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1. 发明授权

US5604665A Multiple parallel impingement flow cooling with tuning 失效
标题翻译：多次平行冲击流冷却带调谐
公开(公告)号：US5604665A
公开(公告)日：1997-02-18
申请号：US497579
申请日：1995-06-30
申请人： Gregory M. Chrysler , Richard C. Chu , Richard M. Koenig
发明人： Gregory M. Chrysler , Richard C. Chu , Richard M. Koenig
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , H01L2924/0002 , Y10S165/908
摘要： An integrated coolant fluid supply and exhaust distribution pathdefining structure is employed to provide a substantially planar cooling system for an electronic assembly which includes a substrate having electronic modules or electronic chips disposed thereon. The pathdefining structure includes interleaved supply and exhaust channels with the supply channels including apertures disposed adjacent to heat sink shafts which are connected to planar heat sink structures in thermal contact with chips or modules being cooled. The pathdefining structure produces a fluid flow path which is initially aligned with the surface area enhancing heat sink shafts and which exits therefrom in a plurality of directions which ultimately lead to the exhaust channels provided in the path-defining structure. The assembly, which includes an exterior housing and the substrate, provides a compact cooling mechanism for electronic components. The cooling structure is both compact and permits high density placement of electronic chips or modules. The system is particularly adaptable in that it permits fine tuning of fluid flow to various ones of the chips or modules and stacking of the assemblies themselves.
摘要翻译：使用集成的冷却剂流体供应和排放分配路径定义结构来为电子组件提供基本上平面的冷却系统，该电子组件包括具有设置在其上的电子模块或电子芯片的基板。路径定义结构包括交错的供应和排出通道，其中供应通道包括邻近散热器轴设置的孔，该散热器轴连接到与被冷却的芯片或模块热接触的平面散热器结构。路径定义结构产生流体流动路径，该流体流动路径最初与表面积增强的散热器轴对齐，并且在多个方向上离开其，最终导致设置在路径限定结构中的排气通道。包括外壳和基板的组件为电子部件提供了紧凑的冷却机构。冷却结构紧凑，允许电子芯片或模块的高密度放置。该系统特别适用于允许将流体流微调到各种芯片或模块以及组件本身的堆叠。

2. 发明授权

US06213194B1 Hybrid cooling system for electronics module 有权
标题翻译：电子模块混合冷却系统
公开(公告)号：US06213194B1
公开(公告)日：2001-04-10
申请号：US09338254
申请日：1999-06-22
申请人： Gregory M. Chrysler , Richard C. Chu
发明人： Gregory M. Chrysler , Richard C. Chu
IPC分类号： F28F700
CPC分类号： H05K7/20354 , F25B39/024 , F25B41/04 , F25B47/022 , F25B2400/06 , F25B2400/075 , F25B2500/06 , F25B2600/0253 , F28F3/12 , Y02B30/741
摘要： A d.c. motor together with a hot gas bypass valve is incorporated into a cooling system specifically designed for removing heat from a computer system. Unlike typical refrigeration systems, the cooling system herein runs continuously and responds to changes in thermal load. This allows the unit to operate within a wide range of ambient conditions and at various thermal load levels unlike other systems which were capable of operation only at a single, pre-designed load level. The cooling system is modular and is easily added to or removed from a redundant system which includes a single evaporator with multiple refrigerant loops which provides yet another aspect of continuous operation due to the inherent redundancy thus provided. In one embodiment, the cooling system includes a refrigeration cooled cold plate thermally coupled to an electronic module of a computer system, and an auxiliary air cooled heat sink thermally coupled to the refrigeration cooled cold plate.
摘要翻译：一个d.c. 电动机和热气旁通阀结合到专门设计用于从计算机系统去除热量的冷却系统中。与典型的制冷系统不同，这里的冷却系统连续运行并响应热负荷的变化。这允许设备在宽范围的环境条件和各种热负载水平下运行，而不同于仅能在单个预设计负载水平下操作的其他系统。冷却系统是模块化的，并且容易地添加到冗余系统中或从冗余系统中去除，该冗余系统包括具有多个制冷剂回路的单个蒸发器，由于提供的固有冗余，这提供了连续操作的另一方面。在一个实施例中，冷却系统包括热耦合到计算机系统的电子模块的冷冻冷却冷板，以及与冷冻冷却的冷板热耦合的辅助空气冷却散热器。

3. 发明授权

US5963425A Combined air and refrigeration cooling for computer systems 失效
标题翻译：用于计算机系统的联合空气和制冷冷却
公开(公告)号：US5963425A
公开(公告)日：1999-10-05
申请号：US976062
申请日：1997-11-21
申请人： Gregory M. Chrysler , Richard C. Chu , Gary F. Goth , Robert E. Simons
发明人： Gregory M. Chrysler , Richard C. Chu , Gary F. Goth , Robert E. Simons
IPC分类号： G06F1/20 , H05K7/20
CPC分类号： H05K7/20836 , G06F1/20 , G06F2200/201
摘要： A cabinet with air inlet and exhaust openings includes one or more air-moving devices for the air cooling of circuit cards contained within the cabinet. The circuit cards are insertable into a board (back plane) which also contains an electronic circuit module which is cooled by at least one refrigeration system which may also be disposed within a portion of the cabinet. In one embodiment, a portion of the exhaust air stream is used to also cool a condenser portion of the refrigeration system. The refrigeration system is preferably a dual/redundant system with two distinct coolant loops passing through a single cold plate in contact with the circuit module.
摘要翻译：具有进气和排气口的机柜包括一个或多个气动装置，用于空气冷却包含在机柜内的电路卡。电路卡可插入到板（背板）中，该板还包含电子电路模块，该电子模块由至少一个还可设置在机柜的一部分内的制冷系统冷却。在一个实施例中，一部分排气流用于冷却制冷系统的冷凝器部分。制冷系统优选地是双重/冗余系统，其具有两个不同的冷却剂回路，其通过与电路模块接触的单个冷板。

4. 发明授权

US5896922A Cold plate for dual refrigeration systems 失效
公开(公告)号：US5896922A
公开(公告)日：1999-04-27
申请号：US60847
申请日：1998-04-15
申请人： Gregory M. Chrysler , Richard C. Chu , Gary F. Goth , Robert E. Simons
发明人： Gregory M. Chrysler , Richard C. Chu , Gary F. Goth , Robert E. Simons
IPC分类号： F25B39/02 , F25B41/04 , F28F3/12
CPC分类号： H05K7/20818 , F25B39/024 , F25B41/04 , F28F3/12 , F25B2400/06 , F25B2400/075
摘要： A cold plate includes two flow-wise isolated coolant (or refrigerant) passages (or sets of passages) for use in conjunction with separate refrigeration systems. The cold plate passages do not permit flow communication between distinct coolant (or refrigerant) paths. This permits two distinct cooling systems to operate in a redundant manner. Nonetheless, flow isolation is achieved while still maintaining tight thermal coupling between each path and the object, such as an electronic computer processor module, to be cooled.

5. 发明授权

US06223810B1 Extended air cooling with heat loop for dense or compact configurations of electronic components 失效
标题翻译：具有热回路的扩展空气冷却，用于密集或紧凑的电子部件配置
公开(公告)号：US06223810B1
公开(公告)日：2001-05-01
申请号：US09052320
申请日：1998-03-31
申请人： Richard C. Chu , Gregory M. Chrysler
发明人： Richard C. Chu , Gregory M. Chrysler
IPC分类号： F28D1500
CPC分类号： H05K7/20681 , F28D15/0266 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A thermosyphon system is employed in conjunction with compact and/or dense configurations of electrical and/or electronic components to provide cooling. The thermosyphon cooling system is particularly advantageous in those systems in which the compact arrangement of circuit modules precludes the use of direct air cooling. The thermosyphon cooling system repositions the air cooling aspect of its cooling function to an exterior cabinet location distant from the circuit modules which can therefore be placed more closely together to shorten signal paths.
摘要翻译：热虹吸系统与电气和/或电子部件的紧凑和/或密集配置结合使用以提供冷却。热虹吸管冷却系统在其中电路模块的紧凑布置阻止使用直接空气冷却的那些系统中是特别有利的。热虹吸管冷却系统将其冷却功能的空气冷却方面重新定位在远离电路模块的外部柜体位置，因此可以将其更靠近地放置在一起以缩短信号路径。

6. 发明授权

US06205796B1 Sub-dew point cooling of electronic systems 失效
标题翻译：电子系统的次露点冷却
公开(公告)号：US06205796B1
公开(公告)日：2001-03-27
申请号：US09281135
申请日：1999-03-29
申请人： Richard C. Chu , Gregory M. Chrysler , Robert E. Simons
发明人： Richard C. Chu , Gregory M. Chrysler , Robert E. Simons
IPC分类号： F25D1706
CPC分类号： H05K7/20354 , F25B5/02 , H01L2924/0002 , H05K5/0213 , H05K7/20818 , H01L2924/00
摘要： Redundant humidity control mechanisms are provided for electronic systems which are cooled to temperatures below the dew point temperature of the ambient environment in which the systems are present. In particular, system environment is controlled in an overall fashion by providing a thermally insulating and substantially sealed enclosure for containing both air coolable and refrigerant coolable components. Humidity control and cooling are both provided in a redundant fashion to ensure reliability of service and availability of the components which are being cooled. Both desiccant-based and refrigeration-based humidity control mechanisms are provided. The present invention also includes embodiments in which multiple heat exchange fluids are employed.
摘要翻译：为电子系统提供了冗余的湿度控制机构，该系统被冷却到低于系统存在的周围环境的露点温度的温度。特别地，通过提供用于容纳空气可冷却和制冷剂可冷却组件的绝热且基本上密封的外壳，整体地控制系统环境。湿度控制和冷却都以冗余的方式提供，以确保服务的可靠性和正在冷却的组件的可用性。提供基于干燥剂和制冷的湿度控制机制。本发明还包括采用多种热交换流体的实施例。

7. 发明授权

US6023410A Extended cooling for portable computers 失效
标题翻译：便携式电脑的延长冷却
公开(公告)号：US6023410A
公开(公告)日：2000-02-08
申请号：US52432
申请日：1998-03-31
申请人： Richard C. Chu , Gregory M. Chrysler
发明人： Richard C. Chu , Gregory M. Chrysler
IPC分类号： H05K7/20 , G06F1/20 , G06F1/16
CPC分类号： G06F1/203
摘要： A notebook or laptop style computer includes a visor which is attached to an upper edge of the screen. This visor includes electrical circuit components which typically have higher thermal load demands. The visor provides a mechanism for cooling these chips, particularly microprocessor chips. The system provides two related advantages, the first being placement of hot components in an area which is ideal for convective and radiational cooling. A second advantage is the removal of these components from the base unit which now contains other circuit components which are not subjected to high temperatures due to the presence of the components which have been removed and placed in or on the visor.
摘要翻译：笔记本或笔记型电脑包括附着在屏幕上边缘的遮阳板。该遮阳板包括通常具有较高热负荷需求的电路元件。遮阳板提供冷却这些芯片，特别是微处理器芯片的机制。该系统提供两个相关的优点，首先将热部件放置在理想的对流和辐射冷却区域中。第二个优点是从基本单元中去除这些部件，这些部件现在包含由于已经被去除并放置在面板中的部件的存在而不受高温的其它电路部件。

8. 发明授权

US5970731A Modular refrigeration system 失效
公开(公告)号：US5970731A
公开(公告)日：1999-10-26
申请号：US976352
申请日：1997-11-21
申请人： Jeffrey J. Hare , Willard S. Harris , Jody A. Hickey , Roger R. Schmidt , Edward J. Seminaro , Gregory M. Chrysler , Richard C. Chu , Gary F. Goth , Robert E. Simons
发明人： Jeffrey J. Hare , Willard S. Harris , Jody A. Hickey , Roger R. Schmidt , Edward J. Seminaro , Gregory M. Chrysler , Richard C. Chu , Gary F. Goth , Robert E. Simons
IPC分类号： F25B7/00 , F25B41/04 , F25B47/02 , F28F3/12 , H05K7/20 , F25B41/00
CPC分类号： H05K7/20354 , F25B7/00 , F28F3/12 , F25B2400/06 , F25B2400/075 , F25B2600/0253 , F25B41/04 , F25B47/022 , Y02B30/741
摘要： A d.c. motor together with a hot gas bypass valve is incorporated into a cooling system specifically designed for removing heat from computer systems. Unlike typical refrigeration systems, the cooling system herein runs continuously and responds to changes in thermal load. This allows the unit to operate within a wide range of ambient conditions and at various thermal load levels unlike other systems which were capable of operation only at a single, predesigned load level. The cooling system is modular and is easily added to or removed from a redundant system which includes a single evaporator with multiple refrigerant loops which provides yet another aspect of continuous operation due to the inherent redundancy thus provided.

9. 发明授权

US5954127A Cold plate for dual refrigeration system 失效
标题翻译：双制冷系统冷板
公开(公告)号：US5954127A
公开(公告)日：1999-09-21
申请号：US975852
申请日：1997-11-21
申请人： Gregory M. Chrysler , Richard C. Chu , Gary F. Goth , Robert E. Simons
发明人： Gregory M. Chrysler , Richard C. Chu , Gary F. Goth , Robert E. Simons
IPC分类号： F25B39/02 , F25B41/04 , F28F3/12
CPC分类号： H05K7/20818 , F25B39/024 , F25B41/04 , F28F3/12 , F25B2400/06 , F25B2400/075
摘要： A cold plate includes two flow-wise isolated coolant (or refrigerant) passages (or sets of passages) for use in conjunction with separate refrigeration systems. The cold plate passages do not permit flow communication between distinct coolant (or refrigerant) paths. This permits two distinct cooling systems to operate in a redundant manner. Nonetheless, flow isolation is achieved while still maintaining tight thermal coupling between each path and the object, such as an electronic computer processor module, to be cooled.
摘要翻译：冷板包括与独立制冷系统结合使用的两个流动隔离的冷却剂（或制冷剂）通道（或通道组）。冷板通道不允许在不同的冷却剂（或制冷剂）路径之间流动连通。这允许两个不同的冷却系统以冗余的方式操作。然而，仍然保持流动隔离，同时仍保持每个路径和待冷却的物体（例如电子计算机处理器模块）之间的紧密热耦合。

10. 发明授权

US5456081A Thermoelectric cooling assembly with optimized fin structure for improved thermal performance and manufacturability 失效
标题翻译：具有优化翅片结构的热电冷却组件，用于改善热性能和可制造性
公开(公告)号：US5456081A
公开(公告)日：1995-10-10
申请号：US222150
申请日：1994-04-01
申请人： Gregory M. Chrysler , Richard C. Chu , Robert E. Simons , David T. Vader
发明人： Gregory M. Chrysler , Richard C. Chu , Robert E. Simons , David T. Vader
IPC分类号： H01L23/38 , H01L35/30 , H01L35/28
CPC分类号： H01L35/30 , H01L23/38 , H01L2924/0002
摘要： A configuration of solid state thermoelectric heat transfer or removal elements is provided to enhance the rate and amount of heat removal from electrical and electronic circuit devices. By rotating the thermoelectric heat transfer modules ninety degrees and by disposing them between the interdigitated fingers of a cold plate and a heat transfer plate possessing fins, improved thermal transfer is produced without the necessity of liquid coolants or moving part cooling devices. Accordingly, a method and apparatus is provided for enhancing heat transfer using thermoelectric modules. One embodiment of the present invention is particularly seen to be easy to manufacture. Additionally, this embodiment also possesses desirable heat transfer characteristics in terms of the cross sections of thermally conductive components.
摘要翻译：提供了固态热电传热或去除元件的结构，以增强从电气和电子电路器件的散热速率和散热量。通过将热电传热模块旋转90度并且将它们设置在冷板的交叉指状物和具有翅片的传热板之间，不需要液体冷却剂或移动部件冷却装置就可以产生改进的热转印。因此，提供了一种用于增强使用热电模块的传热的方法和装置。特别地看到本发明的一个实施例易于制造。此外，该实施例还具有关于导热部件的横截面的期望的热传递特性。

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