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    • 78. 发明授权
    • Curable epoxy resin composition
    • 可固化环氧树脂组合物
    • US08399577B2
    • 2013-03-19
    • US13404894
    • 2012-02-24
    • Bandeep SinghStéphane SchaalXavier KornmannPrateek Puri
    • Bandeep SinghStéphane SchaalXavier KornmannPrateek Puri
    • C08K3/36C08L63/02H01B3/40H01F27/32H01L23/29
    • C08G59/4284C08G59/58C08L63/00H01B3/40
    • A curable epoxy resin composition including at least an epoxy resin component and a hardener component, and optionally further additives, wherein: (a) the epoxy resin component is an epoxy resin compound or a mixture of such compounds; (b) the hardener component includes (b1) an aliphatic and cycloaliphatic or aromatic polycarbonic acid anhydride; and (b2) a polyether-amine of the general formula (I), H2N—(CnH2n—O)m—CnH2n—NH2, wherein n is an integer from 2 to 8; and m is from about 3 to about 100; (c) the polycarbonic acid anhydride [component (b1)] is present in the curable epoxy resin composition in a concentration of 0.60 Mol to 0.93 Mol; and (d) the polyether-amine of the general formula (I) [component (b2)] is present in the curable epoxy resin composition in a concentration of about 0.02 Mol to about 0.1 Mol.
    • 至少包含环氧树脂组分和硬化剂组分的可固化环氧树脂组合物,以及任选的其它添加剂,其中:(a)环氧树脂组分是环氧树脂化合物或这些化合物的混合物; (b)硬化剂组分包括(b1)脂族和脂环族或芳族聚碳酸酐; 和(b2)通式(I)的聚醚 - 胺,H2N-(CnH2n-O)m-CnH2n-NH2,其中n是2至8的整数; m为约3至约100; (c)聚碳酸酐[组分(b1)]以0.60Mol至0.93mol的浓度存在于可固化环氧树脂组合物中; 和(d)通式(I)[组分(b2)]的聚醚 - 胺以约0.02Mol至约0.1Mol的浓度存在于可固化环氧树脂组合物中。
    • 79. 发明授权
    • Epoxy and silane group-containing oligomers and polymers and a method for the production and the use thereof
    • 含环氧基和含硅烷基的低聚物和聚合物及其制备方法和用途
    • US08022119B2
    • 2011-09-20
    • US11908986
    • 2006-01-28
    • Andreas PoppeMikolajetz Dunja
    • Andreas PoppeMikolajetz Dunja
    • C08G59/50C08L63/00
    • C08G59/58C09D163/00
    • Oligomers and polymers containing epoxide groups and silane groups and preparable by reacting (A) at least one low molecular mass, oligomeric or polymeric compound containing at least two epoxide groups (a1) with (B) at least one silane containing (b1) at least one at least divalent organic radical which per se is not hydrolyzable, (b2) at least one cyclic dicarboxylic anhydride group and (b3) at least one silane group containing at least one hydrolyzable group (b31), the cyclic dicarboxylic anhydride groups (b2) being attached to the silane groups (b3) via the radicals (b1), the equivalent ratio of epoxide groups (a1) to dicarboxylic anhydride groups (b2) being 0.7 to 100; processes for preparing them, and their use for preparing anhydrous curable compositions.
    • 含有环氧基团和硅烷基团的低聚物和聚合物可通过(A)至少一种含有至少两个环氧基团(a1)和(B)至少一种含至少一种含(b1)的硅烷的低分子量,低​​聚物或聚合物化合物 一个至少二价有机基团本身不可水解,(b2)至少一个环状二羧酸酐基团和(b3)至少一个含有至少一个可水解基团的硅烷基团(b31),环状二羧酸酐基团(b2) 通过基团(b1)与硅烷基(b3)连接,环氧基(a1)与二羧酸酐基(b2)的当量比为0.7〜100; 制备方法及其制备无水可固化组合物的用途。