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71. 发明申请

US20050017344A1 Interconnecting component 失效
标题翻译：互连组件
公开(公告)号：US20050017344A1
公开(公告)日：2005-01-27
申请号：US10828160
申请日：2004-04-21
申请人： Hisanobu Utsunomiya
发明人： Hisanobu Utsunomiya
IPC分类号： H05K1/18 , H01L21/60 , H01L23/48 , H01L23/485 , H01L25/00 , H05K1/02 , H05K1/14 , H01L23/053
CPC分类号： H01L24/10 , H01L23/48 , H01L24/13 , H01L24/81 , H01L2224/13 , H01L2224/13099 , H01L2224/16 , H01L2224/81801 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01033 , H01L2924/01056 , H01L2924/01078 , H01L2924/014 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H05K1/023 , H05K1/0231 , H05K1/0233 , H05K1/145 , H05K2201/1053 , H05K2201/10583 , H01L2924/00
摘要： The wide usable interconnecting component of the present invention is capable of reducing number of components or electric elements and reducing number of interconnecting sections without limiting circuit design. The interconnecting component electrically interconnects electric components, and the interconnecting component acts as an electric element. Namely, the interconnecting component acts as a passive element or an active element.
摘要翻译：本发明的广泛可用的互连部件能够减少部件或电气元件的数量并减少互连部件的数量而不限制电路设计。互连部件电连接电气部件，并且互连部件用作电气元件。即，互连部件用作无源元件或有源元件。

72. 发明申请

US20040235317A1 Housing system for an electric device 审中-公开
标题翻译：电气设备外壳系统
公开(公告)号：US20040235317A1
公开(公告)日：2004-11-25
申请号：US10488270
申请日：2004-03-01
发明人： Peter Schiefer
IPC分类号： H01R012/00
CPC分类号： H05K9/0026 , H05K1/181 , H05K3/301 , H05K5/0056 , H05K5/0069 , H05K9/0037 , H05K9/0049 , H05K2201/0999 , H05K2201/10189 , H05K2201/10371 , H05K2201/10583 , H05K2203/1572 , Y02P70/611
摘要： The invention relates to a housing device for an electrical device (1), with at least two housing parts (2, 3) and an electronic circuit on a printed circuit board (4), which can be disposed in the device (1) and has a conductive layer that is connected to the housing mass of at least one metallic housing part (2). A housing part (3) is a plastic part into which is integrated at least the connecting device (9) for supplying power to the device and/or for transmitting signals to the electronic circuit. The printed circuit board (4) is equipped on both sides: components (5) that are sensitive to radiated interference are disposed on the side that is largely enclosed by the metallic housing part (2) and the conductive layer, and other components (6) and contacts of a connecting device (9) are disposed on the other side of the printed circuit board (4).
摘要翻译：本发明涉及一种用于电气设备（1）的壳体装置，其中至少两个壳体部分（2,3）和印刷电路板（4）上的电子电路，其可以设置在装置（1）和具有连接到至少一个金属壳体部分（2）的壳体的导电层。壳体部分（3）是塑料部分，其中至少集成有连接装置（9），用于向装置提供电力和/或向电子电路发送信号。印刷电路板（4）装在两面：对辐射干扰敏感的部件（5）设置在主要由金属外壳部分（2）和导电层封闭的一侧以及其它部件（6））和连接装置（9）的触点设置在印刷电路板（4）的另一侧。

73. 发明授权

US5786745A Electronic package and method 失效
标题翻译：电子封装及方法
公开(公告)号：US5786745A
公开(公告)日：1998-07-28
申请号：US597307
申请日：1996-02-06
申请人： Alexander J. Elliott , Lonne L. Mays
发明人： Alexander J. Elliott , Lonne L. Mays
IPC分类号： H01C1/084 , H05K3/30 , H01C1/08
CPC分类号： H01C1/084 , H05K3/303 , H05K2201/10568 , H05K2201/10583 , H05K2201/10651 , Y02P70/613
摘要： A package (10) has outermost surfaces (12, 13, 14, 16) that form a polygon shape. The body (11) of the package (10) has axial symmetry about an axis (21). A lead (22) exits the package along the axis (21).
摘要翻译：包装（10）具有形成多边形形状的最外表面（12,13,14,16）。包装体（10）的主体（11）具有围绕轴线（21）的轴向对称性。引线（22）沿轴线（21）离开封装。

74. 发明授权

US5679976A Molded electric parts and method of manufacturing the same 失效
标题翻译：成型电气部件及其制造方法
公开(公告)号：US5679976A
公开(公告)日：1997-10-21
申请号：US367191
申请日：1995-01-13
申请人： Yoshiaki Nishikawa , Yasuyuki Takeda , Masanaga Kikuzawa
发明人： Yoshiaki Nishikawa , Yasuyuki Takeda , Masanaga Kikuzawa
IPC分类号： B29C45/26 , B29C45/14 , B29K105/20 , B29L31/34 , H01G2/06 , H01G4/224 , H01G13/00 , H01L23/28 , H05K1/00 , H05K1/14 , H05K1/18 , H05K3/30 , H05K3/34 , H05K3/36 , H01L23/48 , H01L23/34
CPC分类号： H01G4/224 , H01G2/065 , H05K1/141 , H05K3/301 , H01L2224/48091 , H01L2224/48247 , H01L2224/4918 , H01L2924/13033 , H01L2924/30107 , H05K1/0284 , H05K1/182 , H05K1/183 , H05K2201/049 , H05K2201/10022 , H05K2201/10166 , H05K2201/10583 , H05K2201/10636 , H05K3/3442 , H05K3/368 , Y02P70/611
摘要： The present invention provides a molded electric part which does not include any lead wires and is preferably compact in size and light in weight. The molded electric part of the invention can effectively prevent deterioration of an electric element by molding the element with a resin. The invention is also directed to a method of simultaneously manufacturing a number of products having fixed dimensions and excellent electrical properties through injection molding with a multi-forming mold complex. A molded film capacitor (1) of the invention includes a film capacitor element (2) and an element-receiving body (3) mainly composed of a synthetic resin with high dielectric ability. The film capacitor element (2) is accommodated in an element-receiving recess (7) formed in a substantial center of the element-receiving body (3). A couple of electrodes (2a,2a) formed on both side faces of the film capacitor element (2) are electrically connected with solder (5,5) to a film conductive pattern (4) formed by metal-plating a surface of the element-receiving body (3). Part of the conductive pattern (4) arranged on a bottom face of the element-receiving body (3) forms an outside connection terminal film (8). The film capacitor element (2) is further molded with a sealing resin (6) in an airtight manner for protecting the element-receiving recess (7) from outside humidity.
摘要翻译： PCT No.PCT / JP94 / 00960 Sec。 371日期1995年1月13日 102（e）日期1995年1月13日PCT提交1994年6月14日PCT公布。第WO94 / 29887号公报日期1994年12月22日本发明提供一种不包含任何引线的成型电气部件，其重量轻，重量轻。本发明的模制电气部件可以通过用树脂模制元件来有效地防止电气元件的劣化。本发明还涉及通过具有多成形模具复合体的注射成型同时制造具有固定尺寸和优异电性能的多种产品的方法。本发明的成型薄膜电容器（1）包括膜电容器元件（2）和主要由具有高介电能力的合成树脂构成的元件容纳体（3）。薄膜电容器元件（2）容纳在形成在元件容纳体（3）的大致中心的元件容纳凹部（7）中。形成在薄膜电容器元件（2）的两个侧面上的几个电极（2a，2a）与焊料（5,5）电连接到薄膜导电图案（4），该导电图案通过金属镀覆元件的表面而形成接收体（3）。布置在元件接收体（3）的底面上的导电图案（4）的一部分形成外部连接端子膜（8）。薄膜电容器元件（2）进一步用密封树脂（6）以气密的方式模制，以保护元件容纳凹部（7）不受外部湿度的影响。

75. 发明授权

US5590029A Circuit board SMT device mounting apparatus 失效
标题翻译：电路板SMT装置安装装置
公开(公告)号：US5590029A
公开(公告)日：1996-12-31
申请号：US371720
申请日：1995-01-12
申请人： H. Scott Estes
发明人： H. Scott Estes
IPC分类号： H05K1/02 , H05K1/14 , H05K1/18 , H05K3/30 , H05K3/34 , H05K3/36 , H05K3/42 , H05K7/02
CPC分类号： H05K1/184 , H05K1/141 , H05K3/301 , H05K1/023 , H05K1/183 , H05K2201/049 , H05K2201/09645 , H05K2201/09981 , H05K2201/10015 , H05K2201/10022 , H05K2201/10075 , H05K2201/10568 , H05K2201/10583 , H05K2201/10636 , H05K3/3442 , H05K3/366 , H05K3/429 , Y02P70/611
摘要： A space-saving circuit board mounting of a Surface Mounted Technology (SMT) device, such as a resistor, capacitor, ferrite or clock oscillator, is achieved using (1) a single through hole extending transversely through the board substrate, and (2) a cylindrical adapter having a first longitudinal portion coaxially received in the through hole and a second longitudinal portion projecting outwardly therefrom. The second longitudinal adapter portion has a radially inwardly extending notch that receives the SMT device and positions it with its electrically conductive opposite end sections spaced apart in a direction parallel to the axis of the through hole. Spaced apart external metal plating sections on the adapter connect the SMT device end portions to circumferentially separated metal plating segments on the surface of the through hole which, in turn, are representatively connected to ground and signal plane structures within the interior of the board substrate.
摘要翻译：使用（1）横向延伸穿过基板的单个通孔实现诸如电阻器，电容器，铁氧体或时钟振荡器的表面贴装技术（SMT）器件的节省空间的电路板安装，以及（2）圆柱形适配器具有同轴地容纳在通孔中的第一纵向部分和从其向外突出的第二纵向部分。第二纵向适配器部分具有径向向内延伸的凹口，其接收SMT装置并且使其具有在平行于通孔的轴线的方向间隔开的导电相对端部分。适配器上的间隔开的外部金属镀层部分将SMT器件端部连接到通孔表面上的周向分离的金属电镀部分，其又代表性地连接到板基板内部的接地和信号平面结构。

76. 发明授权

US5564182A Method for installing axial multiple 失效
标题翻译：安装轴向倍数的方法
公开(公告)号：US5564182A
公开(公告)日：1996-10-15
申请号：US438026
申请日：1995-05-08
申请人： Shary Nassimi
发明人： Shary Nassimi
IPC分类号： H01C1/02 , H01L23/04 , H05K3/34
CPC分类号： H01C1/02 , H01L23/041 , H05K3/341 , H05K3/3415 , H01L2924/0002 , H01L2924/3011 , H05K2201/10166 , H05K2201/10583 , H05K2201/10651 , H05K2201/10659 , H05K2203/0455 , H05K3/3447 , H05K3/3468 , Y02P70/613 , Y10T29/49142 , Y10T29/49144
摘要： A method for installing an axial multiple connection component, for connecting to a circuit board, comprising a shell, the shell substantially cylindrical, having two opposite ends. Conducting leads extend from the opposite ends along the axis, for providing two isolated connections to other components on the circuit board. At least one contact ring encircles the shell with the axis at the center of the contact ring, and provides another connection to the other components on the circuit board. The conducting leads are inserted into lead holes on the circuit board, and the contact ring rests against a metallically plated through ring hole. The component is either manually solder utilizing a solder melting tool or alternatively wave soldered onto the circuit board, with the solder wicking up the plated through ring hole to the contact ring to make a good electrical contact therebetween.
摘要翻译：一种用于安装用于连接到电路板的轴向多重连接部件的方法，包括壳体，壳体基本上为圆柱形，具有两个相对的端部。导线从轴的相对端延伸，用于提供与电路板上其他部件的两个隔离连接。至少一个接触环围绕壳体，轴线处于接触环的中心，并提供与电路板上其他部件的另一连接。导电引线插入电路板上的导线孔中，接触环支撑在金属电镀通孔环上。组件是使用焊料熔化工具手工焊接或者焊接到电路板上的焊料，焊料将电镀通孔环穿过接触环，以在它们之间形成良好的电接触。

77. 发明授权

US5406458A Printed circuit board having tapered contact pads for surface mounted electrical components 失效
标题翻译：具有用于表面安装的电气部件的锥形接触垫的印刷电路板
公开(公告)号：US5406458A
公开(公告)日：1995-04-11
申请号：US164977
申请日：1993-12-10
申请人： Joachim Schutt
发明人： Joachim Schutt
IPC分类号： H05K1/11 , H05K3/34 , H05K7/10
CPC分类号： H05K1/111 , H05K3/3442 , H05K2201/09381 , H05K2201/10583 , H05K2201/10636 , H05K2203/0545 , Y02P70/611 , Y02P70/613
摘要： A printed circuit board (23) having a plurality of solder coated contact pads (24, 26) for the surface mounting of electrical components (10.sup.1) thereon. Each pad (24, 26) has a rectangular portion and a triangular portion extending in the direction of the component's body (18) so as to reduce the amount of solder (28) located under the body (18) while not disadvantageously affecting the tolerance with which connector caps (20, 22) of the components (10.sup.1) can be mounted on, and bonded to, the pads (24, 26). This arrangement inhibits the formation of solder droplets on the printed circuit board (23) during the bonding process. At least one of the components fixed to the connector pads has an elongated electrically insulating body portion provided at its ends with connector portions which are respectively bonded to the connector pads. The dimension of the rectangular portion of each pad which is at right angles to the longitudinal axis of the associated component is less than the transverse dimension of the associated connector portion of the associated component. The connector portions of the electrical component extend over and are soldered to parts of both the rectangular and the triangular portions of each of the pads.
摘要翻译：一种印刷电路板（23），其具有用于在其上表面安装电气部件（101）的多个焊料涂覆的接触焊盘（24,26）。每个垫（24,26）具有矩形部分和在部件本体（18）的方向上延伸的三角形部分，以便减少位于主体（18）下方的焊料（28）的量，同时不影响公差组件（101）的连接器帽（20,22）可以安装在衬垫（24,26）上并结合到衬垫（24,26）上。这种布置抑制了在接合过程中印刷电路板（23）上的焊料液滴的形成。固定到连接器焊盘的部件中的至少一个具有细长的电绝缘主体部分，其在其端部设置有连接器部分，连接器部分分别连接到连接器焊盘。每个垫的与相关联的部件的纵向轴线成直角的矩形部分的尺寸小于相关部件的相关联的连接器部分的横向尺寸。电气部件的连接器部分延伸并焊接到每个焊盘的矩形和三角形部分的部分。

78. 发明授权

US4873764A Component mounting process for printed circuit boards 失效
标题翻译：印刷电路板组件安装工艺
公开(公告)号：US4873764A
公开(公告)日：1989-10-17
申请号：US260852
申请日：1988-10-21
申请人： Frank W. Grimm
发明人： Frank W. Grimm
IPC分类号： H05K1/03 , H05K1/14 , H05K1/18 , H05K3/40
CPC分类号： H05K1/184 , H05K1/036 , H05K1/145 , H05K2201/0133 , H05K2201/043 , H05K2201/091 , H05K2201/09845 , H05K2201/10583 , H05K2201/10636 , H05K3/4046 , Y02P70/611 , Y10T29/49126 , Y10T29/4913 , Y10T29/53174
摘要： A process is disclosed for use in the manufacture of layered printed circuit board assembly having first and second layers with electrically conductive patterns thereon. The assembly has at least one inner layer between the first and second layers for receiving and retaining a surface-mount device inserted through aligned holes in the layers. The device has an electrically conductive cap at each end for electrical connection to the conductive patterns. The inner layer physically retains the surface-mount device in place pending the electrical connection of the end caps to the conductive patterns, and by virtue of its being inherently compliant and yielding, provides for physically retaining the surface-mount device in place pending the electrical and mechanical connection of the electrically conductive end caps to the conductive patterns.
摘要翻译：公开了一种用于制造具有其上具有导电图案的第一和第二层的分层印刷电路板组件的方法。组件在第一和第二层之间具有至少一个内层，用于接收和保持插入层中对准的孔的表面安装装置。该装置在每个端部具有导电盖，用于与导电图案电连接。内层将表面贴装器件物理地保持在适当位置，等待端盖与导电图案的电连接，并且由于其本身具有柔顺性和屈服性，从而将表面贴装器件物理地保持在适当位置，等待电气以及导电端盖与导电图案的机械连接。

79. 发明授权

US3197164A Electrical component securing means 失效
标题翻译：电气部件固定装置
公开(公告)号：US3197164A
公开(公告)日：1965-07-27
申请号：US38457664
申请日：1964-07-16
申请人： HANSEN CIAUDE A
发明人： HANSEN CIAUDE A
IPC分类号： F16L3/04 , F16L3/123 , F16L3/233 , H05K3/30
CPC分类号： H05K3/301 , F16L3/04 , F16L3/1236 , F16L3/233 , H05K2201/10287 , H05K2201/10583 , H05K2201/10598 , H05K2201/10606 , Y10S411/907 , Y10S411/92 , Y10T24/1498 , Y10T24/3444

80. 发明公开

US20240206074A1 SEMICONDUCTOR STORAGE DEVICE 审中-公开
公开(公告)号：US20240206074A1
公开(公告)日：2024-06-20
申请号：US18459316
申请日：2023-08-31
申请人： Kioxia Corporation
发明人： Koji UENO
IPC分类号： H05K1/18
CPC分类号： H05K1/182 , H05K2201/09072 , H05K2201/09163 , H05K2201/10015 , H05K2201/10159 , H05K2201/10189 , H05K2201/10583 , H05K2201/10651 , H05K2201/10757
摘要： A semiconductor storage device including a board, an electronic component, and a holder. The board has a region with an opening. The electronic component includes a component body disposed in the opening and a lead protruding from the component body and connected to the board. The holder is disposed in the opening and supports the component body. The region includes first and second edges on either side of the opening, the first and second edges extending along a first direction and separated from each other in a second direction crossing the first direction. The holder includes a holder body at least partially formed in an annular shape and into which the component body is inserted, a first groove extending along the first direction and engaged with the first edge, and a second groove extending along the first direction and engaged with the second edge.

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