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    • 71. 发明授权
    • High speed pipeline image processing for digital photoprinter
    • 数字照相机高速流水线图像处理
    • US6072916A
    • 2000-06-06
    • US932169
    • 1997-09-17
    • Ryo Suzuki
    • Ryo Suzuki
    • G03B17/50G06T1/20H04N1/04H04N1/21H04N1/32G06K9/54
    • H04N1/32443H04N1/32358H04N1/32491H04N2201/0416H04N2201/3288
    • An image processing apparatus subjects image data photoelectrically read out by an image reading apparatus to predetermined image processings and outputs the read-out image data as image data to be recorded. The image processing apparatus includes a plurality of memories for storing image data read out by the image reading apparatus; an image processing unit for reading the image data from the memories and for carrying out the predetermined image processings by pipeline processing; a condition setting unit for setting image processing conditions in the image processing unit; an image data bus for inputting and outputting the image data; and a control bus for inputting and outputting control data. The image processing apparatus permits a scanner to continuously read images, and a printer to continuously record the images of an application requiring high speed output of finished prints (i.e., a digital photoprinter). Thus, finished prints can be effectively output at high speed.
    • 图像处理设备对由图像读取装置进行光电读取的图像数据进行预定的图像处理,并将读出的图像数据作为要记录的图像数据输出。 图像处理装置包括:多个存储器,用于存储由图像读取装置读出的图像数据; 图像处理单元,用于从存储器读取图像数据并通过流水线处理执行预定的图像处理; 条件设置单元,用于设置图像处理单元中的图像处理条件; 用于输入和输出图像数据的图像数据总线; 以及用于输入和输出控制数据的控制总线。 图像处理装置允许扫描仪连续地读取图像,并且打印机连续地记录需要高速输出完成的打印的应用的图像(即,数字照片打印机)。 因此,能够高效地输出成品。
    • 73. 发明授权
    • Planar display apparatus having exposed insulated substrate portion
    • 具有露出的绝缘基板部分的平面显示装置
    • US5587627A
    • 1996-12-24
    • US395703
    • 1995-02-28
    • Masato SaitoRyo SuzukiKeiji FukuyamaTakuya OhiraKeiji WatanabeMinoru KobayashiSusumu HoshinouchiYoshinori Hatanaka
    • Masato SaitoRyo SuzukiKeiji FukuyamaTakuya OhiraKeiji WatanabeMinoru KobayashiSusumu HoshinouchiYoshinori Hatanaka
    • H01J31/12H05B37/02
    • H01J31/126
    • A control electrode portion for passing electrons through a given electron-passing hole selected from a plurality of electron-passing holes provided on an insulating substrate is formed by coating the insulating substrate with a conductive film and dividing the into a plurality of conductive films as control electrodes. This structure obviates the mesh structure of electrons which are necessary in the case of arranging control electrodes on the insulating substrate, thereby realizing high-definition display devices with improved luminance. In addition, planar display devices provided with a surface insulated substrate produced by forming an insulating film on a conductive substrate having electron-passing holes and a plurality of separate control electrodes arranged on the surface insulated substrate, it is possible to prevent the charge-up effect which obstructs the passage of electron beams and, hence, to enhance the luminance at least by (1) providing a voltage applying circuit for applying a predetermined voltage to the conductive substrate, (2) providing a portion at which the conductive substrate is exposed between the adjacent control electrodes.
    • 通过用导电膜涂覆绝缘基板并将其分成多个导电膜作为对照,形成用于使电子通过选自设置在绝缘基板上的多个电子通过孔中的给定电子通过孔的控制电极部分 电极。 这种结构消除了在绝缘基板上布置控制电极的情况下必需的电子的网格结构,从而实现了具有改善的亮度的高清晰度显示装置。 另外,具有通过在具有电子通过孔的导电性基板上形成绝缘膜而形成的表面绝缘基板的平面显示装置和配置在表面绝缘基板上的多个分立控制电极,能够防止充电 至少通过(1)提供用于向导电衬底施加预定电压的电压施加电路,(2)提供导电衬底露出的部分,从而阻止电子束通过,并因此提高亮度 在相邻的控制电极之间。
    • 79. 发明授权
    • Hybrid silicon wafer
    • 混合硅片
    • US08659022B2
    • 2014-02-25
    • US13498992
    • 2010-10-28
    • Ryo SuzukiHiroshi Takamura
    • Ryo SuzukiHiroshi Takamura
    • H01L29/04
    • C30B29/06C30B29/605H01L21/02532H01L21/02595H01L21/02598H01L21/02667
    • A hybrid silicon wafer which is a silicon wafer having a structure wherein monocrystalline silicon is embedded in polycrystalline silicon that is prepared by the unidirectional solidification/melting method. The longitudinal plane of crystal grains of the polycrystalline portion prepared by the unidirectional solidification/melting method is used as the wafer plane, and the monocrystalline silicon is embedded so that the longitudinal direction of the crystal grains of the polycrystalline portion forms an angle of 120° to 150° relative to the cleaved surface of the monocrystalline silicon. Thus provided is a hybrid silicon wafer comprising the functions of both a polycrystalline silicon wafer and a monocrystalline wafer.
    • 作为硅晶片的混合硅晶片,其具有通过单向凝固/熔融法制备的单晶硅嵌入到多晶硅中的结构。 使用通过单向凝固/熔融法制备的多晶部分的晶粒的纵向平面用作晶片平面,并且嵌入单晶硅,使得多晶部分的晶粒的纵向方向形成120°的角度 至150°相对于单晶硅的切割表面。 因此提供了包括多晶硅晶片和单晶晶片的功能的混合硅晶片。
    • 80. 发明授权
    • Hybrid silicon wafer and method of producing the same
    • 混合硅晶片及其制造方法
    • US08647747B2
    • 2014-02-11
    • US12832150
    • 2010-07-08
    • Hiroshi TakamuraRyo Suzuki
    • Hiroshi TakamuraRyo Suzuki
    • B32B3/02B32B9/04B32B13/04C01B33/02B29D7/00
    • C30B33/06C01B32/05C30B11/00C30B29/06Y10T428/21
    • Provided is a hybrid silicon wafer in which molten state polycrystalline silicon and solid state single-crystal silicon are mutually integrated, comprising fine crystals having an average crystal grain size of 8 mm or less at a polycrystalline portion within 10 mm from a boundary with a single-crystal portion. Additionally provided is a method of manufacturing a hybrid silicon wafer, wherein a columnar single-crystal silicon ingot is sent in a mold in advance, molten silicon is cast around and integrated with the single-crystal ingot to prepare an ingot complex of single-crystal silicon and polycrystalline silicon, and a wafer shape is cut out therefrom. The provided hybrid silicon wafer comprises the functions of both a polycrystalline silicon wafer and a single-crystal wafer.
    • 提供了一种混合硅晶片,其中熔融状态的多晶硅和固态单晶硅相互整合,包括在与单个边界的边界10mm以内的多晶部分处具有8mm或更小的平均晶粒尺寸的细晶体 晶体部分。 另外提供了一种制造混合硅晶片的方法,其中预先在模具中输送柱状单晶硅锭,将熔融硅铸造并与单晶锭一体化以制备单晶锭锭 硅和多晶硅,并从其中切出晶片形状。 所提供的混合硅晶片包括多晶硅晶片和单晶晶片的功能。