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71. 发明授权

US07672110B2 Electrostatic chuck having textured contact surface 有权
标题翻译：具有纹理接触表面的静电吸盘
公开(公告)号：US07672110B2
公开(公告)日：2010-03-02
申请号：US11214286
申请日：2005-08-29
申请人： Jennifer Y. Sun , James Dempster , Semyon L. Kats , Allen Fox
发明人： Jennifer Y. Sun , James Dempster , Semyon L. Kats , Allen Fox
IPC分类号： H01L21/683 , H01T23/00 , B23B31/28
CPC分类号： H01L21/6833 , Y10T279/23
摘要： An electrostatic chuck has an electrode embedded in a dielectric which is mounted on a pedestal. The dielectric has a contact surface with an average surface roughness of less than about 0.5 μm, a surface peak waviness of less than about 0.12 μm, and a surface peak waviness material ratio of greater than about 20%. The surface texture can be formed by lapping the dielectric surface with a slurry of abrasive particles.
摘要翻译：静电吸盘具有嵌入在基座上的电介质中的电极。电介质具有平均表面粗糙度小于约0.5μm的接触表面，小于约0.12μm的表面波峰波纹，以及大于约20％的表面波峰厚度材料比。可以通过用研磨颗粒的浆料研磨电介质表面来形成表面纹理。

72. 发明申请

US20080261800A1 EROSION RESISTANCE ENHANCED QUARTZ USED IN PLASMA ETCH CHAMBER 有权
标题翻译：在等离子体蚀刻室中使用的耐腐蚀性增强石墨
公开(公告)号：US20080261800A1
公开(公告)日：2008-10-23
申请号：US11738030
申请日：2007-04-20
申请人： Jie Yuan , Jennifer Y. Sun , Renguan Duan
发明人： Jie Yuan , Jennifer Y. Sun , Renguan Duan
IPC分类号： C04B35/505
CPC分类号： C03C3/06 , C03B32/00 , C03B2201/24 , C03B2201/34 , C03B2201/36 , C03C2201/3411 , C03C2201/36 , C03C2203/54 , H01L21/67069 , H01L21/68721 , H01L21/68735 , H01L21/68757 , Y02P40/57 , Y10S156/915
摘要： A method of fabricating doped quartz component is provided herein. In one embodiment, the doped quartz component is a yttrium doped quartz ring configured to support a substrate. In another embodiment, the doped quartz component is a yttrium and aluminum doped cover ring. In yet another embodiment, the doped quartz component is a yttrium, aluminum and nitrogen containing cover ring.
摘要翻译：本文提供了一种制造掺杂石英组分的方法。在一个实施例中，掺杂的石英组件是被配置为支撑衬底的掺钇的石英环。在另一个实施例中，掺杂的石英组件是掺钇和铝的覆盖环。在另一个实施方案中，掺杂的石英组分是含钇，铝和氮的覆盖环。

73. 发明申请

US20080029032A1 SUBSTRATE SUPPORT WITH PROTECTIVE LAYER FOR PLASMA RESISTANCE 审中-公开
标题翻译：基板支持保护层进行等离子体电阻
公开(公告)号：US20080029032A1
公开(公告)日：2008-02-07
申请号：US11461643
申请日：2006-08-01
申请人： Jennifer Y. Sun , Irene A. Chou
发明人： Jennifer Y. Sun , Irene A. Chou
IPC分类号： H01L21/306 , C23C16/00
CPC分类号： H02N13/00 , H01L21/6833 , H01L21/68757
摘要： Embodiments of the present invention provide a substrate support assembly having a protective layer that enhances plasma resistance. In one embodiment, a substrate support assembly includes an electrostatic chuck having an upper substrate support surface, and a protective layer disposed on the electrostatic chuck, wherein the protective layer is fabricated by a ceramic material containing a rare earth metal.
摘要翻译：本发明的实施例提供了具有增强等离子体电阻的保护层的基板支撑组件。在一个实施例中，基板支撑组件包括具有上基板支撑表面的静电卡盘和设置在静电卡盘上的保护层，其中保护层由含有稀土金属的陶瓷材料制成。

74. 发明授权

US09281226B2 Electrostatic chuck having reduced power loss 有权
标题翻译：静电吸盘具有降低的功率损耗
公开(公告)号：US09281226B2
公开(公告)日：2016-03-08
申请号：US13766208
申请日：2013-02-13
申请人： Konstantin Makhratchev , Jennifer Y. Sun
发明人： Konstantin Makhratchev , Jennifer Y. Sun
IPC分类号： B23K10/00 , H01L21/683 , H01R43/16 , H01L21/67
CPC分类号： H01L21/6833 , B23K10/00 , H01L21/67103 , H01R43/16 , Y10T29/49204
摘要： Embodiments of the invention generally relate to an electrostatic chuck having reduced power loss, and methods and apparatus for reducing power loss in an electrostatic chuck, as well as methods for testing and manufacture thereof. In one embodiment, an electrostatic chuck is provided. The electrostatic chuck includes a conductive base, and a ceramic body disposed on the conductive base, the ceramic body comprising an electrode and one or more heating elements embedded therein, wherein the ceramic body comprises a dissipation factor of about 0.11 to about 0.16 and a capacitance of about 750 picoFarads to about 950 picoFarads between the electrode and the one or more heating elements.
摘要翻译：本发明的实施例一般涉及具有降低的功率损耗的静电卡盘，以及用于减少静电卡盘中的功率损耗的方法和装置，以及用于其的测试和制造方法。在一个实施例中，提供静电卡盘。静电卡盘包括导电基体和布置在导电基底上的陶瓷体，陶瓷体包括电极和嵌入其中的一个或多个加热元件，其中陶瓷体包括约0.11至约0.16的损耗因数和电容在电极和一个或多个加热元件之间约750皮微米至约950皮克级。

75. 发明申请

US20130344285A1 ADHESIVE MATERIAL USED FOR JOINING CHAMBER COMPONENTS 审中-公开
标题翻译：用于接合室内组件的胶粘材料
公开(公告)号：US20130344285A1
公开(公告)日：2013-12-26
申请号：US13988656
申请日：2011-11-07
申请人： Jennifer Y. Sun , Sumanth Banda
发明人： Jennifer Y. Sun , Sumanth Banda
IPC分类号： B32B7/12 , H01L21/02 , B32B9/00 , B32B3/26 , B32B9/04
CPC分类号： B32B7/12 , B32B3/266 , B32B9/005 , B32B9/041 , C09J183/00 , H01L21/02 , H01L21/67109 , H01L21/6719 , H01L21/6831 , Y10T428/24322 , Y10T428/31663
摘要： Embodiments of the invention provide a robust bonding material suitable for joining semiconductor processing chamber components. Other embodiments provide semiconductor processing chamber components joined using an adhesive material with desired characteristics. In one embodiment, an adhesive material suitable for joining semiconductor chamber components includes an adhesive material having a Young's-modulus lower than 300 psi. In another embodiment, a semiconductor chamber component includes a first surface disposed adjacent a second surface, and an adhesive material coupling the first and second surfaces, wherein the adhesive material has a Young's modulus lower than 300 psi.
摘要翻译：本发明的实施例提供了适用于接合半导体处理室部件的坚固的接合材料。其他实施例提供使用具有期望特性的粘合剂材料连接的半导体处理室部件。在一个实施例中，适于接合半导体室部件的粘合剂材料包括具有低于300psi的杨氏模量的粘合剂材料。在另一个实施例中，半导体室部件包括邻近第二表面设置的第一表面和连接第一和第二表面的粘合材料，其中粘合材料具有低于300psi的杨氏模量。

76. 发明申请

US20120118510A1 METHOD FOR DEBONDING COMPONENTS IN A CHAMBER 审中-公开
标题翻译：用于在室内去除组件的方法
公开(公告)号：US20120118510A1
公开(公告)日：2012-05-17
申请号：US13294012
申请日：2011-11-10
申请人： Sumanth Banda , Jennifer Y. Sun
发明人： Sumanth Banda , Jennifer Y. Sun
IPC分类号： B32B38/10
CPC分类号： B32B38/10 , B32B2457/00 , H01J37/32082 , H01L21/67092 , H01L21/6831 , H01L21/68785 , Y10T156/1116 , Y10T156/1168
摘要： Embodiments of the invention provide a method for debonding chamber component used in a semiconductor processing chamber. In one embodiment, a method for debonding chamber components used in a semiconductor processing chamber includes providing a first chamber component and a second chamber component bonded by an adhesive material disposed at an interface defined between the first and the second chamber components, soaking the bonded first and the second chamber components into an organic solution for between about 8 hours to about 240 hours, and removing the bonded first and the second chamber from the organic solution; and mechanically separating the soaked first and the second chamber components.
摘要翻译：本发明的实施例提供一种用于半导体处理室中使用的室分离方法。在一个实施例中，用于在半导体处理室中使用的用于脱离室组件的方法包括提供第一室部件和第二室部件，第一室部件和第二室部件通过布置在第一和第二室部件之间的界面处的粘合剂材料粘合，并将第二室分成有机溶液约8小时至约240小时，并从有机溶液中除去粘合的第一和第二室; 并机械地分离浸渍的第一和第二室组分。

77. 发明授权

US07718559B2 Erosion resistance enhanced quartz used in plasma etch chamber 有权
标题翻译：用于等离子体蚀刻室的耐腐蚀性增强的石英
公开(公告)号：US07718559B2
公开(公告)日：2010-05-18
申请号：US11738030
申请日：2007-04-20
申请人： Jie Yuan , Jennifer Y. Sun , Renguan Duan
发明人： Jie Yuan , Jennifer Y. Sun , Renguan Duan
IPC分类号： C03C3/06 , C03C3/04
CPC分类号： C03C3/06 , C03B32/00 , C03B2201/24 , C03B2201/34 , C03B2201/36 , C03C2201/3411 , C03C2201/36 , C03C2203/54 , H01L21/67069 , H01L21/68721 , H01L21/68735 , H01L21/68757 , Y02P40/57 , Y10S156/915
摘要： A method of fabricating doped quartz component is provided herein. In one embodiment, the doped quartz component is a yttrium doped quartz ring configured to support a substrate. In another embodiment, the doped quartz component is a yttrium and aluminum doped cover ring. In yet another embodiment, the doped quartz component is a yttrium, aluminum and nitrogen containing cover ring.
摘要翻译：本文提供了一种制造掺杂石英组分的方法。在一个实施例中，掺杂的石英组件是被配置为支撑衬底的掺钇的石英环。在另一个实施例中，掺杂的石英组件是掺钇和铝的覆盖环。在另一个实施方案中，掺杂的石英组分是含钇，铝和氮的覆盖环。

78. 发明授权

US07473152B1 Sealing of flat-panel device 失效
标题翻译：密封平板设备
公开(公告)号：US07473152B1
公开(公告)日：2009-01-06
申请号：US10768806
申请日：2004-01-30
申请人： Paul N. Ludwig , Theodore S. Fahlen , Shinji Kanagawa , Jennifer Y. Sun
发明人： Paul N. Ludwig , Theodore S. Fahlen , Shinji Kanagawa , Jennifer Y. Sun
IPC分类号： H01J9/00
CPC分类号： H01J9/261 , H01J2211/48 , H01J2329/867 , H01J2329/8675
摘要： A flat-panel display is hermetically sealed by a process in which a first plate structure (30) is positioned generally opposite a second plate structure (32) such that sealing material (34) provided over the second plate structure lies between the plate structures. In a gravitational sealing technique, the first plate structure is positioned vertically below the second plate structure. The sealing material is heated so that it moves vertically downward under gravitational influence to meet the first plate structure and seal the plate structures together. In a global-heating gap-jumping technique, the plate structures and sealing material are globally heated to cause the sealing material to jump a gap between the sealing material and the first plate structure. When the first plate structure is positioned vertically above the second plate structure, the sealing material moves vertically upward to meet the first plate structure and close the gap.
摘要翻译：平板显示器通过其中第一板结构（30）大致相对于第二板结构（32）定位的过程而气密地密封，使得设置在第二板结构上方的密封材料（34）位于板结构之间。在重力密封技术中，第一板结构位于第二板结构的垂直下方。密封材料被加热，使得其在重力作用下垂直向下移动以满足第一板结构并将板结构密封在一起。在全局加热间隙跳跃技术中，板结构和密封材料被全局加热，使得密封材料在密封材料和第一板结构之间跳跃间隙。当第一板结构垂直地位于第二板结构上方时，密封材料垂直向上移动以满足第一板结构并闭合间隙。

79. 发明授权

US06682627B2 Process chamber having a corrosion-resistant wall and method 失效
标题翻译：处理室具有耐腐蚀壁和方法
公开(公告)号：US06682627B2
公开(公告)日：2004-01-27
申请号：US09962626
申请日：2001-09-24
申请人： Shamouil Shamouilian , Jennifer Y. Sun , Ananda H. Kumar
发明人： Shamouil Shamouilian , Jennifer Y. Sun , Ananda H. Kumar
IPC分类号： H05H100
CPC分类号： C04B41/009 , C04B41/4842 , C04B41/83 , H01J37/32467 , H01J2237/022 , C04B35/00 , C04B35/565
摘要： A substrate processing chamber has a substrate support, a gas supply, a gas exhaust, a gas energizer, and a wall about the substrate support, the wall having a porous ceramic material at least partially infiltrated with a fluorinated polymer, whereby a substrate on the substrate support may be processed by gas introduced by the gas supply, energized by the gas energizer, and exhausted by the gas exhaust.
摘要翻译：衬底处理室具有衬底支撑件，气体供应器，气体排出器，气体激发器和围绕衬底支撑件的壁，所述壁具有至少部分地被氟化聚合物渗透的多孔陶瓷材料，由此，衬底支撑件可以由气体源引入的气体进行处理，由气体激发器激励并被排气排出。

80. 发明授权

US06278066B1 Self-standing spacer wall structures 失效
标题翻译：自立间隔壁结构
公开(公告)号：US06278066B1
公开(公告)日：2001-08-21
申请号：US08771453
申请日：1996-12-20
申请人： Theodore S. Fahlen , Alfred S. Conte , Robert M. Duboc, Jr. , George B. Hopple , John K. O'Reilly , Vasil M. Chakarov , Robert L. Marion , Steve T. Cho , Robert G. Neimeyer , Jennifer Y. Sun , David L. Morris , Christopher J. Spindt , Kollengode S. Narayanan
发明人： Theodore S. Fahlen , Alfred S. Conte , Robert M. Duboc, Jr. , George B. Hopple , John K. O'Reilly , Vasil M. Chakarov , Robert L. Marion , Steve T. Cho , Robert G. Neimeyer , Jennifer Y. Sun , David L. Morris , Christopher J. Spindt , Kollengode S. Narayanan
IPC分类号： H05K111
CPC分类号： H01J9/242 , H01J29/864 , H01J31/127 , H01J2329/8625 , H01J2329/864 , H01J2329/8645 , H01J2329/8665 , Y10T29/49004 , Y10T29/49117
摘要： A spacer (100 or 600/1000A/1000B) situated between a faceplate structure (301) and a backplate structure (302) of a flat panel display is configured to be self standing. In one implementation, a pair of spacer feet (111 or 113 and 112 or 114) are located over the same face surface, or over opposite face surfaces, of a spacer wall (101) near opposite ends of the wall. An edge electrode (121 or 122) is located over an edge surface of the spacer adjacent to the faceplate structure or the backplate structure. In another implementation, a spacer clip (1000A or 1000B) clamps opposite face surfaces of a spacer wall (600) largely at one end of the wall.
摘要翻译：位于平板显示器的面板结构（301）和背板结构（302）之间的间隔物（100或600 / 1000A / 1000B）构造成自立。在一个实施方式中，一对间隔脚（111或113和112或114）位于靠近壁的相对端的间隔壁（101）的相同的面表面上或相对的表面上方。边缘电极（121或122）位于隔板的与面板结构或背板结构相邻的边缘表面上方。在另一实施方案中，间隔夹（1000A或1000B）主要在壁的一端处夹紧间隔壁（600）的相对的面表面。

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