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71. 发明申请

US20050202999A1 Multiple use fabric conditioning block with indentations 有权
标题翻译：多用织物调节块与压痕
公开(公告)号：US20050202999A1
公开(公告)日：2005-09-15
申请号：US11059200
申请日：2005-02-16
申请人： Rick Woo , Toan Trinh , Charles Hardy , Kurt Karussi , Samuel Morris , Lawrence Schumacher , John Smith , Jacqueline Duderstadt
发明人： Rick Woo , Toan Trinh , Charles Hardy , Kurt Karussi , Samuel Morris , Lawrence Schumacher , John Smith , Jacqueline Duderstadt
IPC分类号： C11D1/62 , C11D3/00 , C11D3/37 , C11D3/50 , C11D17/00 , C11D17/04 , D06F29/00 , D06F58/20 , D06L1/00 , D06M13/00
CPC分类号： D06F58/203 , C11D1/62 , C11D3/001 , C11D3/502 , C11D3/505 , C11D3/507 , C11D17/041 , C11D17/047
摘要： Multiple use fabric conditioning blocks comprising indentations and/or protrusions are useful for conditioning fabric.
摘要翻译：包括凹痕和/或突起的多用织物调理块可用于调理织物。

72. 发明申请

US20050196524A1 Apparatuses and methods for forming assemblies 有权
标题翻译：用于形成组件的装置和方法
公开(公告)号：US20050196524A1
公开(公告)日：2005-09-08
申请号：US11046651
申请日：2005-01-28
申请人： Jeffrey Jacobsen , John Smith , Mark Hadley
发明人： Jeffrey Jacobsen , John Smith , Mark Hadley
IPC分类号： G02F1/1333 , G02F1/1343 , G02F1/1362 , H01L21/77 , H01L21/84 , H01L21/98 , H01L25/075 , H01L31/0304 , H01L31/103 , H01L31/109 , B05D5/12 , B05D5/06
CPC分类号： H01L27/1214 , G02F1/133305 , G02F1/1362 , H01L24/24 , H01L24/82 , H01L24/95 , H01L24/97 , H01L25/0753 , H01L25/50 , H01L29/0657 , H01L2224/24101 , H01L2224/24137 , H01L2224/24227 , H01L2224/76155 , H01L2224/7665 , H01L2224/82102 , H01L2224/95085 , H01L2224/95145 , H01L2224/97 , H01L2251/5338 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01079 , H01L2924/10158 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/15153 , H01L2924/15155 , H01L2924/15165 , H01L2924/19041 , H01L2924/30105 , H01S5/0201 , H01L2224/82 , H01L2924/00
摘要： Apparatuses and methods for forming displays are claimed. One embodiment of the invention relates to forming a flexible active matrix display along a length of flexible substrate. Another embodiment of the invention relates to forming multiple flexible displays along a continuous flexible substrate. Another embodiment of the invention relates to forming a flexible display along a flexible reflective substrate. Another embodiment of the invention relates to using FSA generally with a flexible web process material. Another embodiment of the invention relates to using FSA and a deterministic method such as “pick and place” to place objects onto a rigid substrate or onto a web process material. Another embodiment of the invention relates to using web processing to deposit and/or pattern display material through an in-line process.
摘要翻译：要求保护用于形成显示器的装置和方法。本发明的一个实施例涉及沿柔性基底的长度形成柔性有源矩阵显示器。本发明的另一个实施例涉及沿着连续柔性基底形成多个柔性显示器。本发明的另一个实施例涉及沿柔性反射衬底形成柔性显示器。本发明的另一个实施方案涉及一般使用FSA柔性网状物料的FSA。本发明的另一个实施例涉及使用FSA和诸如“拾取和放置”的确定性方法将物体放置在刚性基底上或网状加工材料上。本发明的另一个实施例涉及使用网络处理来通过在线处理来沉积和/或图案显示材料。

73. 发明申请

US20050133900A1 Microelectronic assemblies with composite conductive elements 审中-公开
公开(公告)号：US20050133900A1
公开(公告)日：2005-06-23
申请号：US11047542
申请日：2005-01-31
申请人： John Smith
发明人： John Smith
IPC分类号： H01L21/56 , H01L23/498 , H05K1/14 , H05K3/34 , H01L23/48
CPC分类号： H01L24/16 , H01L21/563 , H01L23/49816 , H01L24/81 , H01L2224/05568 , H01L2224/05573 , H01L2224/13099 , H01L2224/16238 , H01L2224/73203 , H01L2224/812 , H01L2224/81801 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01049 , H01L2924/01082 , H01L2924/014 , H01L2924/3011 , H05K1/0271 , H05K1/141 , H05K1/147 , H05K1/189 , H05K3/3436 , H05K2201/0133 , H05K2201/10234 , H05K2201/10378 , H05K2201/10977 , H05K2203/128 , Y02P70/613 , H01L2224/29099 , H01L2224/05599
摘要： A microelectronic assembly includes composite conductive elements, each incorporating a core and a coating of a low-melting conductive material. The composite conductive elements interconnect microelectronic elements. At the normal operating temperature of the assembly, the low-melting conductive material melts, allowing the cores and microelectronic elements to move relative to one another and relieve thermally-induced stress.

74. 发明申请

US20050046018A1 Electronic devices with small functional elements supported on a carrier 有权
标题翻译：载体上支持小功能元件的电子设备
公开(公告)号：US20050046018A1
公开(公告)日：2005-03-03
申请号：US10966617
申请日：2004-10-14
申请人： Jeffrey Jacobsen , Glenn Gengel , Mark Hadley , Gordon Craig , John Smith
发明人： Jeffrey Jacobsen , Glenn Gengel , Mark Hadley , Gordon Craig , John Smith
IPC分类号： G02F1/1345 , G09F9/00 , G09F9/30 , G09F9/35 , H01L21/02 , H01L21/336 , H01L21/98 , H01L23/538 , H01L27/12 , H01L27/32 , H01L29/786 , H01L33/00 , H01L51/50 , H05B33/02 , H01L27/00 , H01L21/70
CPC分类号： H01L24/95 , H01L23/5387 , H01L23/5389 , H01L24/18 , H01L24/50 , H01L24/82 , H01L24/97 , H01L25/50 , H01L2224/18 , H01L2224/76155 , H01L2224/7665 , H01L2224/82102 , H01L2224/95085 , H01L2224/95136 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01079 , H01L2924/01084 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/1461 , H01L2924/15153 , H01L2924/15155 , H01L2924/15165 , H01L2924/19041 , H01L2924/30105 , Y10S428/901 , Y10T428/24802 , Y10T428/24917 , Y10T428/24926 , Y10T428/31681 , H01L2224/82 , H01L2924/00
摘要： Apparatuses and methods for forming displays are claimed. One embodiment of the invention relates to depositing a plurality of blocks onto a substrate and is coupled to a flexible layer having interconnect deposited thereon. Another embodiment of the invention relates to forming a display along a length of a flexible layer wherein a slurry containing a plurality of elements with circuit elements thereon washes over the flexible layer and slides into recessed regions or holes found in the flexible layer. Interconnect is then deposited thereon. In another embodiment, interconnect is placed on the flexible layer followed by a slurry containing a plurality of elements.
摘要翻译：要求保护用于形成显示器的装置和方法。本发明的一个实施例涉及将多个块沉积到衬底上并且耦合到其上沉积有互连的柔性层。本发明的另一个实施方案涉及沿着柔性层的长度形成显示器，其中包含多个元件的浆料在其上洗涤在柔性层上并且滑动到柔性层中发现的凹陷区域或孔中。然后在其上沉积互连。在另一个实施例中，互连被放置在柔性层上，随后是含有多个元件的浆料。

75. 发明申请

US20050035041A1 Hollow fiber membrane filters in various containers 审中-公开
标题翻译：中空纤维膜过滤器在各种容器中
公开(公告)号：US20050035041A1
公开(公告)日：2005-02-17
申请号：US10486346
申请日：2002-08-12
申请人： John Nohren , Bradley Mierau , John Smith
发明人： John Nohren , Bradley Mierau , John Smith
IPC分类号： A45F3/16 , B01D61/18 , B01D61/20 , B01D63/02 , C02F1/00 , C02F1/28 , C02F1/44 , C02F1/50 , C02F1/68 , C02F1/76
CPC分类号： C02F1/441 , A45F3/16 , A45F2003/163 , B01D61/18 , B01D61/20 , B01D63/02 , B01D63/024 , B01D2313/02 , B01D2313/10 , B01D2313/16 , B01D2313/20 , B01D2313/40 , B01D2313/44 , B01D2313/48 , B01D2313/50 , B01D2321/16 , C02F1/002 , C02F1/283 , C02F1/444 , C02F1/50 , C02F1/686 , C02F1/76 , C02F2201/006 , C02F2303/185 , C02F2307/02
摘要： A water filter cooperable with a water container includes both a carbon composite filter (30) and a bundle of micro porous hollow fiber membranes (5) in fluid communication with the carbon composite filter (30). An influent side of the hollow fiber membrane (5) is continuously immersed in water whereby air is prevented from being reintroduced to the hollow fiber membrane (5).
摘要翻译：与水容器配合的滤水器包括碳复合过滤器（30）和与碳复合过滤器（30）流体连通的微孔中空纤维膜束（5）。将中空纤维膜（5）的流入侧连续浸入水中，防止空气再次引入中空纤维膜（5）。

76. 发明申请

US20050025897A1 Kinetic spray application of coatings onto covered materials 有权
标题翻译：涂料在覆盖材料上的动力喷雾应用
公开(公告)号：US20050025897A1
公开(公告)日：2005-02-03
申请号：US10812861
申请日：2004-03-30
申请人： Thomas Van Steenkiste , Daniel Gorkiewicz , John Smith , Martin Stier , George Drew
发明人： Thomas Van Steenkiste , Daniel Gorkiewicz , John Smith , Martin Stier , George Drew
IPC分类号： C23C24/04 , H05K1/11 , H05K3/10 , H05K3/24 , H05K3/28 , H05H1/26
CPC分类号： H05K3/24 , C23C24/04 , H05K1/118 , H05K3/102 , H05K3/28 , H05K2203/1189 , H05K2203/1344
摘要： Disclosed is a process for applying a kinetic spray coating of powder particles onto a substrate covered in a plastic-type material without first removing the plastic-type material. In one use of the process a mask is used to enable a single kinetic spray pass to both remove the plastic covering and bind particles having average nominal diameters of from 60 to 250 microns to the underlying substrate. In another use of the process the particles have an average nominal diameter of from 250 to 1400 microns and the use of a mask is optional because the particles can penetrate the plastic material and bind directly to the substrate. The process finds special use in forming electrical connections or solderable pads anywhere along the length of a flexible circuit.
摘要翻译：公开了一种将粉末颗粒的动态喷雾涂层施加到覆盖在塑料型材料中的基材上而不首先去除塑料型材料的方法。在该方法的一个使用中，使用掩模使得能够进行单次动力学喷雾通过，以去除塑料覆盖物并将平均标称直径为60至250微米的颗粒结合到下面的基底。在该方法的另一用途中，颗粒的平均公称直径为250至1400微米，并且掩模的使用是任选的，因为颗粒可以穿透塑料材料并直接结合到基底。该过程特别用于在柔性电路的长度上的任何地方形成电连接或可焊垫。

77. 发明授权

US06737265B2 Microelectronic unit forming methods and materials 失效
标题翻译：微电子单元成型方法和材料
公开(公告)号：US06737265B2
公开(公告)日：2004-05-18
申请号：US10242017
申请日：2002-09-12
申请人： Masud Beroz , Joseph Fjelstad , Belgacem Haba , Christopher M. Pickett , John Smith
发明人： Masud Beroz , Joseph Fjelstad , Belgacem Haba , Christopher M. Pickett , John Smith
IPC分类号： C12M100
CPC分类号： H01L24/02 , H01L2221/68359 , H01L2221/68381 , H01L2224/02313 , H01L2224/02319 , H01L2224/02331 , H01L2224/02333 , H01L2224/02335 , H01L2224/0235 , H01L2224/02377 , H01L2224/0401 , H01L2224/04042 , H01L2224/13024 , H01L2224/48091 , H01L2224/48245 , H01L2224/48247 , H01L2224/48472 , H01L2224/94 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/10253 , H01L2924/12042 , H01L2924/3011 , H01L2924/3025 , H01L2924/3511 , H01L2924/00015 , H01L2224/03 , H01L2924/00 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599
摘要： Releasable leads having an elongated fixed portion extend over a surface defined by a dielectric material of a component or by a semiconductor body. A semiconductor element having a conductive structure connected to a set of contacts is also disclosed. A method of making the conductive structure is disclosed.
摘要翻译：具有细长固定部分的可释放引线在由部件的介电材料或半导体本体限定的表面上延伸。还公开了具有连接到一组触点的导电结构的半导体元件。公开了制造导电结构的方法。

78. 外观设计

USD457917S1 Retractable pen 失效
标题翻译：伸缩笔
公开(公告)号：USD457917S1
公开(公告)日：2002-05-28
申请号：US29145571
申请日：2001-07-25
申请人： Conrad Stanley Traut , Charles Richard Lewis, Jr. , John Smith
设计人： Conrad Stanley Traut , Charles Richard Lewis, Jr. , John Smith

79. 发明授权

US06361959B1 Microelectronic unit forming methods and materials 有权
标题翻译：微电子单元成型方法和材料
公开(公告)号：US06361959B1
公开(公告)日：2002-03-26
申请号：US09317675
申请日：1999-05-24
申请人： Masud Beroz , Joseph Fjelstad , Belgacem Haba , Christopher M. Pickett , John Smith
发明人： Masud Beroz , Joseph Fjelstad , Belgacem Haba , Christopher M. Pickett , John Smith
IPC分类号： C12Q154
CPC分类号： C12Q1/00 , C12Q1/54 , H01L2224/48091 , H01L2224/48227 , H01L2924/01039 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/10253 , H01L2924/3011 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： Electrically conductive elements such as terminals and leads are held on a support structure by a degradable connecting layer such as a adhesive degradable by heat or radiant energy. After connecting these elements to a microelectronic element such as a chip or wafer, the conductive elements are released from the support structure by degrading the connecting layer. The support structure desirably has a predictable, isotropic coefficient of thermal expansion and such coefficient of thermal expansion may be close to that of silicon to minimize the effect of the temperature changes. The conductive elements may be mounted on a plurality of individual tiles rather than on an unitary sheet covering an entire wafer to minimize dimensional changes when the dielectric is released from the support structure.
摘要翻译：诸如端子和引线的导电元件通过可降解的连接层（例如通过热或辐射能降解的粘合剂）保持在支撑结构上。在将这些元件连接到诸如芯片或晶片的微电子元件之后，通过降低连接层而将导电元件从支撑结构释放。支撑结构理想地具有可预测的各向同性热膨胀系数，并且这种热膨胀系数可能接近于硅的热膨胀系数以最小化温度变化的影响。导电元件可以安装在多个单独的瓦片上，而不是在覆盖整个晶片的整体片材上安装，以便当电介质从支撑结构释放时最小化尺寸变化。

80. 发明授权

US4745595A Distributed electronic mailbox system 失效
标题翻译：分布式电子邮箱系统
公开(公告)号：US4745595A
公开(公告)日：1988-05-17
申请号：US877774
申请日：1986-06-24
申请人： Leslie Muir , John Smith , Andrew McKechnie
发明人： Leslie Muir , John Smith , Andrew McKechnie
IPC分类号： H04L12/58 , H04J3/02 , H04J3/16
CPC分类号： H04L12/58 , H04L51/28 , H04L51/30
摘要： The disclosure describes an electronic mailbox system in which a plurality of like data terminals are provided coupled to a common message carrying facility such as a telephone line wherein any terminal is capable at any selected time of being designated a controlling terminal; and further, wherein any terminal may either transmit or receive messages from any other terminal in the system. The system of the present disclosure is characterized by its ability to maintain effective communication among the terminals despite the occasional or intermittent linking of the terminals into the system. Thus, if a terminal is destined to receive a message but is not on-line or for any other reason does not receive the transmitted message, the system will continue to present the message from time to time until it is received by the destined terminal.
摘要翻译：本公开描述了一种电子邮箱系统，其中提供了多个相似的数据终端，其耦合到诸如电话线的公共消息传送设施，其中任何终端在任何选定的时间被指定为控制终端; 并且此外，其中任何终端可以从系统中的任何其他终端发送或接收消息。本公开的系统的特征在于，尽管终端偶尔地或间歇地连接到系统中，但是能够在终端之间保持有效的通信。因此，如果终端注定要接收消息但不在线，或者由于任何其他原因不接收所发送的消息，则系统将不时地显示消息，直到由目的终端接收到。

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