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    • 72. 发明授权
    • Double wavelength semiconductor light emitting device and method of manufacturing the same
    • 双波长半导体发光器件及其制造方法
    • US07745839B2
    • 2010-06-29
    • US12224287
    • 2007-02-23
    • Shinichi TamaiKen NakaharaAtsushi Yamaguchi
    • Shinichi TamaiKen NakaharaAtsushi Yamaguchi
    • H01L33/00
    • H01S5/4031B82Y20/00H01S5/0425H01S5/20H01S5/22H01S5/2214H01S5/305H01S5/3063H01S5/3211H01S5/34333H01S5/4087H01S2304/04
    • Provided are a double wavelength semiconductor light emitting device, having an n electrode and p electrode disposed on the same surface side, in which the area of a chip is reduced to increase the number of chips taken from one single wafer, in which light focusing performance of double wavelength optical beams are improved, and in which an active layer of a light emitting element having a longer wavelength can be prevented from deteriorating in a process of manufacturing; and a method of manufacturing the same.Semiconductor lasers D1 and D2 as two light emitting elements having different wavelengths are integrally formed on a common substrate 1. A semiconductor laminate A is deposited on an n-type contact layer 21 in a semiconductor laser D1, and a semiconductor laminate B is deposited in a semiconductor laser D2. The semiconductor laminate A and semiconductor laminate B are configured to have different layer structures. An n electrode 12 formed between the semiconductor lasers D1 and D2 is shared by the semiconductor lasers D1 and D2, and serves as a common electrode on an n side. Additionally, the semiconductor laminate having a shorter wavelength is crystal-grown firstly.
    • 提供了一种双波长半导体发光器件,其具有设置在同一表面侧的n电极和p电极,其中芯片的面积减小以增加从单个晶片获取的芯片的数量,其中光聚焦性能 双波长光束的改善,其中可以防止在制造过程中具有较长波长的发光元件的有源层劣化; 及其制造方法。 作为具有不同波长的两个发光元件的半导体激光器D1和D2一体地形成在公共基板1上。半导体层叠体A沉积在半导体激光器D1中的n型接触层21上,并且半导体层叠体B沉积在 半导体激光器D2。 半导体层叠体A和半导体层叠体B具有不同的层结构。 形成在半导体激光器D1和D2之间的n电极12由半导体激光器D1和D2共享,并且用作n侧的公共电极。 此外,首先将具有较短波长的半导体层叠体晶体生长。
    • 76. 发明申请
    • SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
    • 半导体发光器件及其制造方法
    • US20100019257A1
    • 2010-01-28
    • US11815759
    • 2006-02-07
    • Mitsuhiko SakaiAtsushi YamaguchiKen NakaharaMasayuki SonobeTsuyoshi Tsutsui
    • Mitsuhiko SakaiAtsushi YamaguchiKen NakaharaMasayuki SonobeTsuyoshi Tsutsui
    • H01L33/00
    • H01L33/20H01L33/0079H01L33/60
    • There are provided a nitride semiconductor light emitting device having a structure enabling enhanced external quantum efficiency by effectively taking out light which is apt to repeat total reflection within a semiconductor lamination portion and a substrate and attenuate, and a method for manufacturing the same. A semiconductor lamination portion (6) including a first conductivity type layer and a second conductivity type layer, made of nitride semiconductor, is provided on a surface of the substrate (1) made of, for example, sapphire or the like. A first electrode (for example, p-side electrode (8)) is provided electrically connected to the first conductivity type layer (for example, p-type layer (5)) on a surface side of the semiconductor lamination portion (6), and a second electrode (for example, n-side electrode (9)) is provided electrically connected to the second conductivity type layer (for example, n-type layer (3)). A part of the semiconductor lamination portion (6) is removed at a surrounding region of a chip of the semiconductor lamination portion (6) by etching so that column portions (6a) stand side by side by leaving the semiconductor lamination portion without etching, and the n-type layer (3) expose around the column portions (6a).
    • 提供了具有通过有效地取出在半导体层叠部分和衬底内易于重复全反射的光而衰减的能够提高外部量子效率的结构的氮化物半导体发光器件及其制造方法。 在由例如蓝宝石等制成的基板(1)的表面上设置包括由氮化物半导体构成的第一导电型层和第二导电型层的半导体层叠部(6)。 第一电极(例如,p侧电极(8))在半导体层叠部分(6)的表面侧电连接到第一导电类型层(例如,p型层(5)), 并且第二电极(例如,n侧电极(9))被设置为电连接到第二导电类型层(例如,n型层(3))。 通过蚀刻在半导体层叠部(6)的芯片的周围区域去除半导体层叠部(6)的一部分,使得柱部(6a)不经蚀刻而离开半导体层叠部而并排放置,并且 n型层(3)围绕柱部(6a)露出。
    • 78. 发明授权
    • Semiconductor light emitting device
    • 半导体发光器件
    • US07582905B2
    • 2009-09-01
    • US11662097
    • 2005-09-07
    • Kentaro TamuraKen Nakahara
    • Kentaro TamuraKen Nakahara
    • H01L27/15
    • H01L33/42H01L33/32H01L33/405
    • A semiconductor light emitting device is provided, in which the light emitting efficiency of a LED is improved. A semiconductor light emitting device (11) includes a light emitting layer (16) made of a GaN-based semiconductor sandwiched with an n-type GaN-based semiconductor layer (17) and a p-type GaN-based semiconductor layer (15), and a ZnO-based or an ITO transparent electrode layer (14). Further, a value of an equation represented by 3t/(A/π)1/2−3(t/(A/π)1/2)2+(t/(A/π)1/2)3 is 0.1 or more, where a thickness of the transparent electrode layer is represented by t and an area of the light emitting layer (light emitting area) of the light emitting device (11) is represented by A. The light emitting efficiency is improved using the transparent electrode layer (14) having an optimum thickness to the light emitting area.
    • 提供了一种提高了LED的发光效率的半导体发光器件。 半导体发光器件(11)包括由夹在n型GaN基半导体层(17)和p型GaN基半导体层(15)之间的GaN基半导体制成的发光层(16) ,以及ZnO系或ITO透明电极层(14)。 此外,由3t /(A / pi)1 / 2-3(t /(A / pi)1/2)2+(t /(A / pi)1/2)3表示的方程的值为0.1 以上,透明电极层的厚度由t表示,发光元件(11)的发光面积(发光面积)的面积由A表示。发光效率通过透明 对于发光区域具有最佳厚度的电极层(14)。
    • 79. 发明申请
    • Nitride Semiconductor Light Emitting Element
    • 氮化物半导体发光元件
    • US20090179190A1
    • 2009-07-16
    • US12227711
    • 2006-05-26
    • Ken NakaharaNorikazu ItoKazuaki Tsutsumi
    • Ken NakaharaNorikazu ItoKazuaki Tsutsumi
    • H01L33/00
    • H01L33/32H01L33/02H01L33/04
    • Provided is a nitride semiconductor light emitting element having an improved carrier injection efficiency from a p-type nitride semiconductor layer to an active layer by simple means from a viewpoint utterly different from the prior art. In the nitride semiconductor light emitting element, a buffer layer 2, an undoped GaN layer 3, an n-type GaN contact layer 4, an InGaN/GaN superlattice layer 5, an active layer 6, an undoped GaN-based layer 7, and a p-type GaN-based contact layer 8 are stacked on a sapphire substrate 1. A p-electrode 9 is formed on the p-type GaN-based contact layer 8. An n-electrode 10 is formed on a surface where the n-type GaN contact layer 4 is exposed as a result of mesa-etching. An intermediate semiconductor layer is formed between a well layer closest to a p-side in the active layer having a quantum well structure and the p-type GaN-based contact layer 8. The carrier injection efficiency into the active layer 6 can be improved by making the total film thickness of the intermediate semiconductor layer 20 nm or less.
    • 提供了从与现有技术完全不同的观点,通过简单的手段,具有从p型氮化物半导体层到活性层的载流子注入效率提高的氮化物半导体发光元件。 在氮化物半导体发光元件中,缓冲层2,未掺杂的GaN层3,n型GaN接触层4,InGaN / GaN超晶格层5,有源层6,未掺杂的GaN基层7和 在蓝宝石衬底1上堆叠p型GaN基接触层8.在p型GaN基接触层8上形成p电极9.在n面上形成n电极10, 作为台面蚀刻的结果,露出GaN型接触层4。 在具有量子阱结构的有源层中的最靠近p侧的阱层和p型GaN基接触层8之间形成中间半导体层。通过以下方式可以提高进入有源层6的载流子注入效率: 使中间半导体层的总膜厚度为20nm以下。
    • 80. 发明申请
    • Nitride Semiconductor Light Emitting Element
    • 氮化物半导体发光元件
    • US20090166607A1
    • 2009-07-02
    • US12227694
    • 2006-05-26
    • Ken NakaharaNorikazu ItoKazuaki Tsutsumi
    • Ken NakaharaNorikazu ItoKazuaki Tsutsumi
    • H01L33/00
    • H01L33/32H01L33/02H01L33/06
    • Provided is a nitride semiconductor light emitting element having an improved carrier injection efficiency from a p-type nitride semiconductor layer to an active layer by simple means from a viewpoint utterly different from the prior art. A buffer layer 2, an undoped GaN layer 3, an n-type GaN contact layer 4, an InGaN/GaN superlattice layer 5, an active layer 6, a first undoped InGaN layer 7, a second undoped InGaN layer 8, and a p-type Gan-based contact layer 9 are stacked on a sapphire substrate 1. A p-electrode 10 is formed on the p-type Gan-based contact layer 9. An n-electrode 11 is formed on a surface where the n-type GaN contact layer 4 is exposed as a result of mesa-etching. The first undoped InGaN layer 7 is formed to contact a well layer closest to a p-side in the active layer having a quantum well structure, and subsequently the second undoped InGaN layer 8 is formed thereon. The carrier injection efficiency into the active layer 6 can be improved by making the total film thickness of the first and second undoped InGaN layers 20 nm or less.
    • 提供了从与现有技术完全不同的观点,通过简单的手段,具有从p型氮化物半导体层到活性层的载流子注入效率提高的氮化物半导体发光元件。 缓冲层2,未掺杂的GaN层3,n型GaN接触层4,InGaN / GaN超晶格层5,有源层6,第一未掺杂的InGaN层7,第二未掺杂的InGaN层8和p 型的Gan型接触层9层叠在蓝宝石基板1上。在p型Gan型接触层9上形成p电极10.在n型电极11的表面上形成n电极11, 作为台面蚀刻的结果,GaN接触层4被暴露。 第一未掺杂的InGaN层7形成为与具有量子阱结构的有源层中最靠近p侧的阱层接触,随后在其上形成第二未掺杂的InGaN层8。 通过使第一和第二未掺杂的InGaN层的总膜厚度达到20nm以下,能够提高进入有源层6的载流子注入效率。