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71. 发明授权

US07036442B2 Yarn passing device of sewing machine for embroidery 失效
标题翻译：缝纫机纱线通过装置
公开(公告)号：US07036442B2
公开(公告)日：2006-05-02
申请号：US10220704
申请日：2001-03-07
申请人： Toshio Miyamoto , Teruya Miyamoto
发明人： Toshio Miyamoto , Teruya Miyamoto
IPC分类号： D05B87/02
CPC分类号： D05C11/16 , B65H49/16 , B65H2701/31 , D05B87/02
摘要： A threading device for embroidery machinery performs threading accurately regardless of the type of thread such that it is capable of changing colored thread automatically without intervention of an operator. The threading device includes a needle support mechanism disposed movably facing a hooking member, for preventing deflection of a needle by correcting deflection of the needle, when inserting the hooking member formed in the shape of a hook at a tip of a thread pull-out mechanism in a needle hole.
摘要翻译：用于刺绣机械的穿线装置可以精确地执行穿线，而不管螺纹的类型如何，使得能够自动地改变着色线，而不需要操作者的介入。穿线装置包括：针支撑机构，其可移动地面向钩挂构件，用于通过矫正针的偏转来防止针头的偏转，当将形成为钩状的钩形构件插入到线拔出机构的尖端时在针孔。

72. 发明申请

US20050146008A1 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US20050146008A1
公开(公告)日：2005-07-07
申请号：US11057495
申请日：2005-02-15
申请人： Toshio Miyamoto , Asao Nishimura , Koki Noguchi , Satoshi Michishita , Masashi Horiguchi , Masaharu Kubo , Kazuyoshi Shiba
发明人： Toshio Miyamoto , Asao Nishimura , Koki Noguchi , Satoshi Michishita , Masashi Horiguchi , Masaharu Kubo , Kazuyoshi Shiba
IPC分类号： H01L23/495 , H01L23/498 , H01L25/10 , H01L27/108 , H01L23/52
CPC分类号： H01L24/50 , H01L23/49572 , H01L23/49816 , H01L24/06 , H01L24/45 , H01L24/48 , H01L25/0657 , H01L25/105 , H01L27/10897 , H01L2224/0401 , H01L2224/04042 , H01L2224/06136 , H01L2224/16245 , H01L2224/451 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2225/1029 , H01L2225/1035 , H01L2225/1058 , H01L2225/107 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01021 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01055 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/12033 , H01L2924/13091 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/15312 , H01L2924/15331 , H01L2924/181 , H01L2924/19041 , H01L2924/3011 , H01L2924/3511 , H01L2924/00015 , H01L2224/05599 , H01L2924/00 , H01L2924/00012
摘要： Described herein is a stacked package according to the present invention, wherein a plurality of tape carriers which seal semiconductor chips, are multilayered in upward and downward directions. In the stacked package, one ends of leads formed over the whole surfaces of each tape carrier are electrically connected to their corresponding connecting terminals of the semiconductor chip. Other ends of the leads are electrically connected to their corresponding through holes defined in the tape carrier. Connecting terminals common to the plurality of semiconductor chips are formed at the same places of the plurality of tape carriers and withdrawn to the same external connecting terminals through a plurality of mutually-penetrated through holes.
摘要翻译：这里描述的是根据本发明的堆叠式封装，其中密封半导体芯片的多个带状载体在上下方向上多层叠。在叠层封装中，形成在每个带载体的整个表面上的引线的一端电连接到其对应的半导体芯片的连接端子。引线的另一端电连接到其在带载体中限定的相应的通孔。在多个带状载体的相同位置形成有与多个半导体芯片共用的连接端子，并且通过多个相互贯穿的贯通孔将其连接到相同的外部连接端子。

73. 发明授权

US06900074B2 METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE HAVING PLURAL SEMICONDUCTOR CHIPS, WHEREIN ELECTRODES OF THE SEMICONDUCTOR CHIPS ARE ELECTRICALLY CONNECTED TOGETHER VIA WIRING SUBSTRATES OF THE SEMICONDUCTOR CHIPS 有权
标题翻译：制造具有多个半导体器件的半导体器件的方法，其中半导体器件的电极通过半导体器件的布线基板电连接
公开(公告)号：US06900074B2
公开(公告)日：2005-05-31
申请号：US10422942
申请日：2003-04-25
申请人： Toshio Miyamoto , Asao Nishimura , Koki Noguchi , Satoshi Michishita , Masashi Horiguchi , Masaharu Kubo , Kazuyoshi Shiba
发明人： Toshio Miyamoto , Asao Nishimura , Koki Noguchi , Satoshi Michishita , Masashi Horiguchi , Masaharu Kubo , Kazuyoshi Shiba
IPC分类号： H01L23/495 , H01L23/498 , H01L25/10 , H01L27/108 , H01L21/48 , H01L23/02
CPC分类号： H01L24/50 , H01L23/49572 , H01L23/49816 , H01L24/06 , H01L24/45 , H01L24/48 , H01L25/0657 , H01L25/105 , H01L27/10897 , H01L2224/0401 , H01L2224/04042 , H01L2224/06136 , H01L2224/16245 , H01L2224/451 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2225/1029 , H01L2225/1035 , H01L2225/1058 , H01L2225/107 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01021 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01055 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/12033 , H01L2924/13091 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/15312 , H01L2924/15331 , H01L2924/181 , H01L2924/19041 , H01L2924/3011 , H01L2924/3511 , H01L2924/00015 , H01L2224/05599 , H01L2924/00 , H01L2924/00012
摘要： Described herein is a stacked package according to the present invention, wherein a plurality of tape carriers which seal semiconductor chips, are multilayered in upward and downward directions. In the stacked package, one ends of leads formed over the whole surfaces of each tape carrier are electrically connected to their corresponding connecting terminals of the semiconductor chip. Other ends of the leads are electrically connected to their corresponding through holes defined in the tape carrier. Connecting terminals common to the plurality of semiconductor chips are formed at the same places of the plurality of tape carriers and withdrawn to the same external connecting terminals through a plurality of mutually-penetrated through holes.
摘要翻译：这里描述的是根据本发明的堆叠式封装，其中密封半导体芯片的多个带状载体在上下方向上多层叠。在叠层封装中，形成在每个带载体的整个表面上的引线的一端电连接到其对应的半导体芯片的连接端子。引线的另一端电连接到其在带载体中限定的相应的通孔。在多个带状载体的相同位置形成有与多个半导体芯片共用的连接端子，并且通过多个相互贯穿的贯通孔将其连接到相同的外部连接端子。

74. 发明授权

US06763205B2 Image heating apparatus with heater in form of a plate cooperable with a rotatable member to form a heating nip 有权
标题翻译：具有与可旋转构件配合以形成加热辊隙的板形式的加热器的图像加热装置
公开(公告)号：US06763205B2
公开(公告)日：2004-07-13
申请号：US10263962
申请日：2002-10-04
申请人： Satoru Izawa , Masahiro Goto , Toshio Miyamoto , Masahiko Suzumi , Eiji Uekawa , Koji Nihonyanagi
发明人： Satoru Izawa , Masahiro Goto , Toshio Miyamoto , Masahiko Suzumi , Eiji Uekawa , Koji Nihonyanagi
IPC分类号： G03G1520
CPC分类号： G03G15/2064
摘要： An image heating apparatus includes a rotatable member; back-up means for cooperating with the rotatable member to form a feeding nip for feeding a recording material; heating means for heating an outer peripheral surface of the rotatable member, the heating means including a heater in the form of a plate cooperable with the rotatable member to form a heating nip.
摘要翻译：图像加热装置包括可旋转构件; 用于与所述可旋转构件配合以形成用于馈送记录材料的进给辊隙的备用装置; 用于加热可旋转构件的外周面的加热装置，加热装置包括与可旋转构件配合的板形式的加热器，以形成加热辊隙。

75. 发明授权

US06720591B2 Semiconductor integrated circuit device 有权
标题翻译：半导体集成电路器件
公开(公告)号：US06720591B2
公开(公告)日：2004-04-13
申请号：US10127583
申请日：2002-04-23
申请人： Toshio Miyamoto , Ichiro Anjo , Asao Nishimura , Yoshihide Yamaguchi
发明人： Toshio Miyamoto , Ichiro Anjo , Asao Nishimura , Yoshihide Yamaguchi
IPC分类号： H01L2710
CPC分类号： H01L23/5258 , H01L23/3114 , H01L27/10814 , H01L27/10897 , H01L2224/0392 , H01L2224/05001 , H01L2224/05008 , H01L2224/05022 , H01L2224/05548 , H01L2224/05569 , H01L2224/05571 , H01L2224/16 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/04941 , H01L2924/15311 , H01L2924/19041 , H01L2224/05644 , H01L2924/00014 , H01L2224/05147 , H01L2224/05171
摘要： Disclosed is a technique capable of enhancing the degree of freedom in the layout of a rerouting layer in a wafer level CSP in which defect repairing is performed by cutting a fuse. More specifically, after the defect repairing is performed by irradiating a laser beam to a fuse, an organic passivation layer (photo-sensitive polyimide layer) is filled in a fuse opening. Thereafter, a rerouting layer, a bump land, an uppermost wiring layer, and a solder bump are formed on the organic passivation layer. In the following steps of the defect repairing, the baking process to cure an elastomer layer and the uppermost protection layer is conducted at a temperature below 260° C. in order to prevent the variance of the refresh times of memory cells.
摘要翻译：公开了一种能够提高晶片级CSP中的重新布线层的布局自由度的技术，其中通过切割熔丝进行缺陷修复。更具体地，在通过将激光束照射到熔丝进行缺陷修复之后，将有机钝化层（光敏聚酰亚胺层）填充在保险丝开口中。此后，在有机钝化层上形成重路由层，凸起焊盘，最上布线层和焊料凸块。在缺陷修复的以下步骤中，在低于260℃的温度下进行固化弹性体层和最上层保护层的烘烤过程，以防止存储单元的更新时间的变化。

76. 发明授权

US06573158B2 Methods of processing semiconductor wafer and producing IC card, and carrier 有权
公开(公告)号：US06573158B2
公开(公告)日：2003-06-03
申请号：US09991747
申请日：2001-11-26
申请人： Toshio Miyamoto , Kunihiro Tsubosaki , Mitsuo Usami
发明人： Toshio Miyamoto , Kunihiro Tsubosaki , Mitsuo Usami
IPC分类号： H01L2146
CPC分类号： H01L21/6835 , G06K19/077 , G06K19/07749 , G06K19/0775 , G06K19/07779 , G06K19/07783 , H01L23/49855 , H01L23/5388 , H01L24/27 , H01L24/28 , H01L24/83 , H01L2221/68318 , H01L2224/05001 , H01L2224/05022 , H01L2224/05572 , H01L2224/16225 , H01L2224/16227 , H01L2224/2919 , H01L2224/81903 , H01L2224/8319 , H01L2224/838 , H01L2224/83851 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/0105 , H01L2924/01057 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/14 , H01L2924/19041 , H01L2924/3025 , H01L2924/3511 , H01L2924/00 , H01L2924/01022 , H01L2924/3512
摘要： The semiconductor wafer is made thin without any cracks and warp under good workability. The semiconductor wafer thinning process includes the first step of preparing a carrier 1 formed of a base 1a and a suction pad 1b provided on one surface of the base 1a or formed of a base film with an adhesive, the second step of bonding a semiconductor wafer to the carrier 1 in such a manner that a rear surface of the semiconductor wafer 2 with no circuit elements formed therein is opposite to the carrier to form a wafer composite 10, and the third step of holding the carrier of the wafer composite 10 with its semiconductor wafer 2 side up and spin-coating an etchant on the rear surface of the semiconductor wafer 2 thereby to make the semiconductor wafer 2 thin.

77. 发明授权

US06518664B2 Semiconductor integrated circuit device and manufacturing method of that 失效
公开(公告)号：US06518664B2
公开(公告)日：2003-02-11
申请号：US09805056
申请日：2001-03-14
申请人： Toshio Miyamoto
发明人： Toshio Miyamoto
IPC分类号： H01L2348
CPC分类号： H01L21/2885 , H01L21/288 , H01L21/76802 , H01L24/11 , H01L24/13 , H01L2224/02166 , H01L2224/05571 , H01L2224/05573 , H01L2224/05624 , H01L2224/1134 , H01L2224/13016 , H01L2224/1308 , H01L2224/13082 , H01L2224/131 , H01L2224/13147 , H01L2224/1357 , H01L2224/1369 , H01L2224/16105 , H01L2224/45124 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01056 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/12042 , H01L2924/1306 , H01L2924/14 , H01L2924/3011 , H01L2224/13099 , H01L2924/00 , H01L2224/48
摘要： A laser beam is irradiated onto a photocurable resin layer formed on an electrode part before rearrangement. By scanning the resin on the periphery of a metal wiring formation area extending from the electrode part before rearrangement to a bump electrode contact area, is cured. As a result, a cured resin part is formed which works as a guide layer and a protection film for protecting the metal wire in which the metal wiring formation area has a hollow shape. Thereafter, the metal wire is formed inside the cured resin part.

78. 发明授权

US06493521B2 Image forming apparatus 有权
标题翻译：图像形成装置
公开(公告)号：US06493521B2
公开(公告)日：2002-12-10
申请号：US09778894
申请日：2001-02-08
申请人： Toshio Miyamoto , Hiroto Hasegawa , Satoru Izawa , Masahiko Suzumi
发明人： Toshio Miyamoto , Hiroto Hasegawa , Satoru Izawa , Masahiko Suzumi
IPC分类号： G03G1500
CPC分类号： G03G15/205
摘要： An object of the present invention is to provide an image forming apparatus having a fixing device, which can obtain good fixing ability while preventing occurrence of hot offset. The present invention provides an image forming apparatus that has image forming means for forming an image on a recording material, a heating member for heating the image on the recording material, a backup roller forming a nip with the heating member, a temperature detecting element for detecting a temperature of an atmosphere, and control means for controlling a power supply to the heating member, wherein when a print signal is inputted, the control means controls power supply (electrical communication) to the heating member in such a manner that the heating member maintains a set temperature in accordance with a detection temperature of the temperature detecting element, and, thereafter, a fixing operation is effected.
摘要翻译：本发明的目的是提供一种具有定影装置的图像形成装置，其能够在防止热偏移的发生的同时获得良好的定影能力。本发明提供了一种图像形成装置，其具有用于在记录材料上形成图像的图像形成装置，用于加热记录材料上的图像的加热构件，与加热构件形成夹持的支撑辊，用于检测大气的温度，以及控制装置，用于控制对加热构件的供电，其中当输入打印信号时，控制装置以加热构件的方式控制对加热构件的电力供应（电通信）根据温度检测元件的检测温度保持设定温度，然后进行定影操作。

79. 发明授权

US6115563A Image fixing apparatus 有权
标题翻译：图像定影装置
公开(公告)号：US6115563A
公开(公告)日：2000-09-05
申请号：US184847
申请日：1998-11-03
申请人： Toshio Miyamoto
发明人： Toshio Miyamoto
IPC分类号： G03G15/20 , H05B1/00
CPC分类号： G03G15/2046 , G03G15/2003 , G03G15/2039 , G03G15/6594 , G03G2215/00514 , G03G2215/2035
摘要： The present invention provides an image fixing apparatus which comprises a heater for generating heat upon receiving electric power supply thereto, a film movable with an unfixed image on a recording material while being in contact with said heater, a backup roller for forming a nip with said heater, with said film being interposed in the nip, and fixing condition setting means for setting an image fixing condition according to a size of the recording material conveyed to the nip in a preceding image fixing operation and a size of the recording material conveyed to the nip in the current image fixing operation.
摘要翻译：本发明提供了一种图像定影装置，其包括：加热器，用于在接收电源时产生热量，可在与所述加热器接触的同时在记录材料上以未定影图像移动的胶片，用于与所述加热器形成辊隙的支撑辊加热器，其中所述胶片插入辊隙中;以及固定条件设置装置，用于根据在先前图像定影操作中传送到辊隙的记录材料的尺寸设置图像定影条件，并将记录材料的尺寸传送到在当前图像定影操作中。

80. 发明授权

US5862435A Image forming apparatus 失效
标题翻译：图像形成装置
公开(公告)号：US5862435A
公开(公告)日：1999-01-19
申请号：US7190
申请日：1998-01-15
申请人： Masahiko Suzumi , Toshio Miyamoto , Satoru Izawa
发明人： Masahiko Suzumi , Toshio Miyamoto , Satoru Izawa
IPC分类号： G03G15/20 , G03G15/00
CPC分类号： G03G15/6552 , G03G2215/00421
摘要： An image forming apparatus comprises a fusing device for heating and fixing an unfixed image on a recording material while feeding the recording material, reversing device for reversing the recording material after passing the fusing device. The image forming apparatus operates in a first mode in which the recording material which passed the fusing device is ejected to an ejection section directly without being reversed, and a second mode in which the recording material which passed said fusing device is ejected to an ejection section after being reversed by the reversing device. A throughput of the recording material fed and/or the fusing temperature of the fusing device in the first mode being smaller or lower during at least part of an image forming process than in the second mode. With this image forming apparatus, the recording materials can be stacked in the ejection portion with improved quality and an excessive rise of temperature in the vicinity of the ejection portion can be avoided.
摘要翻译：图像形成装置包括：熔融装置，用于在馈送记录材料的同时在记录材料上加热和固定未固定的图像，并在通过定影装置之后使记录材料反转的反转装置。图像形成装置以第一模式操作，其中通过定影装置的记录材料被直接喷射到喷射部分而不被反转，并且第二模式将通过所述定影装置的记录材料喷射到喷射部分在被倒车装置反转之后。在图像形成处理的至少一部分中，与第二模式相比，馈送的记录材料的吞吐量和/或定影装置在第一模式中的熔化温度较小或更低。利用该图像形成装置，能够以提高的质量将记录材料堆叠在喷射部中，并且可以避免喷射部附近的温度的过度上升。

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