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71. 发明申请

US20110008545A1 FILM FORMING METHOD, FILM FORMING APPARATUS, PATTERN FORMING METHOD, AND MANUFACTURING METHOD OF SEMICONDUCTOR APPARATUS 审中-公开
标题翻译：薄膜成型方法，薄膜成型装置，图案形成方法及半导体装置的制造方法
公开(公告)号：US20110008545A1
公开(公告)日：2011-01-13
申请号：US12885934
申请日：2010-09-20
申请人： Shinichi ITO , Tatsuhiko Ema , Kei Hayasaki , Rempei Nakata , Nobuhide Yamada , Katsuya Okumura
发明人： Shinichi ITO , Tatsuhiko Ema , Kei Hayasaki , Rempei Nakata , Nobuhide Yamada , Katsuya Okumura
IPC分类号： B05D1/02
CPC分类号： H01L21/6715 , H01L21/02126 , H01L21/02164 , H01L21/022 , H01L21/02282 , H01L21/288 , H01L21/31633
摘要： There is disclosed a film forming method comprising continuously discharging a solution adjusted so as to spread over a substrate by a given amount to the substrate through a discharge port disposed in a nozzle, moving the nozzle and substrate with respect to each other, and holding the supplied solution onto the substrate to form a liquid film, wherein a distance h between the discharge port of the nozzle and the substrate is set to be not less than 2 mm and to be in a range less than 5×10−5 qγ (mm) given with respect to a surface tension γ (N/m) of the solution, discharge speed q (m/sec) of the solution continuously discharged through the discharge port, and a constant of 5×10−5 (m·sec/N).
摘要翻译：公开了一种成膜方法，其特征在于，连续地排出通过设置在喷嘴中的排出口将调整后的液体以一定量向基板扩散至基板，使喷嘴和基板相对移动，将其供给到基板上形成液膜，其中喷嘴的排出口与基板的距离h设定为2mm以上且小于5×10 -5qγ（mm））相对于溶液的表面张力γ（N / m）给出，通过排出口连续排出的溶液的排出速度q（m / sec），常数为5×10-5（m·sec / N）。

72. 发明授权

US07862959B2 Transfer mask for exposure and pattern exchanging method of the same 有权
标题翻译：转印掩模的曝光和图案交换方法相同
公开(公告)号：US07862959B2
公开(公告)日：2011-01-04
申请号：US11030963
申请日：2005-01-10
申请人： Katsuya Okumura , Kazuya Nagaseki , Naoyuki Satoh
发明人： Katsuya Okumura , Kazuya Nagaseki , Naoyuki Satoh
IPC分类号： G03F1/00 , G03F7/20
CPC分类号： B82Y10/00 , B82Y40/00 , G03F1/20 , G03F1/50 , H01J37/3174 , H01J2237/31788 , H01J2237/31794
摘要： The present invention is a transfer mask for exposure comprising a mask portion having a plurality of cells, each of which an opening of a predetermined pattern is formed in. When one side of the plurality of cells is exposed to a charged particle beam, each of the plurality of cells is adapted to make the charged particle beam pass through itself to the other side thereof based on the pattern of the opening formed in the cell. Thus, when a substrate to be processed is arranged on the other side of the cell, the pattern of the opening formed in the cell is transferred to the substrate to be processed and hence an exposure pattern is formed on the substrate to be processed. The feature of the present invention is that a part of or all the plurality of cells can be exchanged at the mask portion.
摘要翻译：本发明是用于曝光的转印掩模，其包括具有多个单元的掩模部分，每个单元都形成有预定图案的开口。当多个单元的一侧暴露于带电粒子束时，多个单元适于基于形成在单元中的开口的图案使带电粒子束自身通过其自身的另一侧。因此，当待处理基板布置在单元的另一侧时，形成在单元中的开口的图案被转移到待处理的基板，因此在待处理的基板上形成曝光图案。本发明的特征在于，可以在掩模部分更换多个单元的一部分或全部。

73. 发明授权

US07766341B2 Seal structure, fluid device, integrated valve, and sealing member 有权
标题翻译：密封结构，流体装置，集成阀和密封构件
公开(公告)号：US07766341B2
公开(公告)日：2010-08-03
申请号：US11631156
申请日：2005-03-23
申请人： Katsuya Okumura , Shoichi Kitagawa , Shigenobu Itoh , Kazuhiro Sugata , Kazuhiro Arakawa , Hiroshi Tomita
发明人： Katsuya Okumura , Shoichi Kitagawa , Shigenobu Itoh , Kazuhiro Sugata , Kazuhiro Arakawa , Hiroshi Tomita
IPC分类号： F16L17/00 , F16J15/02 , H02G3/22
CPC分类号： F16J15/106 , F16J15/104
摘要： A seal structure in which a sealing member 510 fitted in the seal holding part 120 is elastically deformed to hermetically seal a flow passage joining portion. The seal holding part 120 opening on a flow passage side and including a first retaining surface 121, a second retaining surface 122, and a circumferential surface 123. The sealing member 510 includes a first surface 511 in contact with the first retaining surface 121, a second surface 512 in contact with the retaining surface 122, and an inner surface 513 located inside the seal holding part 510 and tapered to have a diameter becoming smaller from the first surface 511 side to the second surface 512 side. An engagement portion 515 engaged in the seal holding part 120 is formed protruding from an outer surface 514 located on the circumferential surface 123 side and on the first surface 511 side. When the sealing member 510 is fitted in the seal holding part 120 while the engagement portion 515 is pressed, the sealing member 510 is placed such that the inner surface 513 on the first surface 511 side protrudes inward and the outer surface 514 is in contact with the circumferential surface 123.
摘要翻译：其中装配在密封保持部分120中的密封构件510弹性变形以密封流路连接部分的密封结构。密封保持部分120在流动通道侧开口并且包括第一保持表面121，第二保持表面122和周向表面123.密封构件510包括与第一保持表面121接触的第一表面511，与保持表面122接触的第二表面512和位于密封保持部510内的内表面513，并且具有从第一表面511侧到第二表面512侧的直径变小的锥形。接合在密封保持部120中的接合部515从位于圆周表面123侧和第一表面511侧的外表面514形成。当密封构件510在接合部分515被按压时装配在密封保持部分120中时，密封构件510被放置成使得第一表面511侧的内表面513向内突出，并且外表面514与圆周表面123。

74. 发明授权

US07686588B2 Liquid chemical supply system having a plurality of pressure detectors 有权
标题翻译：具有多个压力检测器的液体化学物质供应系统
公开(公告)号：US07686588B2
公开(公告)日：2010-03-30
申请号：US11581464
申请日：2006-10-17
申请人： Katsuya Okumura , Tetsuya Toyoda , Tomohiro Ito , Akira Murakumo , Atsuyuki Sakai
发明人： Katsuya Okumura , Tetsuya Toyoda , Tomohiro Ito , Akira Murakumo , Atsuyuki Sakai
IPC分类号： F04B49/22
CPC分类号： F04B49/08
摘要： A liquid chemical supply system that performs accurate pressure feedback control and controls the discharge flow rate of liquid chemical with high precision, even when the pressure setting value of the operation pressure differs due to changes in the type of liquid chemical, includes a pump having a pump chamber and an operation chamber separated by a diaphragm comprised of a flexible membrane. The intake and discharge of liquid chemical is performed in accordance with the change in pressure inside the operation chamber. An electro-pneumatic regulator supplies operation gas pressure to the operation chamber. A plurality of pressure sensors having different pressure detection ranges is provided for detecting the operation gas pressure. A controller selectively employs any of the detection results of the plurality of sensors in accordance with the pressure setting value of the operation air that is set for each use, and performs pressure feedback control.
摘要翻译：一种液体化学品供应系统，即使当由于液体化学品的类型的变化而导致的操作压力的压力设定值不同时，也能够精确地进行精确的压力反馈控制和控制液体化学品的排出流量，包括具有泵室和由包括柔性膜的隔膜隔开的操作室。根据操作室内的压力变化进行液体化学品的进出。电动气动调节器将操作气体压力提供给操作室。提供具有不同压力检测范围的多个压力传感器用于检测操作气体压力。控制器根据为每次使用设定的操作空气的压力设定值选择性地使用多个传感器的检测结果，并进行压力反馈控制。

75. 发明申请

US20090285998A1 PLASMA PROCESSING APPARATUS, ELECTRODE PLATE FOR PLASMA PROCESSING APPARATUS, AND ELECTRODE PLATE MANUFACTURING METHOD 有权
标题翻译：等离子体处理装置，等离子体处理装置的电极板和电极板的制造方法
公开(公告)号：US20090285998A1
公开(公告)日：2009-11-19
申请号：US12505940
申请日：2009-07-20
申请人： Katsuya Okumura , Shinji Himori , Kazuya Nagaseki , Hiroki Matsumaru , Shoichiro Matsuyama , Toshiki Takahashi
发明人： Katsuya Okumura , Shinji Himori , Kazuya Nagaseki , Hiroki Matsumaru , Shoichiro Matsuyama , Toshiki Takahashi
IPC分类号： C23C16/513 , C23C14/24 , C23C16/04 , B05D1/32
CPC分类号： H01L21/3065 , H01J37/32009 , H01J37/32082 , H01J37/32541
摘要： A plasma processing apparatus for performing a plasma process on a target substrate includes a process container configured to accommodate the target substrate and to reduce pressure therein. A first electrode is disposed within the process container. A supply system is configured to supply a process gas into the process container. An electric field formation system is configured to form an RF electric field within the process container so as to generate plasma of the process gas. A number of protrusions are discretely disposed on a main surface of the first electrode and protrude toward a space where the plasma is generated.
摘要翻译：用于在目标衬底上执行等离子体处理的等离子体处理装置包括：配置成容纳目标衬底并减少其中的压力的处理容器。第一电极设置在处理容器内。供应系统被配置为将处理气体供应到处理容器中。电场形成系统被配置为在处理容器内形成RF电场，以产生处理气体的等离子体。多个突起离散地设置在第一电极的主表面上，朝向产生等离子体的空间突出。

76. 发明授权

US07387717B2 Method of performing electrolytic treatment on a conductive layer of a substrate 失效
标题翻译：在基板的导电层上进行电解处理的方法
公开(公告)号：US07387717B2
公开(公告)日：2008-06-17
申请号：US10631726
申请日：2003-08-01
申请人： Junji Kunisawa , Mitsuko Odagaki , Natsuki Makino , Koji Mishima , Kenji Nakamura , Hiroaki Inoue , Norio Kimura , Tetsuo Matsuda , Hisashi Kaneko , Nobuo Hayasaka , Katsuya Okumura , Manabu Tsujimura , Toshiyuki Morita
发明人： Junji Kunisawa , Mitsuko Odagaki , Natsuki Makino , Koji Mishima , Kenji Nakamura , Hiroaki Inoue , Norio Kimura , Tetsuo Matsuda , Hisashi Kaneko , Nobuo Hayasaka , Katsuya Okumura , Manabu Tsujimura , Toshiyuki Morita
IPC分类号： C25D7/12
CPC分类号： H01L21/6719 , C25D7/123 , C25D17/001 , C25D17/12 , C25D17/14 , H01L21/2885 , H01L21/67046 , H01L21/67051 , H01L21/6708 , H01L21/6715 , H01L21/6723 , H01L21/76877 , H01L21/76879 , H01L2924/0002 , H05K3/423 , H01L2924/00
摘要： A plating method and apparatus for a substrate fills a metal, e.g., copper, into a fine interconnection pattern formed in a semiconductor substrate. The apparatus has a substrate holding portion 36 horizontally holding and rotating a substrate with its surface to be plated facing upward. A seal material 90 contacts a peripheral edge portion of the surface, sealing the portion in a watertight manner. A cathode electrode 88 passes an electric current upon contact with the substrate. A cathode portion 38 rotates integrally with the substrate holding portion 36. An electrode arm portion 30 is above the cathode portion 38 and movable horizontally and vertically and has an anode 98 face-down. Plating liquid is poured into a space between the surface to be plated and the anode 98 brought close to the surface to be plated. Thus, plating treatment and treatments incidental thereto can be performed by a single unit.
摘要翻译：用于衬底的电镀方法和装置将诸如铜的金属填充到形成在半导体衬底中的精细互连图案中。该装置具有基板保持部分36，其水平地保持并旋转基板，其表面被面向上。密封材料90接触表面的周缘部分，以水密的方式密封该部分。阴极电极88在与基板接触时通过电流。阴极部38与基板保持部36一体地旋转。电极臂部30在阴极部38的上方，水平且垂直地移动，阳极98面朝下。将电镀液注入被镀表面与接近待镀表面的阳极98之间的空间中。因此，电镀处理和附带的处理可以通过单个单元进行。

77. 发明申请

US20080090001A1 Film forming method, film forming apparatus, pattern forming method, and manufacturing method of semiconductor apparatus 失效
标题翻译：成膜方法，成膜装置，图案形成方法以及半导体装置的制造方法
公开(公告)号：US20080090001A1
公开(公告)日：2008-04-17
申请号：US11987653
申请日：2007-12-03
申请人： Shinichi Ito , Tatsuhiko Ema , Kei Hayasaki , Rempei Nakata , Nobuhide Yamada , Katsuya Okumura
发明人： Shinichi Ito , Tatsuhiko Ema , Kei Hayasaki , Rempei Nakata , Nobuhide Yamada , Katsuya Okumura
IPC分类号： C23C14/54 , B05C11/00
CPC分类号： H01L21/6715 , H01L21/02126 , H01L21/02164 , H01L21/022 , H01L21/02282 , H01L21/288 , H01L21/31633
摘要： There is disclosed a film forming method comprising continuously discharging a solution adjusted so as to spread over a substrate by a given amount to the substrate through a discharge port disposed in a nozzle, moving the nozzle and substrate with respect to each other, and holding the supplied solution onto the substrate to form a liquid film, wherein a distance h between the discharge port of the nozzle and the substrate is set to be not less than 2 mm and to be in a range less than 5×10−5 qγ (mm) given with respect to a surface tension γ (N/m) of the solution, discharge speed q (m/sec) of the solution continuously discharged through the discharge port, and a constant of 5×10−5 (m·sec/N).
摘要翻译：公开了一种成膜方法，其特征在于，连续地排出通过设置在喷嘴中的排出口将调整后的液体以一定量向基板扩散至基板，使喷嘴和基板相对移动，将所述溶液供给到所述基板上以形成液膜，其中所述喷嘴的排出口与所述基板之间的距离h被设定为不小于2mm并且在小于5×10 -5的范围内，相对于溶液的表面张力γ（N / m）给出的SUP> qgamma（mm），通过排出口连续排出的溶液的排出速度q（m / sec）和5×10 -6 5（m.sec / N）。

78. 发明申请

US20070275178A1 Substrate Heating Apparatus and Substrate Heating Method 审中-公开
标题翻译：基板加热装置和基板加热方法
公开(公告)号：US20070275178A1
公开(公告)日：2007-11-29
申请号：US11630440
申请日：2005-07-13
申请人： Takanori Nishi , Takahiro Kitano , Katsuya Okumura
发明人： Takanori Nishi , Takahiro Kitano , Katsuya Okumura
IPC分类号： B05D1/18 , B05B5/00
CPC分类号： G03F7/38 , H01L21/67109 , H01L21/67748
摘要： A substrate heating apparatus for heating a substrate coated with a film of chemically amplified resist within a period after exposure and before development, having a mounting table to mount the substrate substantially horizontal with the resist-coated film faced up, a fluid supply mechanism for supplying glycerin to the substrate, and a heating mechanism for heating the substrate on a mounting table, in a state that glycerin contacts a resist-coated film, wherein the substrate on a mounting table is heated, in a state that glycerin contacts the resist-coated film.
摘要翻译：一种基板加热装置，用于在曝光和显影之前的一段时间内加热涂覆有化学放大型抗蚀剂膜的基板，该基板加热装置具有安装台，用于将基板保持在水平面上，使抗蚀剂涂覆膜面朝上;流体供应机构，用于供应甘油与基材的加热机构，以及加热机构，其用于在甘油接触抗蚀剂涂布膜的状态下将载体加热到安装台上，其中，在甘油接触抗蚀剂涂布的状态下，将载置台上的基板加热电影。

79. 发明申请

US20070181556A1 Capacitor and manufacturing method thereof 审中-公开
标题翻译：电容及其制造方法
公开(公告)号：US20070181556A1
公开(公告)日：2007-08-09
申请号：US11508156
申请日：2006-08-23
申请人： Yoshiki Yamanishi , Muneo Harada , Takahiro Kitano , Tatsuzo Kawaguchi , Yoshihiro Hirota , Kenji Matsuda , Kinji Yamada , Tomotaka Shinoda , Daohai Wang , Katsuya Okumura
发明人： Yoshiki Yamanishi , Muneo Harada , Takahiro Kitano , Tatsuzo Kawaguchi , Yoshihiro Hirota , Kenji Matsuda , Kinji Yamada , Tomotaka Shinoda , Daohai Wang , Katsuya Okumura
IPC分类号： F27B5/14
CPC分类号： H01L28/55
摘要： Atmosphere in processing apparatus is adjusted to, for example, oxygen atmosphere, by gas supply source and the like. Interior of thermal processing apparatus is set to oxygen atmosphere and raised to predetermined temperature. A wafer boat containing wafer W having dielectric precursor layer formed is loaded into thermal processing apparatus at speed at which no defects are produced in wafer W. Thereafter, reaction tube of thermal processing apparatus has its internal temperature raised to baking temperature, to perform baking for predetermined time. The wafer W is cooled to predetermined temperature in thermal processing apparatus and then to room temperature in processing apparatus, and carried out from processing apparatus. Before dielectric precursor layer is baked, it is maintained for predetermined time at temperature higher than temperature at which solvent in dielectric precursor layer is volatilized and lower than temperature at which dielectric precursor layer starts crystallization to vaporize residual solvent.
摘要翻译：处理装置中的气氛通过气体供给源等调节为例如氧气氛。热处理装置的内部设定为氧气氛并升温至规定温度。包含形成有电介质前体层的晶片W的晶片舟以晶片W中没有产生缺陷的速度装载到热处理装置中。之后，热处理装置的反应管的内部温度升高到烘烤温度，进行烘烤预定时间将晶片W在热处理装置中冷却至规定温度，然后在处理装置中冷却至室温，并从处理装置进行。在电介质前体层被烘烤之前，在高于电介质前体层中的溶剂挥发并且低于电介质前体层开始结晶以蒸发残留溶剂的温度的温度下将其保持预定时间。

80. 发明申请

US20070122291A1 Liquid chemical supply system having a plurality of pressure detectors 有权
标题翻译：具有多个压力检测器的液体化学物质供应系统
公开(公告)号：US20070122291A1
公开(公告)日：2007-05-31
申请号：US11581464
申请日：2006-10-17
申请人： Katsuya Okumura , Tetsuya Toyoda , Tomohiro Ito , Akira Murakumo , Atsuyuki Sakai
发明人： Katsuya Okumura , Tetsuya Toyoda , Tomohiro Ito , Akira Murakumo , Atsuyuki Sakai
IPC分类号： F04B49/00
CPC分类号： F04B49/08
摘要： [Problem] To always perform accurate pressure feedback control, and control the discharge flow rate of liquid chemical with high precision, even in situations in which the pressure setting value of the operation pressure differs due to changes in the type of liquid chemical, etc. [Means of solution] A pump 11 has a pump chamber 13 and an operation chamber 14 separated by a diaphragm 12 comprised of a flexible membrane, and performs the intake and discharge of liquid chemical in accordance with the change in pressure inside the operation chamber 14. An electro-pneumatic regulator 32 supplies operation air to the operation chamber 14. In addition, in the present system, a plurality of pressure sensors 51, 63 having different pressure detection ranges is provided as pressure detection means for detecting the operation air pressure. A controller 40 selectively employs any of the detection results of the plurality of sensors 51, 63 in accordance with the pressure setting value of the operation air that is set for each use, and performs pressure feedback control.
摘要翻译： [问题]为了始终进行精确的压力反馈控制，并且即使在由于液体化学品的类型的变化而导致的操作压力的设定值不同的情况下也能够高精度地控制液体化学品的排出流量。 [解决方案]泵11具有由柔性膜构成的隔膜12隔开的泵室13和操作室14，并根据操作室14内的压力变化进行液体化学品的进出。。电动气动调节器32将操作空气供给到操作室14。此外，在本系统中，具有不同压力检测范围的多个压力传感器51,63被设置为用于检测操作空气压力的压力检测装置。控制器40根据为每次使用设定的操作空气的压力设定值选择性地使用多个传感器51,63的检测结果中的任一个，并进行压力反馈控制。

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