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71. 发明授权

US09717143B2 Method for fabricating flexible substrate and flexible substrate prefabricated component 有权
公开(公告)号：US09717143B2
公开(公告)日：2017-07-25
申请号：US14353389
申请日：2013-12-12
申请人： BOE TECHNOLOGY GROUP CO., LTD.
发明人： Meili Wang , Hongda Sun , Fengjuan Liu
IPC分类号： H05K3/02 , H05K3/46 , H05K1/02 , H01L23/00 , H01L21/48 , H05K1/03
CPC分类号： H05K1/028 , H01L21/4846 , H01L21/6835 , H01L23/00 , H01L25/105 , H01L51/003 , H01L51/5228 , H01L2221/68318 , H01L2221/6835 , H01L2221/68381 , H01L2251/5338 , H01L2924/0002 , H05K1/0393 , H05K3/022 , H05K3/4644 , H05K2201/0195 , H05K2203/0235 , H05K2203/068 , H01L2924/00
摘要： A method for fabricating a flexible substrate and a flexible substrate prefabricated component are disclosed, the flexible substrate comprises an electronic device and a flexible layer provided with the electronic device. The fabrication method comprises: disposing a single-sided adhesive layer at a central portion of a surface of a support substrate, an adhesive side of the single-sided adhesive layer being in contact with the support substrate; disposing a double-sided adhesive layer at a peripheral region of the support substrate; disposing the flexible layer on surfaces of the single-sided adhesive layer and the double-sided adhesive layer, the flexible layer being bonded to the double-sided adhesive layer; disposing the electronic device in a region of a surface of the flexible layer corresponding to the single-sided adhesive layer; cutting the flexible layer along a boundary of the electronic device and removing the flexible layer from the single-sided adhesive layer.

72. 发明申请

US20170135220A1 Printable Films for Printed Circuit Boards and Processes for Making Same 审中-公开
公开(公告)号：US20170135220A1
公开(公告)日：2017-05-11
申请号：US15330844
申请日：2016-11-07
申请人： THE GOVERNING COUNCIL OF THE UNIVERSITY OF TORONTO
发明人： Perumal Varun Chadalavada , Daniel Wigdor
IPC分类号： H05K3/02 , H05K1/09
CPC分类号： H05K3/027 , H05K1/0386 , H05K1/092 , H05K3/04 , H05K3/048 , H05K3/06 , H05K2201/0108 , H05K2201/032 , H05K2201/0335 , H05K2201/0355 , H05K2203/013 , H05K2203/0264 , H05K2203/0525 , H05K2203/0551 , H05K2203/068
摘要： Film for use in preparing a printed circuit board (PCB) along with methods for making a PCB and producing a printable film are described herein. The film includes a first layer formed of a radiation-transparent material, a second layer formed of a curable adhesive material, a third layer formed of an electrically conductive material, and optionally, a fourth layer formed of an adhesive and a fifth layer formed of a removable material. Through the adhesive layers, the layers are bonded together to produce the printable film. To produce a PCB, the first layer is covered in ink distributed in a pattern representing the PCB, and the ink-covered film is exposed to radiation until the non-ink-covered portions of the second layer have cured. Then, the fifth layer is removed tearing away the electrically conductive material associated with the non-ink-covered portions of the second layer producing the PCB.

73. 发明申请

US20160324012A1 RIGID-FLEXIBLE CIRCUIT BOARD HAVING FLYING-TAIL STRUCTURE AND METHOD FOR MANUFACTURING SAME 有权
标题翻译：具有飞尾结构的刚性柔性电路板及其制造方法
公开(公告)号：US20160324012A1
公开(公告)日：2016-11-03
申请号：US15102803
申请日：2014-12-11
申请人： GUANGZHOU FASTPRINT CIRCUT TECH CO., LTD. , SHENZHEN FASTPRINT CIRCUT TECH CO., LTD. , YIXING SILICON VALLEY ELECTRONICS TECHNOLOGY CO., LTD.
发明人： Xingya QIU , Chutao LIN , Bei CHEN
IPC分类号： H05K3/46 , H05K1/09 , H05K1/11 , H05K3/00 , H05K1/02 , H05K3/42
CPC分类号： H05K3/4691 , H05K1/028 , H05K1/0298 , H05K1/09 , H05K1/115 , H05K3/0047 , H05K3/423 , H05K3/429 , H05K3/4611 , H05K2203/061 , H05K2203/068 , H05K2203/308
摘要： Provided is a method for manufacturing a rigid-flexible circuit board having a flying-tail structure, comprising the following steps: step 1: manufacturing core substrates needed by daughter boards (500), the cord boards needed by each daughter board comprising at least one flexible core substrate (510) and at least one rigid core substrate (520), stacking and laminating the core substrates to manufacture daughter boards, the number of the manufactured daughter boards being equal to the number of second rigid areas (300), and each daughter board comprising a partial first rigid area (110), a flexible area (200), and a second rigid area (300); step 2, stacking the daughter boards obtained in step 1, and pasting polyetherimide covering films (400) on solder-resist areas of adjacent end surfaces of the second rigid areas; and step 3, providing PTFE gaskets (600) between adjacent flexible areas and adjacent second rigid areas, laminating the daughter boards that have been processed in step 2, and laminating the partial first rigid areas of the daughter plates together to form a first rigid area (100). Also provided is a rigid-flexible circuit board having a flying-tail structure. The method for manufacturing a rigid-flexible circuit board having a flying-tail structure can effectively prevent the solder-resist layer from being damaged.
摘要翻译：本发明提供一种具有飞尾结构的刚挠柔电路板的制造方法，其特征在于，包括以下步骤：步骤1：制造子板（500）所需的芯基板，每个子板所需的电路板包括至少一个柔性芯基板（510）和至少一个刚性芯基板（520），堆叠和层叠芯基板以制造子板，所制造的子板的数量等于第二刚性区域（300）的数量，并且每个子板包括部分第一刚性区域（110），柔性区域（200）和第二刚性区域（300）; 步骤2，堆叠步骤1中获得的子板，并将聚醚酰亚胺覆盖膜（400）粘贴在第二刚性区域的相邻端表面的阻焊区域上; 和步骤3，在相邻的柔性区域和相邻的第二刚性区域之间提供PTFE衬垫（600），层压已经在步骤2中处理的子板，并将子板的部分第一刚性区域层叠在一起以形成第一刚性区域（100）。还提供了具有飞尾结构的刚性柔性电路板。制造具有飞尾结构的刚性 - 柔性电路板的方法可以有效地防止阻焊层受损。

74. 发明申请

US20160262256A1 METHOD FOR FABRICATING FLEXIBLE SUBSTRATE AND FLEXIBLE SUBSTRATE PREFABRICATED COMPONENT 有权
标题翻译：柔性基板和柔性基板预制构件的制作方法
公开(公告)号：US20160262256A1
公开(公告)日：2016-09-08
申请号：US14353389
申请日：2013-12-12
申请人： BOE TECHNOLOGY GROUP CO., LTD.
发明人： Meili WANG , Hongda SUN , Fengjuan LIU
IPC分类号： H05K1/02 , H05K3/46
CPC分类号： H05K1/028 , H01L21/4846 , H01L21/6835 , H01L23/00 , H01L25/105 , H01L51/003 , H01L51/5228 , H01L2221/68318 , H01L2221/6835 , H01L2221/68381 , H01L2251/5338 , H01L2924/0002 , H05K1/0393 , H05K3/022 , H05K3/4644 , H05K2201/0195 , H05K2203/0235 , H05K2203/068 , H01L2924/00
摘要： A method for fabricating a flexible substrate and a flexible substrate prefabricated component are disclosed, the flexible substrate comprises an electronic device and a flexible layer provided with the electronic device. The fabrication method comprises: disposing a single-sided adhesive layer at a central portion of a surface of a support substrate, an adhesive side of the single-sided adhesive layer being in contact with the support substrate; disposing a double-sided adhesive layer at a peripheral region of the support substrate; disposing the flexible layer on surfaces of the single-sided adhesive layer and the double-sided adhesive layer, the flexible layer being bonded to the double-sided adhesive layer; disposing the electronic device in a region of a surface of the flexible layer corresponding to the single-sided adhesive layer; cutting the flexible layer along a boundary of the electronic device and removing the flexible layer from the single-sided adhesive layer.
摘要翻译：公开了一种用于制造柔性基板和柔性基板预制部件的方法，柔性基板包括电子装置和设置有电子装置的柔性层。制造方法包括：在支撑基板的表面的中心部分处设置单面粘合剂层，单面粘合剂层的粘合剂侧与支撑基板接触; 在支撑基板的周边区域设置双面粘合剂层; 将柔性层设置在单面粘合剂层和双面粘合剂层的表面上，柔性层粘合到双面粘合剂层上; 将所述电子器件设置在与所述单面粘合剂层相对应的所述柔性层的表面的区域中; 沿着电子设备的边界切割柔性层并从柔性层从单面粘合剂层移除。

75. 发明授权

US09363890B2 Circuit board and method of manufacturing same 有权
标题翻译：电路板及其制造方法
公开(公告)号：US09363890B2
公开(公告)日：2016-06-07
申请号：US13997883
申请日：2011-12-16
申请人： Kazuyuki Ohmori , Tatsuya Sunamoto
发明人： Kazuyuki Ohmori , Tatsuya Sunamoto
IPC分类号： H05K3/00 , H05K1/03 , B29C37/00 , B29C43/18 , H05K3/28 , B29C43/20 , H05K1/02
CPC分类号： H05K1/0245 , B29C37/0075 , B29C43/18 , B29C43/203 , H05K1/0237 , H05K1/0242 , H05K1/0296 , H05K1/0306 , H05K1/09 , H05K3/281 , H05K2201/0129 , H05K2201/0141 , H05K2203/068 , Y10T156/10
摘要： Provided is a method of manufacturing a circuit board including preparing a board structural body (11) and covering a conductor circuit element (13) on an outermost layer of the board structural body (11) with a cover film (14), wherein a heat treatment is performed while having a release material (15) interposed between the cover film (14) and a heat-processing device. The release material (15) is a laminate at least including, sequentially from the cover film toward the heat-processing device, a low friction film (16) selected from an ultrahigh-molecular-weight polyethylene film and a polytetrafluoroethylene film, a first aluminum foil (17), a first high-density polyethylene film (18a), a second high-density polyethylene film (18b), and a second aluminum foil (19). The first high-density polyethylene film (18a) and the second high-density polyethylene film (18b) are positioned such that respective MD directions are perpendicular to each other.
摘要翻译：提供一种制造电路板的方法，包括制备板结构体（11）并用覆盖膜（14）覆盖在板结构体（11）的最外层上的导体电路元件（13），其中热在将隔离材料（15）插入在覆盖膜（14）和热处理装置之间的同时进行处理。剥离材料（15）是从覆盖膜向加热装置依次形成选自超高分子量聚乙烯膜和聚四氟乙烯膜的低摩擦膜（16）的层叠体，第一铝箔（17），第一高密度聚乙烯膜（18a），第二高密度聚乙烯膜（18b）和第二铝箔（19）。第一高密度聚乙烯膜（18a）和第二高密度聚乙烯膜（18b）被定位成使得各个MD方向彼此垂直。

76. 发明授权

US09288914B2 Method of manufacturing a printed circuit board with circuit visible 有权
标题翻译：具有电路可见的印刷电路板的制造方法
公开(公告)号：US09288914B2
公开(公告)日：2016-03-15
申请号：US14082196
申请日：2013-11-18
申请人： FuKui Precision Component (Shenzhen) Co., Ltd. , Zhen Ding Technology Co., Ltd.
发明人： Ming-Jaan Ho , Xian-Qin Hu
IPC分类号： H05K3/44 , H05K3/28 , H05K3/20 , H05K1/11
CPC分类号： H05K3/281 , H05K1/11 , H05K3/202 , H05K2201/0145 , H05K2203/063 , H05K2203/068 , Y10T29/302
摘要： A printed circuit board with circuit visible includes a wiring layer, a first adhesive layer, a first dielectric layer, and a cover film, which are stacked in described order, the wiring layer comprising at least one electrical contact pad. The cover film has at least one opening corresponding to the electrical contact pad. The cover film includes a second dielectric layer and a second adhesive layer. A flow initiation temperature of the first adhesive layer is in a range from 85 degrees centigrade to 90 degrees centigrade, and a hardening temperature of the first adhesive being lower than 150 degrees centigrade.
摘要翻译：具有电路可见的印刷电路板包括按照上述顺序堆叠的布线层，第一粘合剂层，第一介电层和覆盖膜，所述布线层包括至少一个电接触焊盘。覆盖膜具有至少一个对应于电接触垫的开口。覆盖膜包括第二介电层和第二粘合剂层。第一粘合剂层的流动起始温度在85摄氏度到90摄氏度的范围内，第一粘合剂的硬化温度低于150摄氏度。

77. 发明申请

US20150108084A1 METHOD OF MAKING A FLEXIBLE CIRCUIT 有权
标题翻译：制造柔性电路的方法
公开(公告)号：US20150108084A1
公开(公告)日：2015-04-23
申请号：US14375824
申请日：2013-01-24
申请人： Trackwise Designs Limited
发明人： Philip Johnston
IPC分类号： H05K3/46 , H05K3/06
CPC分类号： H05K3/4611 , B32B37/1027 , B32B2457/08 , H05K1/0298 , H05K1/115 , H05K3/06 , H05K3/064 , H05K3/4617 , H05K3/462 , H05K3/4635 , H05K3/4638 , H05K3/4644 , H05K2201/09063 , H05K2203/068 , H05K2203/1545 , H05K2203/167
摘要： A method of manufacturing a multilayer flexible circuit comprises providing first and second flexible substrates, each comprising a conductor layer and an insulator layer. The conductor layer of the first substrate is a patterned conductor layer. The first and second substrates are laminated together using a double belt press through which the substrates move in a continuous process. The method may include patterning the conductor layer of the first substrate and/or the conductor layer of the second substrate using an etching method that includes exposing a dry film resist on the conductor layer to a pattern by carrying out a plurality of exposures of adjacent and/or overlapping areas.
摘要翻译：一种制造多层柔性电路的方法包括提供第一和第二柔性基板，每个柔性基板包括导体层和绝缘体层。第一基板的导体层是图案化的导体层。第一和第二基板使用双带压机层压在一起，基板通过该双层压机连续地移动。该方法可以包括使用蚀刻方法图案化第一衬底的导体层和/或第二衬底的导体层，该蚀刻方法包括通过执行多个相邻和相邻的曝光来将导体层上的干膜抗蚀剂暴露于图案 /或重叠区域。

78. 发明申请

US20120118939A1 PROCESS AND APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE 审中-公开
标题翻译：制造半导体器件的工艺和装置
公开(公告)号：US20120118939A1
公开(公告)日：2012-05-17
申请号：US13295581
申请日：2011-11-14
申请人： Keiyo KUSANAGI , Koichi HATAKEYAMA , Mitsuhisa WATANABE , Yusuke NAKANOYA , Hidenori MATSUSHITA , Toru MEURA , Kenzou MAEJIMA , Hiroki NIKAIDO , Mina NIKAIDO
发明人： Keiyo KUSANAGI , Koichi HATAKEYAMA , Mitsuhisa WATANABE , Yusuke NAKANOYA , Hidenori MATSUSHITA , Toru MEURA , Kenzou MAEJIMA , Hiroki NIKAIDO , Mina NIKAIDO
IPC分类号： B23K1/008 , B23K31/02
CPC分类号： B23K1/0016 , H01L24/13 , H01L24/29 , H01L24/73 , H01L24/75 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/97 , H01L2224/131 , H01L2224/13109 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/13118 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/16225 , H01L2224/16227 , H01L2224/2919 , H01L2224/73204 , H01L2224/75251 , H01L2224/75252 , H01L2224/81193 , H01L2224/81203 , H01L2224/81209 , H01L2224/81815 , H01L2224/83192 , H01L2224/83203 , H01L2224/83862 , H01L2224/92125 , H01L2224/97 , H01L2924/00013 , H01L2924/01029 , H01L2924/15787 , H01L2924/181 , H05K3/3436 , H05K3/3489 , H05K2201/10674 , H05K2201/10977 , H05K2203/068 , H05K2203/1189 , Y02P70/613 , H01L2924/00014 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/014 , H01L2924/00
摘要： The process for manufacturing the semiconductor device and the apparatus, which achieve stable production of semiconductor devices with improved connection reliability, is presented. First terminals of circuit boards 1 are arranged to face the corresponding bumps of semiconductor chips 2, respectively, and the resin layer 3 is disposed between the respective first terminals and the respective bumps to form laminates, and the laminates are simultaneously compressed from a direction of lamination, while heating a plurality of laminates. In such case, the diaphragm 54 disposed in a heating furnace 51 is abutted against a plurality of laminates or a member 531 to elastically deform the members while a plurality of laminates is heated in the heating furnace 51, so that laminates are simultaneously compressed from a direction of lamination, while heating thereof in a vacuum.
摘要翻译：本发明提供了制造半导体器件的方法以及实现稳定生产具有改进的连接可靠性的半导体器件的装置。电路板1的第一端子被分别布置成与半导体芯片2的相应凸块相对，并且树脂层3设置在相应的第一端子和相应的凸块之间以形成层压体，并且层叠体同时从同时加热多个层压板。在这种情况下，设置在加热炉51中的隔膜54抵靠多个层压体或构件531，以在加热炉51中加热多个层压体的同时使构件弹性变形，使得层压体同时从层叠方向，同时在真空中加热。

79. 发明申请

US20120018084A1 Printed Circuit Board Assembly Manufacturing Device And Method 审中-公开
标题翻译：印刷电路板组装制造装置及方法
公开(公告)号：US20120018084A1
公开(公告)日：2012-01-26
申请号：US13177064
申请日：2011-07-06
申请人： Kyung Woon Jang , Seungbae Park , Young Jun Moon , Soon Min Hong , Chang-kyu Chung , Dae Jung Kim , Sang il Hong
发明人： Kyung Woon Jang , Seungbae Park , Young Jun Moon , Soon Min Hong , Chang-kyu Chung , Dae Jung Kim , Sang il Hong
IPC分类号： H05K7/00
CPC分类号： H05K3/305 , H01L24/16 , H01L24/32 , H01L24/75 , H01L24/81 , H01L24/83 , H01L2224/73204 , H01L2224/75251 , H01L2224/75252 , H01L2224/75314 , H01L2224/75315 , H01L2224/7598 , H01L2224/83101 , H01L2224/83203 , H01L2224/83209 , H01L2224/83851 , H01L2224/83862 , H05K3/323 , H05K2203/0278 , H05K2203/068 , Y02P70/613 , H01L2924/00012
摘要： Disclosed herein is a printed circuit board assembly manufacturing device and method of manufacturing a printed circuit board assembly. The printed circuit board assembly manufacturing device may include a fusing unit configured to cure a conductive adhesive used to fix electronic components having different heights to a printed circuit board. The fusing unit may be configured to cure the conductive adhesive while simultaneously applying pressure to the electronic components having different heights.
摘要翻译：这里公开了印刷电路板组件制造装置和制造印刷电路板组件的方法。印刷电路板组装制造装置可以包括定影单元，其被配置为固化用于将具有不同高度的电子部件固定到印刷电路板的导电粘合剂。定影单元可以被配置为固化导电粘合剂，同时向具有不同高度的电子部件施加压力。

80. 发明申请

US20110262722A1 Method of Producing Laminated Body, and Laminated Body 审中-公开
标题翻译：生产层压体和层压体的方法
公开(公告)号：US20110262722A1
公开(公告)日：2011-10-27
申请号：US12997341
申请日：2010-04-05
申请人： Masayuki Takamori
发明人： Masayuki Takamori
IPC分类号： B32B7/14 , B32B15/08 , B32B37/16 , B32B38/10 , B32B37/02 , B32B37/12
CPC分类号： H05K3/4611 , B32B15/00 , B32B37/0007 , B32B37/003 , B32B37/0076 , B32B37/12 , B32B37/1284 , B32B37/1292 , B32B37/20 , B32B38/0004 , B32B38/0012 , B32B2307/54 , B32B2309/105 , B32B2311/12 , B32B2457/08 , B65H2301/4223 , B65H2601/211 , H05K3/00 , H05K3/025 , H05K2203/0143 , H05K2203/0228 , H05K2203/068 , H05K2203/1178 , Y10T156/1052 , Y10T428/24826 , Y10T428/24917
摘要： Provided is a method of producing a laminated body, wherein, while winding off a carrier A from a bobbin, an adhesive is applied to both facing ends thereof, a metal foil B is laid on and bonded to a side to which the adhesive was applied while being wound off from a bobbin, the obtained laminated body is subsequently cut, the cut laminated bodies are aligned, a roller is applied from the top of an object to be cut configured from the aligned laminated bodies when the elevation of the center of the object to be cut becomes high to vent air existing between the objects to be cut and in the laminated bodies, and the adhesive is eventually hardened to mutually bond the laminated bodies. In particular, this invention provides a carrier-attached copper foil to be used upon producing a laminated plate, and aims to realize the improvement in the handling ability in the production process of a printed board and cost reduction based on an improved production yield.
摘要翻译：本发明提供一种层叠体的制造方法，其中，在将线轴A从托架A上取下的同时，向其两端施加粘合剂，金属箔B被放置在粘合剂一侧在从线轴上卷绕的同时，随后切割得到的层叠体，切割的层叠体对准，当从对准的层叠体构成的被切割物体的顶部施加辊时，待切割的物体变高以排出存在于待切割物体和层叠体之间的空气，并且粘合剂最终被硬化以相互粘合层压体。特别是，本发明提供了一种在制造层叠板时使用的载体附着铜箔，其目的在于提高印刷电路板的制造工序的处理能力和降低生产成本。

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