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    • 74. 发明授权
    • Allocating processing units to processing clusters to generate simulated diffraction signals
    • 将处理单元分配到处理簇以产生模拟衍射信号
    • US07765076B2
    • 2010-07-27
    • US11525793
    • 2006-09-22
    • Hemalatha ErvaHong QiuJunwei BaoVi Vuong
    • Hemalatha ErvaHong QiuJunwei BaoVi Vuong
    • G01N37/00
    • G06F9/505
    • In allocating processing units, first and second requests for jobs are obtained. First and second numbers of processing units requested are determined. First and second numbers of available processing units are determined. When the first number of available processing units is non-zero, the first number of available number of processing units or the first number of processing units requested is assigned to a first processing cluster. A first processing unit in the first processing cluster is designated as a master node. When the second number of available processing units is non-zero, the second number of available number of processing units or the second number of processing units requested is assigned to a second processing cluster. The first processing unit in the second processing cluster is designated as a slave node. The first and second jobs are assigned to the first and second processing clusters, respectively.
    • 在分配处理单元时,获得第一和第二个作业请求。 确定请求的第一和第二数量的处理单元。 确定可用处理单元的第一和第二数量。 当第一数量的可用处理单元不为零时,将第一数量的可用处理单元数量或所请求的第一数量的处理单元分配给第一处理簇。 第一处理簇中的第一处理单元被指定为主节点。 当第二数量的可用处理单元是非零时,将第二数量的可用数量的处理单元或第二数量的处理单元分配给第二处理簇。 第二处理簇中的第一处理单元被指定为从节点。 第一和第二作业分别分配给第一和第二处理簇。
    • 77. 发明授权
    • Parallel profile determination for an optical metrology system
    • 光学测量系统的平行轮廓确定
    • US07469192B2
    • 2008-12-23
    • US11485046
    • 2006-07-11
    • Tri Thanh KhuongJunwei BaoJeffrey A. ChardWei LiuYing ZhuSachin DeshpandePranav ShethHong Qiu
    • Tri Thanh KhuongJunwei BaoJeffrey A. ChardWei LiuYing ZhuSachin DeshpandePranav ShethHong Qiu
    • G06F19/00G01B11/00
    • G01B11/24G01N21/4788G01N21/95607G01N2021/95615G03F7/70625
    • A system to process requests for wafer structure profile determination from optical metrology measurements off a plurality of structures formed on one or more wafer includes a diffraction signal processor, a diffraction signal distributor, and a plurality of profile search servers. The diffraction signal processor is configured to obtain a plurality of measured diffraction signals of the plurality of structures. The diffraction signal distributor is coupled to the diffraction signal processor. The diffraction signal processor is configured to transmit the plurality of measured diffraction signals to the diffraction signal distributor. The plurality of profile search servers is coupled to the diffraction signal distributor. The diffraction signal distributor is configured to distribute the plurality of measured diffraction signals to the plurality of profile search servers. The profile search servers are configured to process in parallel the plurality of measured diffraction signals to determine profiles of the plurality of structures corresponding to the plurality of measured diffraction signals.
    • 包括衍射信号处理器,衍射信号分配器和多个轮廓搜索服务器,用于处理从一个或多个晶片上形成的多个结构的光学测量测量的晶圆结构轮廓确定的请求的系统。 衍射信号处理器被配置为获得多个结构的多个测量的衍射信号。 衍射信号分配器耦合到衍射信号处理器。 衍射信号处理器被配置为将多个测量的衍射信号传输到衍射信号分配器。 多个轮廓搜索服务器耦合到衍射信号分配器。 衍射信号分配器被配置为将多个测量的衍射信号分布到多个简档搜索服务器。 轮廓搜索服务器被配置为并行处理多个测量的衍射信号,以确定与多个测量的衍射信号相对应的多个结构的轮廓。
    • 78. 发明授权
    • Consecutive measurement of structures formed on a semiconductor wafer using an angle-resolved spectroscopic scatterometer
    • 使用角度分辨光谱散射仪连续测量在半导体晶片上形成的结构
    • US07417750B2
    • 2008-08-26
    • US11594659
    • 2006-11-07
    • Vi VuongJunwei BaoManuel Madriaga
    • Vi VuongJunwei BaoManuel Madriaga
    • G01B11/04G01B15/00G01N21/88
    • G01N21/4788G01N21/95607G01N2021/8416G01N2021/95615
    • Structures formed on a semiconductor wafer are consecutively measured by obtaining first and second measured diffraction signals of a first structure and a second structure formed abutting the first structure. The first and second measured diffraction signals were consecutively measured using an angle-resolved spectroscopic scatterometer. The first measured diffraction signal is compared to a first simulated diffraction signal generated using a profile model of the first structure. The profile model has profile parameters, characterize geometries of the first structure, and an azimuth angle parameter, which define the angle between the plane of incidence beam and direction of periodicity of the first or second structure. One or more features of the first structure are determined based on the comparison. The second measured diffraction signal is compared to a second simulated diffraction signal generated using the same profile model as the first simulated diffraction signal with the azimuth angle parameter having a value that is about 90 degrees different than the value of the azimuth angle parameter used to generate the first simulated diffraction signal. One or more features of the second structure are determined based on the comparison of the second measured diffraction signal to the second simulated diffraction signal.
    • 通过获得与第一结构邻接形成的第一结构和第二结构的第一和第二测量的衍射信号,连续测量形成在半导体晶片上的结构。 使用角度分辨光谱散射仪连续测量第一和第二测量的衍射信号。 将第一测量的衍射信号与使用第一结构的轮廓模型产生的第一模拟衍射信号进行比较。 轮廓模型具有轮廓参数,表征第一结构的几何形状和方位角参数,其定义入射光束与第一或第二结构的周期性方向之间的角度。 基于比较确定第一结构的一个或多个特征。 将第二测量的衍射信号与使用与第一模拟衍射信号相同的轮廓模型生成的第二模拟衍射信号进行比较,其中方位角参数具有与用于产生的方位角参数的值不同的约90度的值 第一个模拟衍射信号。 基于第二测量衍射信号与第二模拟衍射信号的比较来确定第二结构的一个或多个特征。
    • 79. 发明申请
    • Automated process control using optical metrology and a correlation between profile models and key profile shape variables
    • 使用光学测量的自动过程控制以及轮廓模型和关键轮廓形状变量之间的相关性
    • US20080170241A1
    • 2008-07-17
    • US11653061
    • 2007-01-12
    • Jeffrey ChardJunwei BaoManuel Madriaga
    • Jeffrey ChardJunwei BaoManuel Madriaga
    • G01B11/14
    • H01L22/12G03F7/70625H01L2924/0002H01L2924/00
    • A process step in fabricating a structure on a wafer in a wafer application having one or more process steps and one or more process parameters is controlled by determining a correlation between a set of profile models and one or more key profile shape variables. Each profile model is defined using a set of profile parameters to characterize the shape of the structure. Different sets of profile parameters define the profile models in the set. The one or more key profile shape variables include one or more profile parameters or one or more process parameters. One profile model is selected from the set of profile models based on the correlation and a value of at least one key profile shape variable of the process of the wafer application to be used in fabricating the structure. The structure is fabricated in a first fabrication process cluster using the process step and the value of the at least one key profile shape variable. A measured diffraction signal is obtained off the structure. One or more profile parameters of the structure are determined based on the measured diffraction signal and the selected profile model. The one or more determined profile parameters are transmitted to the first fabrication process cluster or a second fabrication process cluster.
    • 通过确定一组轮廓模型和一个或多个关键轮廓形状变量之间的相关性来控制在具有一个或多个处理步骤和一个或多个处理参数的晶片应用中制造晶片上的结构的工艺步骤。 使用一组轮廓参数来定义每个轮廓模型以表征结构的形状。 不同的配置参数集定义集合中的配置文件模型。 一个或多个关键轮廓形状变量包括一个或多个轮廓参数或一个或多个过程参数。 基于相关性和用于制造结构的晶片应用的处理的至少一个关键轮廓形状变量的值,从该组轮廓模型中选择一个轮廓模型。 该结构在第一制造工艺组中使用工艺步骤和至少一个关键型材形状变量的值来制造。 从该结构获得测量的衍射信号。 基于所测量的衍射信号和选择的轮廓模型来确定结构的一个或多个轮廓参数。 一个或多个确定的轮廓参数被传送到第一制造过程集群或第二制造过程集群。