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71. 发明授权

US07488904B2 Resin molded component fitted with a metal plate and molding method therefor 有权
标题翻译：装有金属板的树脂成型部件及其成型方法
公开(公告)号：US07488904B2
公开(公告)日：2009-02-10
申请号：US11820980
申请日：2007-06-21
申请人： Akihito Maegawa , Shinyu Nagashima
发明人： Akihito Maegawa , Shinyu Nagashima
IPC分类号： H01L23/28
CPC分类号： H05K3/202 , B29C45/14655 , B29C45/1671 , B29C2045/0027 , H05K1/056 , H05K3/326 , H05K2201/0397 , H05K2201/09118 , H05K2201/10151 , H05K2201/10401 , H05K2201/10651
摘要： A sensor unit (1) has a metal plate (10), a resin molded portion (20) and an oil temperature sensor (2). Busbars (4) made of a metal are arranged in the resin molded portion (20). Since the busbars (4) are insert-molded while having the exposed ends (4A) thereof tightly held by a pair of forming dies, a distance between the exposed ends (4A) and the placing surface 10A is held constant. Further, gate marks (5D) of the oil temperature sensor (2) are accommodated in recesses (10B) of the placing surface (10) and engaging grooves (9) and engaging projections (26A) are engaged. Thus, the oil temperature sensor (2) can be held in a proper posture. Additionally, the oil temperature sensor (2) can be held on the placing surface (10A) by riveting the exposed end (4A) and a terminal (8) of the oil temperature sensor (2).
摘要翻译：传感器单元（1）具有金属板（10），树脂模制部分（20）和油温传感器（2）。由树脂成型部（20）配置由金属构成的母线（4）。由于母线（4）在将其暴露端（4A）紧紧地保持在一对成形模具上时被插入成型，所以露出端（4A）和放置面10A之间的距离保持恒定。此外，油温传感器（2）的门标（5D）容纳在放置面（10）的凹部（10B）中，并且接合槽（9）和接合突起（26A）接合。因此，可以将油温传感器（2）保持在适当的姿势。此外，油温传感器（2）可以通过铆接暴露的端部（4A）和油温传感器（2）的端子（8）而保持在放置表面（10A）上。

72. 发明申请

US20080298063A1 LIGHT EMITTING APPARATUS, RESIN MOLDING DEVICE COMPOSING LIGHT EMITTING DEVICE, METHOD FOR PRODUCING THE SAME 有权
标题翻译：发光装置，组合发光装置的树脂模制装置，其生产方法
公开(公告)号：US20080298063A1
公开(公告)日：2008-12-04
申请号：US12129986
申请日：2008-05-30
申请人： Masaki Hayashi
发明人： Masaki Hayashi
IPC分类号： F21V21/00 , H01J9/00 , B29C45/02
CPC分类号： B29C45/14655 , B29C45/1671 , F21K9/00 , H01L25/0753 , H01L25/167 , H01L33/62 , H01L33/64 , H01L2224/48137 , H01L2224/48139 , H01L2224/48247 , H01L2224/48465 , H01L2924/01322 , H01L2924/181 , H01L2924/3025 , H01L2933/0075 , H01L2224/48091 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A light emitting apparatus includes a plurality of light emitting devices. A first lead and a second lead compose a lead pair. The first and second leads are electrically connected to the light emitting devices. A plurality of the light emitting devices is mounted on the base. The lead pairs are arranged generally symmetrically with respect to the base as the center line of the light emitting apparatus. The first and second leads are electrically insulated from each other. A first resin molding member covers at least parts of the base and the lead pairs. Thus, the first resin molding member, the base, and the lead pairs are integrally formed. A recessed portion is formed in the first resin molding member. The recessed portion is filled with a second resin molding member. The first and second resin molding members are formed of a thermosetting resin material.
摘要翻译：发光装置包括多个发光装置。第一个铅和第二个铅组成一个铅对。第一和第二引线电连接到发光器件。多个发光装置安装在基座上。引线对相对于作为发光装置的中心线的基座大致对称地布置。第一和第二引线彼此电绝缘。第一树脂模制构件覆盖基部和引线对的至少一部分。因此，第一树脂成型构件，基座和引线对一体形成。在第一树脂成型构件中形成有凹部。凹部填充有第二树脂模制构件。第一和第二树脂成型构件由热固性树脂材料形成。

73. 发明申请

US20080277825A1 Method and Device for Controllable Encapsulation of Electronic Components 有权
标题翻译：电子元件可控封装的方法和装置
公开(公告)号：US20080277825A1
公开(公告)日：2008-11-13
申请号：US11629345
申请日：2005-06-09
申请人： Johannes Lambertus Gerarus Maria Venrooij
发明人： Johannes Lambertus Gerarus Maria Venrooij
IPC分类号： B29C45/14
CPC分类号： B29C45/02 , B29C45/14655 , B29C45/462 , B29C45/73 , B29C2033/023 , B29C2045/7343
摘要： The invention relates to a method for encapsulating electronic components mounted on a carrier, comprising the processing steps of: A) heating encapsulating material, B) displacing the encapsulating material to a mould cavity, C) filling the mould cavity, and D) curing the encapsulating material in the mould cavity. The temperature regulation of the encapsulating material takes place during separate sections of the path covered by the encapsulating material by creating different temperature zones at least partially separated from each other thermally by means of at least one temperature carrier. The invention also relates to a device for encapsulating electronic components mounted on a carrier.
摘要翻译：本发明涉及一种用于封装安装在载体上的电子部件的方法，包括以下处理步骤：A）加热封装材料，B）将封装材料移位到模腔，C）填充模腔，以及D）固化封装材料在模腔中。封装材料的温度调节是通过由至少一个温度载体通过产生至少部分地彼此热分离的不同温度区而在由封装材料覆盖的路径的分开部分期间进行的。本发明还涉及一种用于封装安装在载体上的电子部件的装置。

74. 发明申请

US20080211074A1 IC CARD AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译： IC卡及其制造方法
公开(公告)号：US20080211074A1
公开(公告)日：2008-09-04
申请号：US12116190
申请日：2008-05-06
申请人： Junichiro OSAKO , Hirotaka Nishizawa , Kenji Osawa , Akira Higuchi
发明人： Junichiro OSAKO , Hirotaka Nishizawa , Kenji Osawa , Akira Higuchi
IPC分类号： H01L23/498
CPC分类号： H05K3/284 , B29C45/14647 , B29C45/14655 , B29C45/1657 , B29C45/1671 , B29C2045/1673 , H01L21/563 , H01L21/565 , H01L23/3121 , H01L23/3135 , H01L23/49855 , H01L24/45 , H01L24/48 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2924/01014 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/12041 , H01L2924/12044 , H01L2924/14 , H01L2924/181 , H05K1/117 , H05K2201/10159 , H05K2203/1316 , H05K2203/1572 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An IC body is loaded to a case 2 made of thermosetting resin material and sealed with a sealing portion made of thermosetting resin material to be integrated, whereby an IC card is manufactured. The IC body comprises: a wiring substrate formed with an external connection terminal at a back surface thereof; a semiconductor chip loaded over a surface of the wiring substrate and electrically connected to the external connection terminal via a interconnect; and the sealing portion made of thermosetting resin material so as to cover the semiconductor chip and a bonding wire. The sealing portion is formed so that the external connection terminal is exposed. The present invention makes it possible to heighten the strength of IC cards and at the same time, to reduce the manufacturing cost and improve the reliability.
摘要翻译：将IC体装载到由热固性树脂材料制成的壳体2上并用由热固性树脂材料制成的密封部分密封以一体化，由此制造IC卡。 IC体包括：在其背面形成有外部连接端子的布线基板; 半导体芯片，其负载在所述布线基板的表面上，并且经由互连电连接到所述外部连接端子; 以及由热固性树脂材料制成的密封部分以覆盖半导体芯片和接合线。密封部形成为使外部连接端子露出。本发明可以提高IC卡的强度，同时降低制造成本，提高可靠性。

75. 发明申请

US20080173892A1 PACKAGE STRUCTURE 审中-公开
标题翻译：包装结构
公开(公告)号：US20080173892A1
公开(公告)日：2008-07-24
申请号：US11683437
申请日：2007-03-08
申请人： Wei-An Chen
发明人： Wei-An Chen
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , B29C45/0025 , B29C45/14655 , B29C45/2708 , B29C2045/0027 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2924/181 , H01L2924/00 , H01L2924/00012
摘要： A package structure including a carrier, a molding element and a chip is provided. A part of the carrier is enclosed by the molding element. The molding element has a top portion and a bottom portion opposite to the top portion, wherein the top portion has a cavity exposing a part of the carrier and the bottom portion has a first protrusion and two second protrusions located at both sides of the first protrusion. The chip is disposed in the cavity and electrically connected to the carrier.
摘要翻译：提供包括载体，成型元件和芯片的封装结构。载体的一部分被模制元件包围。模制元件具有与顶部相对的顶部和底部，其中顶部具有暴露载体的一部分的空腔，底部具有第一突出部和位于第一突起的两侧的两个第二突出部。芯片设置在空腔中并与载体电连接。

76. 发明申请

US20080128724A1 Light Emitting Device and Process for Manufacturing the Same 失效
标题翻译：发光装置及其制造方法
公开(公告)号：US20080128724A1
公开(公告)日：2008-06-05
申请号：US11659667
申请日：2004-08-10
申请人： Hiroyuki Isobe , Gen Murakami , Toshikatsu Hiroe
发明人： Hiroyuki Isobe , Gen Murakami , Toshikatsu Hiroe
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , B29C45/14655 , H01L24/48 , H01L33/60 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16245 , H01L2224/48091 , H01L2224/4826 , H01L2224/48465 , H01L2224/97 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01041 , H01L2924/01047 , H01L2924/0105 , H01L2924/01059 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/181 , Y10S257/918 , H01L2224/81 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012 , H01L2224/0555 , H01L2224/0556
摘要： A light emitting device in which the bottom surface of a cup portion is configured to have an opening, and one electrode of a light emitting element is electrically connected to the cup portion, and the other electrode of the light emitting element is electrically connected to a lead which is set up through an inner space from outside the cup portion by making use of the opening of the cup portion. As a result of this configuration, each electrode and each lead of the light emitting device can be electrically connected to each other without using a bonding wire. This makes it possible to prevent occurrence of a shadow or light unevenness reflecting shape of the bonding wire, thereby allowing an enhancement in light-emission efficiency. Also, in substitution for setting up the lead through the inner space from outside the cup portion, the lead existing outside the cup portion and the other electrode of the light emitting element are electrically connected to each other via the bonding wire set up through the opening of the cup portion. As a result of this configuration, light outputted to outside of the light emitting device is escaped from being partially intercepted by the bonding wire. This makes it possible to prevent the occurrence of a shadow or light unevenness, thereby allowing an enhancement in the light-emission efficiency.
摘要翻译：一种发光装置，其中杯部的底面被构造成具有开口，并且发光元件的一个电极电连接到杯部，并且发光元件的另一个电极电连接到引线，其通过利用杯部的开口而从杯部外部通过内部空间设置。作为这种配置的结果，发光器件的每个电极和每个引线可以彼此电连接，而不使用接合线。这使得可以防止接合线的反射形状的阴影或光不均匀的发生，从而可以提高发光效率。此外，代替从杯部外侧通过内部空间设置引线，存在于杯部外侧的引线和发光元件的另一个电极通过经由开口设置的接合线彼此电连接的杯部分。作为这种结构的结果，输出到发光器件外部的光被接合线部分地截断。这使得可以防止发生阴影或光不均匀，从而可以提高发光效率。

77. 发明授权

US07351611B2 Method of making the mould for encapsulating a leadframe package 有权
标题翻译：制造用于封装引线框架封装的模具的方法
公开(公告)号：US07351611B2
公开(公告)日：2008-04-01
申请号：US10868171
申请日：2004-06-15
申请人： Richard Mow Lum Yee , Chee Heng Wong , Chee Ching Yip , Sasidharan Suresh Dass , Kam Chuan Lau , Kok Siang Goh
发明人： Richard Mow Lum Yee , Chee Heng Wong , Chee Ching Yip , Sasidharan Suresh Dass , Kam Chuan Lau , Kok Siang Goh
IPC分类号： H01L21/56
CPC分类号： H01L21/565 , B29C45/14418 , B29C45/14655 , H01L21/4842 , H01L2924/0002 , H01L2924/00
摘要： A mould for encapsulating an integrated circuit package on a leadframe including a top mould-half and a complementary bottom mould-half enclosing a cavity for encapsulating said package wherein structures are provided on at least one of said mould-halves which, upon the closure of said mould-halves, closes off the spaces between adjacent leads of the leadframe to allow only said leads to extend out of said cavity. The structures may be protrusions from the mould half closing off the spaces. Notches or slots cut to allow the leads' extension are the preferred structures due to ease of machining. The mould design thus enables a leadframe package to be moulded with a peripheral flange as narrow as desired without the need to cut a broad conventional flange formed up to the dam bar because only the leads and tie bars are left to be singulated. A method for making the above mould as well as singulation methods for cutting and punching the leads and tie bars is also disclosed.
摘要翻译：一种用于将集成电路封装封装在引线框架上的模具，该引线框架包括顶部模具半部和互补的底部模具半部，该模具半部包围用于封装所述封装件的空腔，其中结构设置在所述模具半部中的至少一个上，所述模具半部封闭引线框架的相邻引线之间的空间，以仅允许所述引线延伸出所述空腔。结构可以是从模具半部封闭空间的突起。由于加工容易，切槽或切槽允许引线延伸是优选的结构。因此，模具设计使得引线框架封装可以根据需要被模制成具有窄的外围法兰，而不需要切割形成到坝条的宽的常规凸缘，因为只有引线和连接条被分割。还公开了用于制造上述模具的方法以及用于切割和冲压引线和连接杆的切割方法。

78. 发明申请

US20070287208A1 Method of Making Light Emitting Device With Multilayer Silicon-Containing Encapsulant 有权
标题翻译：制造具有多层含硅包封剂的发光装置的方法
公开(公告)号：US20070287208A1
公开(公告)日：2007-12-13
申请号：US11741808
申请日：2007-04-30
申请人： D. Scott Thompson , Larry D. Boardman , Catherine A. Leatherdale
发明人： D. Scott Thompson , Larry D. Boardman , Catherine A. Leatherdale
IPC分类号： H01L33/00
CPC分类号： B29C45/1671 , B29C45/14655 , B29C2035/0833 , B29K2083/00 , C08G77/12 , C08G77/20 , C08G77/70 , C08G77/80 , C08K5/56 , C08L83/00 , C08L83/04 , C08L2312/06 , H01L33/56 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A method of making an LED light emitting device is disclosed. The method includes forming a multilayer encapsulant in contact with an LED by contacting the LED with a first encapsulant that is a silicone gel, silicone gum, silicone fluid, organosiloxane, polysiloxane, polyimide, polyphosphazene, sol-gel composition, or a first photopolymerizable composition, and then contacting the first encapsulant with a second photopolymerizable composition. Each photopolymerizable composition includes a silicon-containing resin and a metal-containing catalyst, the silicon-containing resin comprising silicon-bonded hydrogen and aliphatic unsaturation. Actinic radiation having a wavelength of 700 nm or less is applied to initiate hydrosilylation within the silicon-containing resins.
摘要翻译：公开了一种制造LED发光器件的方法。该方法包括通过使LED与第一密封剂（硅胶，硅酮胶，硅氧烷流体，有机硅氧烷，聚硅氧烷，聚酰亚胺，聚磷腈，溶胶 - 凝胶组合物或第一可光聚合组合物）接触来形成与LED接触的多层密封剂然后使第一密封剂与第二可光聚合组合物接触。每种可光聚合组合物包括含硅树脂和含金属的催化剂，所述含硅树脂包含与硅键合的氢和脂肪族不饱和键。施加波长为700nm以下的光化辐射以引发含硅树脂内的氢化硅烷化。

79. 发明申请

US20070264756A1 Method and apparatus for manufacture and inspection of semiconductor device 审中-公开
标题翻译：半导体器件的制造和检验方法和装置
公开(公告)号：US20070264756A1
公开(公告)日：2007-11-15
申请号：US11878127
申请日：2007-07-20
申请人： Kenichi Shirasaka
发明人： Kenichi Shirasaka
IPC分类号： H01L21/50
CPC分类号： B29C45/14655 , B29C45/14073 , B29C70/72 , H01L21/565 , H01L23/3107 , H01L23/3164 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/451 , H01L2224/4809 , H01L2224/48091 , H01L2224/48095 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/49171 , H01L2924/01029 , H01L2924/01067 , H01L2924/181 , H01L2924/00014 , H01L2924/00012 , H01L2924/00 , H01L2924/00015
摘要： A semiconductor device is manufactured in such a way that a semiconductor chip connected with leads whose internal ends are interconnected with bonding wires are completely sealed and enclosed in a resin corresponding to a package while external ends of leads are exposed from the surface of the package. In manufacture, a chip fixing member is used to fix the semiconductor chip in a prescribed position, while wire fixing members are used to fix the bonding wires in prescribed positions. Both the fixing members are retracted into the split mold so as to avoid formation of unfilled portions or voids in the resin in the cavity. In inspection, an electrical conduction is detected between the bonding wire(s) and an electrode layer formed inside of the cavity, so that a semiconductor device produced in the cavity is automatically removed from the manufacturing line.
摘要翻译：制造半导体器件，使得与内部端部用接合线互连的引线连接的半导体芯片被完全密封并封装在与封装相对应的树脂中，而引线的外部端部从封装的表面露出。在制造时，使用芯片固定部件将半导体芯片固定在规定位置，而线固定部件用于将接合线固定在规定位置。两个固定构件都缩回到分开模具中，以避免在空腔中的树脂中形成未填充的部分或空隙。在检查中，在接合线和形成在空腔内部的电极层之间检测到导电，使得在空腔中制造的半导体器件自动从制造线中移除。

80. 发明授权

US07288441B2 Method for two-stage transfer molding device to encapsulate MMC module 有权
标题翻译：用于封装MMC模块的两级传递成型装置的方法
公开(公告)号：US07288441B2
公开(公告)日：2007-10-30
申请号：US11322819
申请日：2005-12-30
申请人： Todd O. Bolken
发明人： Todd O. Bolken
IPC分类号： H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： B29C45/02 , B29C45/14655 , B29C45/1671 , G06K19/077 , G06K19/07743 , H01L21/565 , H01L23/13 , H01L23/3121 , H01L23/49855 , H01L24/48 , H01L24/49 , H01L2224/05599 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/85399 , H01L2924/00014 , H01L2924/01019 , H01L2924/01039 , H01L2924/01079 , H01L2924/01087 , H01L2924/181 , H01L2924/19041 , H05K1/117 , H05K3/0052 , H05K3/284 , H05K2201/09063 , H05K2201/2018 , H05K2203/1316 , H05K2203/1476 , Y10T29/49121 , Y10T29/49171 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2924/00012
摘要： A method for fabricating a semiconductor card includes a printed circuit substrate upon which is mounted a card circuit including one or more semiconductor components such as dice or packages. External contacts link the card circuit to the circuit of another apparatus by removable insertion therein. The substrate is defined by a peripheral opening in a surrounding frame, which may be part of a multiframe strip. The substrate is connected to the frame by connecting segments. The card includes a first plastic casting molded to the substrate and encapsulating the semiconductor components while leaving a peripheral portion of the substrate uncovered. A second plastic casting is molded to the peripheral portion to abut the first plastic casting and form the card periphery.
摘要翻译：一种用于制造半导体卡的方法包括印刷电路基板，其上安装有包括一个或多个半导体部件如卡片或封装的卡电路。外部触点通过可拆卸插入将卡电路连接到另一设备的电路。衬底由周围框架中的外围开口限定，其可以是复帧条的一部分。基板通过连接段连接到框架。该卡片包括模塑到基底上的第一塑料浇注并封装半导体部件，同时留下未覆盖的基底的周边部分。第二塑料铸件被模制到周边部分以邻接第一塑料铸件并形成卡周边。

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