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    • 1. 发明授权
    • Curable epoxy resin composition
    • 可固化环氧树脂组合物
    • US08399577B2
    • 2013-03-19
    • US13404894
    • 2012-02-24
    • Bandeep SinghStéphane SchaalXavier KornmannPrateek Puri
    • Bandeep SinghStéphane SchaalXavier KornmannPrateek Puri
    • C08K3/36C08L63/02H01B3/40H01F27/32H01L23/29
    • C08G59/4284C08G59/58C08L63/00H01B3/40
    • A curable epoxy resin composition including at least an epoxy resin component and a hardener component, and optionally further additives, wherein: (a) the epoxy resin component is an epoxy resin compound or a mixture of such compounds; (b) the hardener component includes (b1) an aliphatic and cycloaliphatic or aromatic polycarbonic acid anhydride; and (b2) a polyether-amine of the general formula (I), H2N—(CnH2n—O)m—CnH2n—NH2, wherein n is an integer from 2 to 8; and m is from about 3 to about 100; (c) the polycarbonic acid anhydride [component (b1)] is present in the curable epoxy resin composition in a concentration of 0.60 Mol to 0.93 Mol; and (d) the polyether-amine of the general formula (I) [component (b2)] is present in the curable epoxy resin composition in a concentration of about 0.02 Mol to about 0.1 Mol.
    • 至少包含环氧树脂组分和硬化剂组分的可固化环氧树脂组合物,以及任选的其它添加剂,其中:(a)环氧树脂组分是环氧树脂化合物或这些化合物的混合物; (b)硬化剂组分包括(b1)脂族和脂环族或芳族聚碳酸酐; 和(b2)通式(I)的聚醚 - 胺,H2N-(CnH2n-O)m-CnH2n-NH2,其中n是2至8的整数; m为约3至约100; (c)聚碳酸酐[组分(b1)]以0.60Mol至0.93mol的浓度存在于可固化环氧树脂组合物中; 和(d)通式(I)[组分(b2)]的聚醚 - 胺以约0.02Mol至约0.1Mol的浓度存在于可固化环氧树脂组合物中。
    • 9. 发明申请
    • POLYMER CONCRETE ELECTRICAL INSULATION
    • 聚合物混凝土电绝缘
    • US20100227951A1
    • 2010-09-09
    • US12756464
    • 2010-04-08
    • Stephen CLIFFORDFaustine SoyeuxAndrej KrivdaVincent TillietteNikolaus ZantBandeep SinghFelix GreuterLeopold Ritzer
    • Stephen CLIFFORDFaustine SoyeuxAndrej KrivdaVincent TillietteNikolaus ZantBandeep SinghFelix GreuterLeopold Ritzer
    • C08L63/00C08K3/36C08K3/22
    • H01B3/40C08K3/36Y10T428/25Y10T428/252Y10T428/256Y10T428/257Y10T428/259Y10T428/269C08L63/00
    • Polymer concrete electrical insulation including a hardened epoxy resin composition filled with an electrically non-conductive inorganic filler compositions. The polymer concrete electrical insulation system optionally may contain additives. The epoxy resin composition is based on a cycloaliphatic epoxy resin. The inorganic filler composition can be present within the range of about 76% by weight to about 86% by weight, calculated to the total weight of the polymer concrete electrical insulation system. The inorganic filler composition includes a uniform mixture of (i) an inorganic filler with an average grain size within the range of 1 micron (μm) to 100 micron (μm) [component c(i)], and (ii) an inorganic filler with an average grain size within the range of 0.1 mm (100 micron) to 2 mm [component c(ii)]. The inorganic filler with an average grain size within the range of 1 micron (μm) to 100 micron (μm) [component c(i)] can be present in an amount within the range of 22% to 42%, calculated to the total weight of the polymer concrete electrical insulation system; and (e) the inorganic filler with an average grain size within the range of 0.1 mm to 2 mm [component c(ii)] is present within the range of 41% to 61% by weight, calculated to the total weight of the polymer concrete electrical insulation; and method of producing said electrical insulation.
    • 聚合物混凝土电气绝缘包括填充有非导电无机填料组合物的硬化环氧树脂组合物。 聚合物混凝土电绝缘​​系统任选地可以含有添加剂。 环氧树脂组合物基于脂环族环氧树脂。 按照聚合物混凝土电气绝缘系统的总重量,无机填料组合物可以在约76重量%至约86重量%的范围内存在。 无机填料组合物包括(i)平均粒径在1微米(μm)至100微米(μm)[组分c(i)]范围内的无机填料的均匀混合物,和(ii)无机填料 平均粒度在0.1mm(100微米)〜2mm的范围内[成分c(ii)]]。 平均粒径在1微米(μm)至100微米(μm)[组分c(i)]范围内的无机填料可以以22%至42%的范围内的量存在,以总计 聚合物混凝土电气绝缘体系重量; 和(e)平均粒度在0.1mm至2mm范围内的无机填料[组分c(ii)]存在于聚合物总重量的41%至61%的范围内 混凝土电绝缘​​; 以及制造所述电绝缘体的方法。