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    • 73. 发明申请
    • Heat treating system and heat treating method
    • 热处理系统和热处理方法
    • US20060099805A1
    • 2006-05-11
    • US10532878
    • 2003-10-29
    • Takehiko FujitaMitsuhiro OkadaKota UmezawaKazuhide HasebeKoichi Sakamoto
    • Takehiko FujitaMitsuhiro OkadaKota UmezawaKazuhide HasebeKoichi Sakamoto
    • H01L21/44C23C16/00H05B3/02
    • H01L21/67253F27B17/0025H01L21/67109
    • A thermal processing unit of the present invention includes: a holder that holds a plurality of substrates; a reaction container into which the holder is conveyed; a process-gas supplying mechanism that supplies a process gas into the reaction container; and a heating mechanism that heats the reaction container to conduct a film-forming process to the substrates when the process gas is supplied. Flow-rate-parameter table-data associating number-data of the substrates to be processed by one batch-process with target-data of flow-rate parameter of the process gas is stored in a flow-rate-parameter table-data storing part. A controlling unit obtains target-data of flow-rate parameter of the process gas, depending on an actual number of the substrates to be processed by one batch-process, based on the flow-rate-parameter table-data stored in the flow-rate-parameter table-data storing part, and controls the process-gas supplying mechanism according to the obtained target-data. The target-data of flow-rate parameter are determined in such a manner that a speed of the film-forming process is uniform among a plurality of batch-processes in which the numbers of substrates to be processed are different from each other.
    • 本发明的热处理单元包括:保持多个基板的保持器; 保持器被输送到其中的反应容器; 将处理气体供给到反应容器内的处理气体供给机构; 以及加热机构,当供给处理气体时,加热反应容器进行成膜处理。 将通过一批处理的基板的数量数据与处理气体的流量参数的目标数据相关联的流量参数表数据存储在流量参数表数据存储部 。 控制单元根据存储在流量参数表中的流量参数表数据,取决于通过一个批处理的待处理的基板的实际数量来获得处理气体的流量参数的目标数据。 速率参数表数据存储部,并根据获得的目标数据来控制处理气体供给机构。 流量参数的目标数据以这样一种方式确定,即在待处理的基板数目彼此不同的多个间歇处理中,成膜处理的速度是一致的。
    • 78. 发明授权
    • Method of determining set temperature trajectory for heat treatment system
    • 确定热处理系统设定温度轨迹的方法
    • US06495805B2
    • 2002-12-17
    • US09933671
    • 2001-08-22
    • Koichi SakamotoWenling WangFujio SuzukiMoyuru YasuharaKeisuke Suzuki
    • Koichi SakamotoWenling WangFujio SuzukiMoyuru YasuharaKeisuke Suzuki
    • H05B302
    • H01L21/67757H01L21/67248H01L21/67781
    • This invention is a method of determining set temperature trajectories for a heat treatment system that conducts a first heat treatment process and a second heat treatment process to an object to be processed. The method comprises the steps of: conducting the first heat treatment process to a first test object to be processed, by using a temporary first set temperature trajectory; measuring a result of the first heat treatment process produced on the first test object to be processed; and determining a first set temperature trajectory for the first heat treatment process by correcting the temporary first set temperature trajectory on the basis of the measured result of the first heat treatment process. The method also comprises the steps of: conducting the second heat treatment process to a second test object to be processed to which the first heat treatment process has been conducted by using the determined first set temperature trajectory, by using a temporary second set temperature trajectory; measuring a result of the first heat treatment process and the second heat treatment process produced on the second test object to be processed; and determining a second set temperature trajectory for the second heat treatment process by correcting the temporary second set temperature trajectory on the basis of the measured result of the first heat treatment process and the second heat treatment process.
    • 本发明是一种确定对待处理物体进行第一热处理和第二热处理的热处理系统的设定温度轨迹的方法。 该方法包括以下步骤:通过使用临时的第一设定温度轨迹对待处理的第一测试对象进行第一热处理过程; 测量在待处理的第一测试对象上产生的第一热处理过程的结果; 以及通过基于第一热处理过程的测量结果校正临时第一设定温度轨迹来确定用于第一热处理过程的第一设定温度轨迹。 该方法还包括以下步骤:通过使用临时第二设定温度轨迹,通过使用所确定的第一设定温度轨迹,将第二热处理过程执行到已经进行了第一热处理过程的待处理的第二测试对象; 测量在待处理的第二测试对象上产生的第一热处理过程和第二热处理过程的结果; 以及通过基于第一热处理过程和第二热处理过程的测量结果校正临时第二设定温度轨迹来确定第二热处理过程的第二设定温度轨迹。
    • 79. 发明授权
    • Oscillator and radio equipment
    • 振荡器和无线电设备
    • US06445256B1
    • 2002-09-03
    • US09675869
    • 2000-09-29
    • Kazumasa HarutaSadeo YamashitaKoichi SakamotoToru Tanizaki
    • Kazumasa HarutaSadeo YamashitaKoichi SakamotoToru Tanizaki
    • H03B912
    • H03B5/04H03B5/20
    • The present invention provides a small-sized oscillator facilitating the adjustment of a resonance frequency, permitting mass productivity to be improved, sufficiently suppressing a fundamental wave, and permitting cost reduction, and provides radio equipment using the oscillator. In this oscillator, an oscillation circuit is formed by providing a line and a Gunn diode on a dielectric substrate. An NRD guide serving as an output transmission line is formed by disposing a dielectric strip between upper and lower conductor plates, and the above-mentioned line and the NRD guide are coupled. The cut-off frequency of this NRD guide is determined so that the fundamental wave component of an oscillation signal from the oscillation circuit is cut off, so that higher harmonic components are propagated.
    • 本发明提供一种便于调谐共振频率的小型振荡器,可以提高批量生产率,充分抑制基波,并且降低成本,并提供使用该振荡器的无线电设备。 在该振荡器中,通过在电介质基板上设置线和耿氏二极管来形成振荡电路。 通过在上导体板和下导体板之间设置介质条来形成用作输出传输线的NRD引导件,并且上述线路和NRD引导件耦合。 确定该NRD波导的截止频率,使得来自振荡电路的振荡信号的基波分量被切断,从而传播高次谐波分量。