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71. 发明授权

US06940712B2 Electronic device substrate assembly with multilayer impermeable barrier and method of making 有权
标题翻译：具有多层不渗透屏障的电子器件基板组件及其制造方法
公开(公告)号：US06940712B2
公开(公告)日：2005-09-06
申请号：US10197661
申请日：2002-07-17
申请人： Richard C. Chu , Michael J. Ellsworth, Jr. , Robert E. Simons , Prabjit Singh , Paul A. Zucco
发明人： Richard C. Chu , Michael J. Ellsworth, Jr. , Robert E. Simons , Prabjit Singh , Paul A. Zucco
IPC分类号： H01L23/00 , H01L23/31 , H01L23/42 , H01L23/433 , H01L23/473 , H05K7/20
CPC分类号： H01L23/564 , H01L23/3121 , H01L23/42 , H01L23/4334 , H01L23/4338 , H01L23/473 , H01L2224/16 , H01L2224/73253 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/15312 , H01L2924/16152 , H01L2224/0401
摘要： An electronic module, substrate assembly, and fabrication method, the assembly providing thermal conduction between an electronic device to be cooled and an aqueous coolant, while maintaining physical separation between the coolant and electronic device. The assembly includes a substrate, one or more electronic devices to be cooled, and a multilayer, impermeable barrier. The multilayer barrier includes a first layer, providing mechanical support for a second layer. The second, thinner layer provides an impermeable barrier, and a high effective thermal conductivity path between an electronic device and a cooling fluid in contact with an upper surface of the second barrier layer. Mechanical stresses are minimized by appropriate material selection for the first layer, and a thin second layer. When incorporated into an electronic module assembly including a module cap, the substrate assembly provides physical separation between a cooling fluid introduced into the module cap, and both the substrate and electronic devices.
摘要翻译：电子模块，基板组件和制造方法，该组件在要冷却的电子设备和水性冷却剂之间提供热传导，同时保持冷却剂和电子设备之间的物理分离。组件包括基底，待冷却的一个或多个电子器件以及多层不可渗透的屏障。多层屏障包括第一层，为第二层提供机械支撑。第二较薄的层提供了不透水的屏障，以及电子器件与与第二阻挡层的上表面接触的冷却流体之间的高有效导热路径。通过对第一层的适当材料选择和薄的第二层来最小化机械应力。当结合到包括模块帽的电子模块组件中时，衬底组件提供了引入模块盖的冷却流体与衬底和电子设备两者之间的物理分离。

72. 发明授权

US06907917B2 Graphite-based heat sinks and method and apparatus for the manufacture thereof 失效
标题翻译：石墨基散热器及其制造方法和装置
公开(公告)号：US06907917B2
公开(公告)日：2005-06-21
申请号：US10340445
申请日：2003-01-10
申请人： Richard C. Chu , Michael J. Ellsworth, Jr. , Egidio Marotta , Prabjit Singh
发明人： Richard C. Chu , Michael J. Ellsworth, Jr. , Egidio Marotta , Prabjit Singh
IPC分类号： F28F3/02 , F28F21/02 , H01L23/367 , H01L23/373 , H05K7/20
CPC分类号： H01L23/373 , F28D2021/0029 , F28F3/02 , F28F21/02 , H01L23/3672 , H01L2924/0002 , Y10T29/4913 , Y10T29/49135 , Y10T29/49144 , H01L2924/00
摘要： One embodiment of a heat sink comprises a metal support member having a groove disposed at a surface thereof and a fin disposed at the groove. The fin comprises a graphite-based material having a metal-based coating disposed thereon, and the fin is retained at the groove via a soldered joint at the metal-based coating and the groove. Another exemplary embodiment of a heat sink comprises a plurality of fins alternatingly arranged with a plurality of spacers. A method of fabricating a heat sink comprises preparing a surface of a graphite-based substrate, removing particulate matter generated from the preparation of the surface of the substrate, applying a metal-based coating at the surface of the substrate, and arranging the substrate to form a heat sink structure. An apparatus for cladding fins of a heat sink with a protective material comprises a first chamber that facilitates the preparation of substrate surfaces, a grit-removing apparatus disposed adjacent to the first chamber, a second chamber that facilitates the application of the protective material to the substrate surfaces, and a transport device configured to facilitate the movement of the substrates through the first chamber, to the grit-removing apparatus, and through the second chamber.
摘要翻译：散热器的一个实施例包括具有设置在其表面处的凹槽的金属支撑构件和设置在凹槽处的翅片。翅片包括其上设置有金属基涂层的石墨基材料，并且翅片通过金属基涂层和凹槽处的焊接接头保持在凹槽处。散热器的另一示例性实施例包括交替布置有多个间隔件的多个翅片。一种散热器的制造方法，其特征在于，准备石墨系基板的表面，除去从基板的表面的制造产生的微粒，在基板的表面涂敷金属基涂层，将基板形成散热器结构。一种用保护材料包覆散热片的设备包括有助于制备衬底表面的第一室，与第一室邻接设置的除砂装置，有助于将保护材料施加到第二室的第二室衬底表面以及被配置为有助于衬底通过第一腔室移动到移砂装置和通过第二腔室的输送装置。

73. 发明授权

US06819563B1 Method and system for cooling electronics racks using pre-cooled air 有权
标题翻译：使用预冷空气冷却电子机柜的方法和系统
公开(公告)号：US06819563B1
公开(公告)日：2004-11-16
申请号：US10612355
申请日：2003-07-02
申请人： Richard C. Chu , Michael J. Ellsworth, Jr. , Roger R. Schmidt , Robert E. Simons
发明人： Richard C. Chu , Michael J. Ellsworth, Jr. , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K720
CPC分类号： H05K7/20736 , G11B33/1406 , H05K7/20727 , H05K7/20772
摘要： Augmenting air cooling of electronics systems using a cooling fluid to cool air entering the electronics system, and to remove a portion of the heat dissipated by the electronics. A cooled electronics system includes a frame, electronics drawers, fans or air moving devices, and an inlet heat exchanger. A cooling fluid such as chilled water is supplied to the inlet heat exchanger, to cool incoming air below ambient temperature. Fans cause ambient air to enter the system, flow through the inlet heat exchanger, through electronic devices, and exit the system. An optional exhaust heat exchanger further transfers heat dissipated by electronic devices to the cooling fluid. Heat exchangers are pivotally mounted, providing drawer access. Segmented heat exchangers provide access to individual drawers. Heat exchangers are integrated into cover assemblies. Airflow guides such as louvers are provided at inlets and outlets. Cover assemblies provide a degree of acoustic and electromagnetic shielding.
摘要翻译：使用冷却流体增强电子系统的空气冷却，以冷却进入电子系统的空气，以及去除由电子设备消散的部分热量。冷却的电子系统包括框架，电子抽屉，风扇或空气移动装置以及入口热交换器。冷却流体如冷冻水被供应到入口热交换器，以将进入的空气冷却到低于环境温度。风扇会导致环境空气进入系统，流经入口热交换器，通过电子设备，并退出系统。可选的排气热交换器进一步将由电子设备耗散的热量传递给冷却流体。热交换器枢转安装，提供抽屉通道。分段热交换器提供对各个抽屉的访问。热交换器集成到盖组件中。入口和出口设有气流导板，如百叶窗。盖组件提供一定程度的声和电磁屏蔽。

74. 发明授权

US06587336B2 Cooling system for portable electronic and computer devices 失效
标题翻译：便携式电子和计算机设备的冷却系统
公开(公告)号：US06587336B2
公开(公告)日：2003-07-01
申请号：US09893135
申请日：2001-06-27
申请人： Richard C. Chu , Michael J. Ellsworth, Jr. , Robert E. Simons
发明人： Richard C. Chu , Michael J. Ellsworth, Jr. , Robert E. Simons
IPC分类号： G06F120
CPC分类号： G06F1/203
摘要： A cooling system and method of fabrication are provided for cooling one or more heat-generating electronic elements within a portable computer. The cooling system includes a cold plate assembly thermally coupled to a heat-generating electronic element, and a heat exchange structure disposed within the cover of the portable computer. The heat exchange structure includes a hollow channel and an expansion chamber in fluid communication with the channel. A conduit carries coolant between the cold plate assembly and the hollow channel in the heat exchange structure, and a circulation pump circulates coolant through the conduit between the cold plate assembly and the heat exchange structure in a manner to remove heat from the heat-generating electronic component. The expansion chamber integrated within the heat exchange structure provides a reservoir for the circulation pump from which to draw coolant for circulation through the cold plate assembly.
摘要翻译：提供冷却系统和制造方法用于冷却便携式计算机内的一个或多个发热电子元件。冷却系统包括热耦合到发热电子元件的冷板组件和设置在便携式计算机的盖内的热交换结构。热交换结构包括与通道流体连通的中空通道和膨胀室。导管在冷板组件和热交换结构中的中空通道之间承载冷却剂，循环泵以冷却板组件和热交换结构之间的管道循环，以便从发热电子零件。集成在热交换结构内的膨胀室为循环泵提供一个储存器，从中抽出冷却剂以循环通过冷板组件。

75. 发明授权

US06489551B2 Electronic module with integrated thermoelectric cooling assembly 失效
标题翻译：具有集成热电冷却组件的电子模块
公开(公告)号：US06489551B2
公开(公告)日：2002-12-03
申请号：US09726900
申请日：2000-11-30
申请人： Richard C. Chu , Michael J. Ellsworth, Jr. , Robert E. Simons
发明人： Richard C. Chu , Michael J. Ellsworth, Jr. , Robert E. Simons
IPC分类号： H01L3502
CPC分类号： H01L23/38 , H01L2224/16225 , H01L2924/00014 , Y10S257/93 , H01L2224/0401
摘要： An electronic module is provided having an integrated thermoelectric cooling assembly disposed therein coupled to the module's electronic device. The thermoelectric assembly includes one or more thermoelectric stages and a thermal space transformer, for example, disposed between a first thermoelectric stage and a second thermoelectric stage. The electronic device is mounted to a substrate with the thermoelectric assembly disposed in thermal contact with the electronic device and a thermally conductive cap is positioned over the thermoelectric assembly, and is also in thermal contact with the thermoelectric assembly. Power to the thermoelectric assembly can be provided using electrically conductive springs disposed between one or more stages of the assembly and pads on an upper surface of the substrate, which electrically connect to power planes disposed within the substrate.
摘要翻译：提供了一个电子模块，其具有集成的热电冷却组件，其中耦合到模块的电子设备。热电组件包括一个或多个热电级和热空间变压器，例如设置在第一热电级和第二热电级之间。电子装置安装到基板上，其中热电组件设置成与电子装置热接触，并且导热盖位于热电组件上方，并且还与热电组件热接触。可以使用设置在组件的一个或多个阶段之间的导电弹簧和在衬底的上表面上的焊盘（其电连接到设置在衬底内的电源平面）来提供到热电组件的功率。

76. 发明授权

US06397618B1 Cooling system with auxiliary thermal buffer unit for cooling an electronics module 失效
标题翻译：具有辅助热缓冲单元的冷却系统用于冷却电子模块
公开(公告)号：US06397618B1
公开(公告)日：2002-06-04
申请号：US09867855
申请日：2001-05-30
申请人： Richard C. Chu , Michael J. Ellsworth, Jr. , Robert E. Simons
发明人： Richard C. Chu , Michael J. Ellsworth, Jr. , Robert E. Simons
IPC分类号： F25B2300
CPC分类号： H01L23/427 , F25B7/00 , F25B25/00 , F25B39/022 , F25B2400/06 , F25B2400/24 , F25B2500/06 , F28D15/0275 , F28D20/021 , F28F13/00 , H01L2924/0002 , H05K7/20354 , Y02E60/145 , H01L2924/00
摘要： A cooling system and method of fabrication are provided for cooling an electronics device. The cooling system includes a cooling unit and an evaporator plate having at least one isolated refrigerant loop therein for receiving coolant from the cooling unit. A thermal buffer unit having a phase change material therein is thermally coupled to the evaporator plate to maintain temperature of the evaporator plate within a predefined range for a period of time upon failure or shut down of the cooling unit. A thermal conductor structure, such as a metal foam structure and/or thermal transfer rods, is disposed within the thermal buffer unit to facilitate heat transfer between the phase change material and the evaporator plate.
摘要翻译：提供冷却系统和制造方法来冷却电子设备。冷却系统包括冷却单元和蒸发器板，其中具有至少一个隔离的制冷剂回路，用于从冷却单元接收冷却剂。其中具有相变材料的热缓冲单元热耦合到蒸发器板，以在冷却单元故障或关闭时将蒸发器板的温度保持在预定范围内一段时间。诸如金属泡沫结构和/或热转移棒的热导体结构设置在热缓冲单元内，以促进相变材料和蒸发器板之间的热传递。

77. 发明授权

US6035655A Modular refrigeration system 失效
标题翻译：模块化制冷系统
公开(公告)号：US6035655A
公开(公告)日：2000-03-14
申请号：US130358
申请日：1998-08-07
申请人： Jeffrey J. Hare , Willard S. Harris , Jody A. Hickey , Roger R. Schmidt , Edward J. Seminaro , Gregory M. Chrysler , Richard C. Chu , Gary F. Goth , Robert E. Simons
发明人： Jeffrey J. Hare , Willard S. Harris , Jody A. Hickey , Roger R. Schmidt , Edward J. Seminaro , Gregory M. Chrysler , Richard C. Chu , Gary F. Goth , Robert E. Simons
IPC分类号： F25B7/00 , F25B41/04 , F25B47/02 , F28F3/12 , H05K7/20 , F25B23/12
CPC分类号： H05K7/20354 , F25B7/00 , F28F3/12 , F25B2400/06 , F25B2400/075 , F25B2600/0253 , F25B41/04 , F25B47/022 , Y02B30/741
摘要： A d.c. motor together with a hot gas bypass valve is incorporated into a cooling system specifically designed for removing heat from computer systems. Unlike typical refrigeration systems, the cooling system herein runs continuously and responds to changes in thermal load. This allows the unit to operate within a wide range of ambient conditions and at various thermal load levels unlike other systems which were capable of operation only at a single, predesigned load level. The cooling system is modular and is easily added to or removed from a redundant system which includes a single evaporator with multiple refrigerant loops which provides yet another aspect of continuous operation due to the inherent redundancy thus provided.
摘要翻译：一个d.c. 电动机与热气旁通阀结合在专门设计用于从计算机系统中除去热量的冷却系统中。与典型的制冷系统不同，这里的冷却系统连续运行并响应热负荷的变化。这使得该单元能够在宽范围的环境条件和各种热负载水平下运行，而不同于仅能在单个预先设计的负载水平下运行的其他系统。冷却系统是模块化的，并且容易地添加到冗余系统中或从冗余系统中移除，该冗余系统包括具有多个制冷剂回路的单个蒸发器，由于提供的固有冗余，这提供了连续操作的另一方面。

78. 发明授权

US6034872A Cooling computer systems 失效
标题翻译：冷却计算机系统
公开(公告)号：US6034872A
公开(公告)日：2000-03-07
申请号：US976323
申请日：1997-11-21
申请人： Gregory M. Chrysler , Richard C. Chu , Gary F. Goth , Robert E. Simons
发明人： Gregory M. Chrysler , Richard C. Chu , Gary F. Goth , Robert E. Simons
IPC分类号： F25B5/02 , F25B41/04 , G06F1/20 , H05K7/20
CPC分类号： H05K7/20836 , F25B41/04 , G06F1/20 , F25B2400/0403 , F25B2400/06 , F25B2400/075 , F25B5/02 , G06F2200/201
摘要： A redundant refrigeration system is used in conjunction with a dual passage cold plate to provide reliable cooling for electronic circuit modules particularly to such modules which incorporate computer processors for which long term "up time" is very highly desirable. Separate compressor-expansion device-condenser refrigeration systems are coupled to a single cold plate which maintains flow-wise isolation between refrigerant streams while at the same time providing close thermal coupling.
摘要翻译：冗余制冷系统与双通道冷板结合使用，为电子电路模块提供可靠的冷却，特别是对于这样的模块，这些模块包括长期“上行时间”非常需要的计算机处理器。单独的压缩机 - 膨胀装置 - 冷凝器制冷系统联接到单个冷板，其保持制冷剂流之间的流动隔离，同时提供紧密的热耦合。

79. 发明授权

US5604665A Multiple parallel impingement flow cooling with tuning 失效
标题翻译：多次平行冲击流冷却带调谐
公开(公告)号：US5604665A
公开(公告)日：1997-02-18
申请号：US497579
申请日：1995-06-30
申请人： Gregory M. Chrysler , Richard C. Chu , Richard M. Koenig
发明人： Gregory M. Chrysler , Richard C. Chu , Richard M. Koenig
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , H01L2924/0002 , Y10S165/908
摘要： An integrated coolant fluid supply and exhaust distribution pathdefining structure is employed to provide a substantially planar cooling system for an electronic assembly which includes a substrate having electronic modules or electronic chips disposed thereon. The pathdefining structure includes interleaved supply and exhaust channels with the supply channels including apertures disposed adjacent to heat sink shafts which are connected to planar heat sink structures in thermal contact with chips or modules being cooled. The pathdefining structure produces a fluid flow path which is initially aligned with the surface area enhancing heat sink shafts and which exits therefrom in a plurality of directions which ultimately lead to the exhaust channels provided in the path-defining structure. The assembly, which includes an exterior housing and the substrate, provides a compact cooling mechanism for electronic components. The cooling structure is both compact and permits high density placement of electronic chips or modules. The system is particularly adaptable in that it permits fine tuning of fluid flow to various ones of the chips or modules and stacking of the assemblies themselves.
摘要翻译：使用集成的冷却剂流体供应和排放分配路径定义结构来为电子组件提供基本上平面的冷却系统，该电子组件包括具有设置在其上的电子模块或电子芯片的基板。路径定义结构包括交错的供应和排出通道，其中供应通道包括邻近散热器轴设置的孔，该散热器轴连接到与被冷却的芯片或模块热接触的平面散热器结构。路径定义结构产生流体流动路径，该流体流动路径最初与表面积增强的散热器轴对齐，并且在多个方向上离开其，最终导致设置在路径限定结构中的排气通道。包括外壳和基板的组件为电子部件提供了紧凑的冷却机构。冷却结构紧凑，允许电子芯片或模块的高密度放置。该系统特别适用于允许将流体流微调到各种芯片或模块以及组件本身的堆叠。

80. 发明授权

US5394299A Topology matched conduction cooling module 失效
标题翻译：拓扑匹配传导冷却模块
公开(公告)号：US5394299A
公开(公告)日：1995-02-28
申请号：US242658
申请日：1994-05-13
申请人： Richard C. Chu , Michael J. Ellsworth, Jr. , Robert E. Simons , David T. Vader
发明人： Richard C. Chu , Michael J. Ellsworth, Jr. , Robert E. Simons , David T. Vader
IPC分类号： H01L23/36 , H01L23/433 , H01L23/473 , H05K7/20
CPC分类号： H01L23/4735 , H01L23/4338 , H01L2224/16
摘要： The pistons of a cold plate frame orient themselves as a result of being free to move along one axis and about two other axes by the reflowing of solder tinning on the external surfaces of the pistons and the walls of the recesses within which the pistons reside. As the pistons are permitted to move freely under a biasing force during the solder reflow the face of the piston will engage with the top surface of an electronic chip against which the piston is engaged. The cooling of the solder after reflow will freeze the position and orientation of the piston to that of the electronic chip and will permit enhanced cooling. The cold plate may be disassembled from and reassembled with the components of the cooling system and the electronic chips while maintaining significantly enhanced cooling capabilities.
摘要翻译：冷板框架的活塞由于通过在活塞的外表面和活塞所在的凹槽的壁上的焊锡镀层的回流而沿着一个轴线和约两个其它轴线自由移动。当在回流焊接期间允许活塞在偏压力下自由移动时，活塞的表面将与活塞接合的电子芯片的顶表面接合。在回流焊后冷却焊料将使活塞的位置和方向冻结到电子芯片的位置和方位，并且将允许增强冷却。冷却板可以与冷却系统和电子芯片的组件分离并重新组装，同时保持显着增强的冷却能力。

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