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    • 72. 发明授权
    • Method of programming variable resistance element, method of initializing variable resistance element, and nonvolatile storage device
    • 编程可变电阻元件的方法,初始化可变电阻元件的方法和非易失性存储器件
    • US08432721B2
    • 2013-04-30
    • US13201890
    • 2011-02-01
    • Mitsuteru IijimaTakeshi Takagi
    • Mitsuteru IijimaTakeshi Takagi
    • G11C11/00
    • G11C13/0069G11C13/0007G11C13/0097G11C2013/0073G11C2013/0083G11C2213/32G11C2213/72G11C2213/79H01L45/08H01L45/146
    • Programming a variable resistance element includes: a writing step of applying a writing voltage pulse to transition metal oxide comprising two stacked metal oxide layers to decrease resistance of the metal oxide, each metal oxide layer having different oxygen deficiency; and an erasing step of applying an erasing voltage pulse, of different polarity than the writing pulse, to the metal oxide to increase resistance of the metal oxide. |Vw1|>|Vw2|, Vw1 representing voltage of the writing pulse for first to N-th writing steps, and Vw2 representing voltage of the writing pulse for (N+1)-th and subsequent writing steps, N being at least equal to 1, te1>te2, te1 representing pulse width of the erasing pulse for first to M-th erasing steps, and te2 representing pulse width of the erasing pulse for (M+1)-th and subsequent erasing steps. M>1. The (N+1)-th writing step follows the M-th erasing step.
    • 编程可变电阻元件包括:写入步骤,对包含两个堆叠的金属氧化物层的过渡金属氧化物施加写入电压脉冲,以降低金属氧化物的电阻,每个金属氧化物层具有不同的氧缺乏; 以及将与写入脉冲不同的擦除电压脉冲施加到金属氧化物以增加金属氧化物的电阻的擦除步骤。 | Vw1 |> | Vw2 |,表示第一至第N写入步骤的写入脉冲的电压的Vw1,以及表示第(N + 1)个和后续写入步骤的写入脉冲的电压的Vw2,N至少相等 到1,te1> te2,te1表示第一到第M擦除步骤的擦除脉冲的脉冲宽度,te2表示用于(M + 1)个和随后的擦除步骤的擦除脉冲的脉冲宽度。 M> 1。 第(N + 1)个写入步骤在第M擦除步骤之后。
    • 73. 发明申请
    • METHOD FOR DRIVING NON-VOLATILE MEMORY ELEMENT, AND NON-VOLATILE MEMORY DEVICE
    • 驱动非易失性存储器元件的方法和非易失性存储器件
    • US20130010530A1
    • 2013-01-10
    • US13636258
    • 2011-03-18
    • Koji KatayamaTakeshi TakagiMitsuteru Iijima
    • Koji KatayamaTakeshi TakagiMitsuteru Iijima
    • G11C11/00
    • G11C13/0007G11C2213/72H01L27/2409H01L45/08H01L45/1233H01L45/146H01L45/1625
    • Provided is a method for driving a non-volatile memory element in which a variable resistance element including a first electrode, a second electrode, and a variable resistance layer capable of reversibly changing between a high resistance state and a low resistance state with application of electrical signals having different polarities is connected in series with a current steering element having bidirectional rectifying characteristics with respect to an applied voltage. After the non-volatile memory element is manufactured, the resistance value of the variable resistance layer is reduced from a resistance value in the initial resistance state higher than that in the high resistance state by applying, to the non-volatile memory element, a voltage pulse having the polarity identical to that of the voltage pulse for changing the variable resistance layer from the low resistance state to the high resistance state in the normal operations.
    • 提供一种用于驱动非易失性存储元件的方法,其中包括第一电极,第二电极和可变电阻层的可变电阻元件,所述可变电阻元件能够通过施加电而在高电阻状态和低电阻状态之间可逆地变化 具有不同极性的信号与具有相对于施加电压的双向整流特性的电流导向元件串联连接。 在制造非易失性存储元件之后,通过向非易失性存储元件施加电压,可变电阻层的电阻值比初始电阻状态中的电阻值高于高电阻状态的电阻值 脉冲具有与用于在正常操作中将可变电阻层从低电阻状态改变为高电阻状态的电压脉冲的极性相同的脉冲。
    • 75. 发明授权
    • Nonvolatile semiconductor memory apparatus and manufacturing method thereof
    • 非易失性半导体存储装置及其制造方法
    • US08258493B2
    • 2012-09-04
    • US12515379
    • 2007-11-13
    • Takumi MikawaTakeshi Takagi
    • Takumi MikawaTakeshi Takagi
    • H01L29/00
    • H01L27/101G11C13/0007G11C2213/32G11C2213/72G11C2213/73H01L27/0688H01L27/112H01L27/115H01L27/2409H01L27/2418H01L27/2463H01L27/2481H01L45/04H01L45/1233H01L45/146H01L45/1683
    • A nonvolatile semiconductor memory apparatus (10) of the present invention comprises a substrate (10), lower-layer electrode wires (15) provided on the substrate (11), an interlayer insulating layer (16) which is disposed on the substrate (11) including the lower-layer electrode wires (15) and is provided with contact holes at locations respectively opposite to the lower-layer electrode wires (15), resistance variable layers (18) which are respectively connected to the lower-layer electrode wires (15); and non-ohmic devices (20) which are respectively provided on the resistance variable layers (18) such that the non-ohmic devices are respectively connected to the resistance variable layers (18). The non-ohmic devices (20) each has a laminated-layer structure including plural semiconductor layers, a laminated-layer structure including a metal electrode layer and an insulator layer, or a laminated-layer structure including a metal electrode layer and a semiconductor layer. One layer of the laminated-layer structure is embedded to fill each of the contact holes and the semiconductor layer or the insulator layer which is the other layer of the laminated-layer structure has a larger area than an opening of each of the contact holes and is provided on the interlayer insulating layer (16).
    • 本发明的非易失性半导体存储装置(10)具备基板(10),设置在基板(11)上的下层电极布线(15),设置在基板(11)上的层间绝缘层(16) ),并且在分别与下层电极线(15)相对的位置设置接触孔,电阻变化层(18)分别与下层电极线(15)连接 15); 和非欧姆器件(20),其分别设置在电阻变化层(18)上,使得非欧姆器件分别连接到电阻变化层(18)。 非欧姆装置(20)各自具有包括多个半导体层的层叠层结构,包括金属电极层和绝缘体层的层叠层结构,或者包括金属电极层和半导体层的层叠层结构 。 嵌入层叠层结构的一层以填充每个接触孔,作为层叠层结构的另一层的半导体层或绝缘体层的面积比每个接触孔的开口大, 设置在层间绝缘层(16)上。
    • 77. 发明授权
    • Nonvolatile memory element, nonvolatile memory element array, and method for manufacturing nonvolatile memory element
    • 非易失性存储元件,非易失性存储元件阵列和用于制造非易失性存储元件的方法
    • US08093578B2
    • 2012-01-10
    • US12513638
    • 2007-11-16
    • Takeshi TakagiTakumi Mikawa
    • Takeshi TakagiTakumi Mikawa
    • H01L27/10H01L21/02
    • H01L27/101H01L27/1021H01L27/2409H01L27/2418H01L27/2463H01L45/04H01L45/1233H01L45/146H01L45/1683
    • The present invention is configured such that a resistance variable element (16) and a rectifying element (20) are formed on a substrate (12). The resistance variable element (16) is configured such that a resistance variable layer (14) made of a metal oxide material is sandwiched between a lower electrode (13) and an upper electrode (15). The rectifying element (20) is connected to the resistance variable element (16), and is configured such that a blocking layer (18) is sandwiched between a first electrode layer (17) located on a lower side of the blocking layer (18) and a second electrode layer (19) located on an upper side of the blocking layer (18). The resistance variable element (16) and the rectifying element (20) are connected to each other in series in a thickness direction of the resistance variable layer (14), and the blocking layer (18) is formed as a barrier layer having a hydrogen barrier property.
    • 本发明被构造成使得在基板(12)上形成电阻可变元件(16)和整流元件(20)。 电阻可变元件(16)被构造为使得由金属氧化物材料制成的电阻变化层(14)夹在下电极(13)和上电极(15)之间。 整流元件(20)连接到电阻可变元件(16),并且被构造为使阻挡层(18)夹在位于阻挡层(18)的下侧的第一电极层(17)之间, 以及位于阻挡层(18)的上侧的第二电极层(19)。 电阻可变元件(16)和整流元件(20)在电阻变化层(14)的厚度方向上串联连接,并且阻挡层(18)形成为具有氢的阻挡层 屏障属性。