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71. 发明授权

US08064003B2 Thin film transistor integrated circuit device, active matrix display device, and manufacturing methods of the same 失效
标题翻译：薄膜晶体管集成电路器件，有源矩阵显示器件及其制造方法
公开(公告)号：US08064003B2
公开(公告)日：2011-11-22
申请号：US10581035
申请日：2004-11-26
申请人： Tadahiro Ohmi , Akihiro Morimoto , Teruhiko Suzuki , Takeyoshi Kato
发明人： Tadahiro Ohmi , Akihiro Morimoto , Teruhiko Suzuki , Takeyoshi Kato
IPC分类号： G02F1/136
CPC分类号： G02F1/1368 , G02F2001/133357 , H01L27/12 , H01L27/124 , H01L27/1248 , H01L27/1285 , H01L27/1292 , H01L29/41733 , H01L29/66742 , H01L29/78636
摘要： There is provided an active matrix display device including a flattening layer formed so as to surround a source electrode wiring, a drain electrode wiring, and a signal line, so that the source electrode wiring, the drain electrode wiring, and the signal line form substantially the same surface with the flattening layer.
摘要翻译：提供了一种有源矩阵显示装置，包括形成为围绕源电极布线，漏电极布线和信号线形成的平坦化层，使得源极电极布线，漏电极布线和信号线基本上形成与平整层相同的表面。

72. 发明申请

US20100143239A1 METHOD FOR PARALLEL OPERATION OF REACTORS THAT GENERATE MOISTURE 有权
标题翻译：水分生成反应器并行运行的方法
公开(公告)号：US20100143239A1
公开(公告)日：2010-06-10
申请号：US12596395
申请日：2007-04-17
申请人： Yukio Minami , Keiji Hirao , Masaharu Taguchi , Toshiro Nariai , Koji Kawada , Akihiro Morimoto , Nobukazu Ikeda
发明人： Yukio Minami , Keiji Hirao , Masaharu Taguchi , Toshiro Nariai , Koji Kawada , Akihiro Morimoto , Nobukazu Ikeda
IPC分类号： C01B5/00
CPC分类号： C01B5/00 , Y10T137/0396
摘要： The method for parallel operation of moisture generating reactors according to the present invention operates so that an orifice, provided with an orifice hole having a predetermined opening diameter, is disposed on a mixed-gas inlet side of each of a plurality of moisture generating reactors connected in parallel with each other, and mixed gas G consisting of hydrogen and oxygen is supplied from a mixer to each of the moisture generating reactors through each orifice, and the flows of moisture generated by the moisture generating reactors are combined, and the resulting combined moisture is supplied to an apparatus that uses high-purity water. Thus, a need to increase the amount of high-purity water supply is met by allowing a plurality of moisture generating reactors to perform a parallel water generating operation by branching off a mixed gas consisting of H2 and O2 by using a simple orifice construction.
摘要翻译：根据本发明的水分发生反应器的并联操作方法操作，使得设置有具有预定开口直径的孔眼的孔口设置在连接的多个水分发生反应器中的每一个的混合气体入口侧并且由氢气和氧气组成的混合气体G通过每个孔口从混合器供给到每个水分发生反应器，并且由湿度发生反应器产生的水分流合并，并将所得的组合湿气供应给使用高纯度水的设备。因此，通过使用多个水分产生反应器通过使用简单的孔结构分支由H 2和O 2组成的混合气体来进行平行的水生成操作来满足增加高纯度供水量的需要。

73. 发明申请

US20090202957A1 Gas heating method, and gas-heating piping member 审中-公开
标题翻译：气体加热方法和气体加热管道构件
公开(公告)号：US20090202957A1
公开(公告)日：2009-08-13
申请号：US11663557
申请日：2005-08-02
申请人： Nobukazu Ikeda , Akihiro Morimoto , Naofumi Yasumoto , Michio Yamaji , Tsuyoshi Tanikawa , Tadayuki Yakushijin , Hidehiro Doya
发明人： Nobukazu Ikeda , Akihiro Morimoto , Naofumi Yasumoto , Michio Yamaji , Tsuyoshi Tanikawa , Tadayuki Yakushijin , Hidehiro Doya
IPC分类号： F23L99/00 , F28F1/10
CPC分类号： F28F13/12 , F16L53/35 , F24H3/0405 , F28F1/40
摘要： Provided are a heating method making it possible that when a gas inside the body of a piping member, such as a pipe, is heated, the heating efficiency is improved; and a gas-heating piping member making it possible to perform such a heating method easily.A heat keeping member 4 which can transmit a gas to be heated is inserted to the inside of a piping member body 1 into which the gas can be passed in a state that the heat keeping member is brought into close contact with the inside, and further the piping member body 1 is heated from the outside thereof by means of a heating means 2.
摘要翻译：提供一种加热方法，使得当诸如管道的管道构件的主体内的气体被加热时，提高了加热效率; 以及能够容易地进行这样的加热方法的燃气加热配管部件。另外，在将保温体与内部紧密接触的状态下，将能够透过被加热气体的保温体4插入到能够通过气体的管道构件本体1的内部，管道构件主体1通过加热装置2从外部加热。

74. 发明申请

US20090165534A1 METHOD AND APPARATUS FOR TESTING LEAKAGE OF PIPE PASSAGE 审中-公开
标题翻译：用于测试管道泄漏泄漏的方法和装置
公开(公告)号：US20090165534A1
公开(公告)日：2009-07-02
申请号：US12281564
申请日：2007-03-07
申请人： Gisuke Kohno , Teruo Hon'Iden , Akihiro Morimoto , Naofumi Yasumoto , Koji Kawada , Yutaka Ueji , Nobukazu Ikeda , Masayuki Hatano , Michio Kuramochi , Yoshiyuki Kindai , Kazuhiro Nagano , Toshiaki Wada
发明人： Gisuke Kohno , Teruo Hon'Iden , Akihiro Morimoto , Naofumi Yasumoto , Koji Kawada , Yutaka Ueji , Nobukazu Ikeda , Masayuki Hatano , Michio Kuramochi , Yoshiyuki Kindai , Kazuhiro Nagano , Toshiaki Wada
IPC分类号： G01M3/08
CPC分类号： G01M3/2815
摘要： A method for testing leakage of a pipe passage employs a flow rate of gas used in testing supplied to the inside of a pipe passage undergoing testing hermetically sealed on one side while detecting flow rate with a flow measuring device and pressure with a pressure detector, and detecting temperature of the gas used, and inputting the detected values of pressure, flow rate and temperature into a computation treatment apparatus, and internal capacity VL of the pipe passage is computed as VL=(supplied flow rate Q×pressure applied time Δt)/(pressure rise value ΔP2), and next, the volume QL leaked from the pipe passage is computed as QL=(pressure drop value ΔP2′×internal capacity VL)/(pressure drop time Δt′).
摘要翻译：用于测试管道通道泄漏的方法采用供给到通过密封在一侧进行密封的管道内部的测试中使用的气体流量，同时利用流量测量装置和压力检测器检测流量，以及检测所使用的气体的温度，并将检测出的压力，流量和温度的值输入计算处理装置，并且计算管道内部容量VL为VL =（供给流量Qx压力施加时间Deltat）/（压力上升值DeltaP2），接下来，从管道泄漏的体积QL计算为QL =（压降值DeltaP2'内部容量VL）/（压降时间Deltat'）。

75. 发明申请

US20080217617A1 Thin Film Transistor, Wiring Board and Methods of Manufacturing the Same 审中-公开
标题翻译：薄膜晶体管，接线板及其制造方法
公开(公告)号：US20080217617A1
公开(公告)日：2008-09-11
申请号：US11988388
申请日：2006-07-05
申请人： Shigetoshi Sugawa , Akihiro Morimoto , Makoto Fujimura , Takeyoshi Katoh , Masahiko Chiba , Tomoyo Hirayama
发明人： Shigetoshi Sugawa , Akihiro Morimoto , Makoto Fujimura , Takeyoshi Katoh , Masahiko Chiba , Tomoyo Hirayama
IPC分类号： H01L29/04 , H05K1/03 , H01L21/336 , H05K3/00
CPC分类号： H01L29/78636 , G02F1/1368 , H01L27/124 , H01L27/1244 , H01L29/4908 , H01L29/78603 , Y10T29/49155
摘要： A gate electrode or a gate wiring of a thin-film transistor has a four-layer structure including an adhesive base layer, a catalyst layer, a wiring metal layer, and a wiring metal anti-diffusion layer which are laminated in this order. With this structure, adhesion and flatness are improved. In this case, the adhesive base layer is formed by a resin having a structure capable of coordinating to a metal. Hence, adhesion with an insulating substrate can be improved. Further, the wiring metal anti-diffusion layer is formed on the wiring metal layer, so that diffusion of a wiring metal can be inhibited. Thus, characteristics of the thin-film transistor can be improved.
摘要翻译：薄膜晶体管的栅电极或栅极布线具有依次层叠的包括粘合剂基层，催化剂层，布线金属层和布线金属防扩散层的四层结构。利用这种结构，提高了粘合性和平坦度。在这种情况下，粘合剂基层由具有能够与金属配位的结构的树脂形成。因此，可以提高与绝缘基板的粘合性。此外，布线金属反扩散层形成在布线金属层上，从而可以抑制布线金属的扩散。因此，可以提高薄膜晶体管的特性。

76. 发明授权

US07416165B2 Diaphragm valve for the vacuum exhaustion system 有权
标题翻译：用于真空排气系统的隔膜阀
公开(公告)号：US07416165B2
公开(公告)日：2008-08-26
申请号：US10546032
申请日：2004-02-09
申请人： Tadahiro Ohmi , Nobukazu Ikeda , Michio Yamaji , Masafumi Kitano , Akihiro Morimoto
发明人： Tadahiro Ohmi , Nobukazu Ikeda , Michio Yamaji , Masafumi Kitano , Akihiro Morimoto
IPC分类号： F16K31/122 , F16K7/17
CPC分类号： F16K7/16 , F16K51/02
摘要： A diaphragm valve 1 is provided with a body 2 having a flow-in passage 6, a flow-out passage 7, and a valve seat 8 formed between the passages; a diaphragm 3 installed in the body 2 and permitted to rest on and move away from the valve seat 8; and a driving means 4 installed on the body 2 to allow the diaphragm 3 to rest on and move away from the valve seat 8, wherein synthetic resin films 5 of predetermined thickness are coated on fluid-contacting parts 25 of the afore-mentioned body 2 and diaphragm 3. A diaphragm valve in accordance with the present invention prevents corrosion of the valve members caused by accumulation and adherence of substances produced by thermal decomposition, and prevents clogging caused by substances produced, and prevents seat leakage when applied in the vacuum exhaust system of a semiconductor manufacturing facility.
摘要翻译：隔膜阀1设置有主体2，主体2具有形成在通道之间的流入通道6，流出通道7和阀座8; 隔膜3安装在主体2中并允许搁置在阀座8上并远离阀座8; 以及安装在主体2上的驱动装置4，以允许隔膜3搁置在阀座8上并远离阀座8，其中预定厚度的合成树脂膜5涂覆在上述主体2的流体接触部分25上和隔膜3.根据本发明的隔膜阀防止由热分解产生的物质的积聚和粘附引起的阀构件的腐蚀，并且防止由所产生的物质引起的堵塞，并且当应用于真空排气系统时防止阀座泄漏的半导体制造设施。

77. 发明申请

US20080049407A1 Chip Element 有权
标题翻译：芯片元件
公开(公告)号：US20080049407A1
公开(公告)日：2008-02-28
申请号：US11663958
申请日：2004-09-29
申请人： Tadahiro Ohmi , Akihiro Morimoto
发明人： Tadahiro Ohmi , Akihiro Morimoto
IPC分类号： H05K7/06
CPC分类号： H01C1/01 , H01C7/003 , H01C17/006 , H01F17/0013 , H01F27/34 , H01F2017/002 , H01F2017/0026 , H03H5/02
摘要： A chip element according to this invention can reduce the influence of parasitic capacitance and parasitic inductance when used in a GHz band. A substrate is formed of a low permittivity material having a permittivity low enough to reduce parasitic capacitance in a GHz band. Parasitic capacitance inherent to the chip element is reduced.
摘要翻译：根据本发明的芯片元件可以在GHz带中使用时减小寄生电容和寄生电感的影响。衬底由低介电常数材料形成，其电容率低到足以降低GHz带内的寄生电容。降低了芯片元件固有的寄生电容。

78. 发明授权

US07331695B2 Visible light-reflecting member 失效
标题翻译：可见光反射部件
公开(公告)号：US07331695B2
公开(公告)日：2008-02-19
申请号：US10547693
申请日：2004-02-27
申请人： Tadahiro Ohmi , Akihiro Morimoto , Naoki Tanahashi
发明人： Tadahiro Ohmi , Akihiro Morimoto , Naoki Tanahashi
IPC分类号： F21V7/00
CPC分类号： C23C14/345 , C23C14/205 , C23C28/322 , C23C28/345 , C23C30/00 , G02B5/08 , G02F1/133553
摘要： A visible light-reflecting member is disclosed which uses a plate or a film for reflecting visible lights, whose reflective surface is provided with an aluminum thin film having an aluminum purity of not less than 99 mass % and an X-ray diffraction pattern wherein, among peak intensities ascribed to aluminum, the peak intensity ascribed to the (111) plane is higher than the total of the other peak intensities.
摘要翻译：公开了一种可见光反射构件，其使用用于反射可见光的板或膜，其反射表面设置有铝质量不小于99质量％的铝薄膜和X射线衍射图，在归因于铝的峰强度中，归因于（111）面的峰强度高于其他峰强度的总和。

79. 发明申请

US20080029476A1 Circuit Board And Manufacturing Method Thereof 审中-公开
标题翻译：电路板及其制造方法
公开(公告)号：US20080029476A1
公开(公告)日：2008-02-07
申请号：US10594599
申请日：2005-02-24
申请人： Tadahiro Ohmi , Akihiro Morimoto , Takeyoshi Kato , Masafumi Kawasaki , Yasuhiro Wakizaka
发明人： Tadahiro Ohmi , Akihiro Morimoto , Takeyoshi Kato , Masafumi Kawasaki , Yasuhiro Wakizaka
IPC分类号： H01B13/00
CPC分类号： H05K1/024 , H05K1/0216 , H05K1/0242 , H05K3/389
摘要： A circuit board having high adhessiveness contact between electrically insulating layers and having a low interlayer electric resistance is provided. A circuit board is provided with a first conductive layer formed on a core (1) and a first electrically insulating layer formed thereon. In the circuit board, a first conductor layer has a surface roughness Ra of 0.1 nm or more but less than 100 nm, and a first primer layer having a thiol compound as a main material is provided between the first conductive layer and the first electrically insulating layer. Thus, the circuit board which has excellent adhesiveness between the first conductor layer and the first electrically insulating layer and is also applicable to high frequency signal is provided.
摘要翻译：提供一种电绝缘层之间具有高粘合性接触并具有低层间电阻的电路板。电路板设置有形成在芯部（1）上的第一导电层和形成在其上的第一电绝缘层。在电路板中，第一导体层的表面粗糙度Ra为0.1nm以上且小于100nm，在第一导电层和第一电绝缘层之间设置具有硫醇化合物作为主要材料的第一底漆层层。因此，提供了在第一导体层和第一电绝缘层之间具有优异的粘合性并且也适用于高频信号的电路板。

80. 发明申请

US20060278162A1 Vacuum treatment apparatus and vapor deposition apparatus 审中-公开
标题翻译：真空处理装置和蒸镀装置
公开(公告)号：US20060278162A1
公开(公告)日：2006-12-14
申请号：US10568706
申请日：2004-08-19
申请人： Tadahiro Ohmi , Yasuyuki Shirai , Akihiro Morimoto
发明人： Tadahiro Ohmi , Yasuyuki Shirai , Akihiro Morimoto
IPC分类号： C23C16/00
CPC分类号： C23C14/564
摘要： It has been found that an organic component is emitted from a member such as a crucible or a gasket constituting an apparatus for vacuum treatment and an element is contaminated with said organic component emitted, and, as a result, members of the apparatus for vacuum treatment are subjected to a treatment for reducing the emission of an organic component. For example, a crucible is made from a material having a reduced catalytic activity to a material for use in the vapor deposition in question and a gasket is used after a treatment for reducing the bleeding of an organic component or is made from a material containing a reduced amount of an organic component.
摘要翻译：已经发现，有机组分从诸如坩埚或构成真空处理装置的垫圈的构件发射，并且元件被所发射的有机组分污染，结果是真空处理装置的构件经受用于减少有机组分的发射的处理。例如，坩埚由对所使用的气相沉积中使用的材料具有降低的催化活性的材料制成，并且在用于减少有机组分的渗出的处理之后使用垫圈，或者由含有减少有机成分的量。

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