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    • 77. 发明授权
    • Resistance control method for nonvolatile variable resistive element
    • 非易失性可变电阻元件的电阻控制方法
    • US08451647B2
    • 2013-05-28
    • US13157620
    • 2011-06-10
    • Kazuya Ishihara
    • Kazuya Ishihara
    • G11C11/00
    • G11C13/0007G11C13/0023G11C13/0069G11C13/0097G11C2013/0083G11C2013/0088G11C2213/79
    • A resistance control method for a nonvolatile variable resistive element in a nonvolatile semiconductor memory device is provided. The device includes a memory cell array in which unit memory cells having nonvolatile variable resistive elements and transistors are arranged in a matrix. The memory cells that are targets of a memory operation are selected by first selection lines (word lines), second selection lines (bit lines) and third selection lines (source lines). The method includes steps of selecting one or more first selection lines, selecting a plurality of second selection lines, and applying a compensated voltage in which a change in potential of the third selection lines caused by current flowing into the third selection lines through the second selection lines is compensated in a voltage that is necessary for the memory operation, such that the voltage necessary for the memory operation is applied to all of the selected memory cells.
    • 提供了一种用于非易失性半导体存储器件中的非易失性可变电阻元件的电阻控制方法。 该器件包括存储单元阵列,其中具有非易失性可变电阻元件和晶体管的单元存储单元排列成矩阵。 通过第一选择线(字线),第二选择线(位线)和第三选择线(源极线)来选择作为存储器操作的目标的存储器单元。 该方法包括以下步骤:选择一个或多个第一选择线,选择多个第二选择线,以及施加补偿电压,其中由通过第二选择流入第三选择线的电流引起的第三选择线的电位变化 线路以对于存储器操作所必需的电压进行补偿,使得存储器操作所需的电压被应用于所选择的所有存储单元。
    • 79. 发明申请
    • SEMICONDUCTOR MEMORY DEVICE
    • 半导体存储器件
    • US20120075911A1
    • 2012-03-29
    • US13224814
    • 2011-09-02
    • Mitsuru NAKURAKazuya IshiharaShinobu YamazakiSuguru Kawabata
    • Mitsuru NAKURAKazuya IshiharaShinobu YamazakiSuguru Kawabata
    • G11C11/00
    • G11C13/0007G11C13/0028G11C13/0061G11C13/0064G11C13/0069G11C13/0097
    • Regardless of a resistance state of a variable resistance element of a memory cell that is a target of a writing action (erasing and programming actions), an erasing voltage pulse for bringing the resistance state of the variable resistance element to an erased state having a lowest resistance value is applied. Thereafter, a programming voltage pulse for bringing the resistance state of the variable resistance element to a desired programmed state is applied to the variable resistance element of the programming action target memory cell. By always applying the programming voltage pulse after having applied the erasing voltage pulse, a plurality of programming voltage pulses being sequentially applied can be avoided. Further, the memory cell array is constituted of even-numbers of subbanks, and the application of the erasing voltage pulse in one subbank and the application of the programming voltage pulse in the other subbank are alternately performed.
    • 无论作为写入动作(擦除和编程动作)的目标的存储单元的可变电阻元件的电阻状态,将可变电阻元件的电阻状态变为最低的擦除状态的擦除电压脉冲 电阻值被应用。 此后,将用于使可变电阻元件的电阻状态变为期望编程状态的编程电压脉冲被施加到编程动作目标存储单元的可变电阻元件。 通过在施加擦除电压脉冲之后始终应用编程电压脉冲,可以避免顺序施加的多个编程电压脉冲。 此外,存储单元阵列由偶数个子库构成,并且将擦除电压脉冲应用于一个子库中,并且编程电压脉冲在另一个子库中的应用被交替执行。