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    • 72. 发明授权
    • Transistor and process for fabricating the same
    • 晶体管及其制造方法
    • US06261875B1
    • 2001-07-17
    • US09432109
    • 1999-11-02
    • Hongyong ZhangToru TakayamaYasuhiko Takemura
    • Hongyong ZhangToru TakayamaYasuhiko Takemura
    • H01L2100
    • H01L21/2022H01L21/26506H01L29/4908H01L29/66757H01L29/66765H01L29/78618H01L29/78675H01L29/78678
    • A process for fabricating a thin film transistor, which comprises crystallizing an amorphous silicon film, forming thereon a gate insulating film and a gate electrode, implanting impurities in a self-aligned manner, adhering a coating containing a catalyst element which accelerates the crystallization of the silicon film, and annealing the resulting structure at a temperature lower than the deformation temperature of the substrate to activate the doped impurities. Otherwise, the catalyst element can be incorporated into the structure by introducing it into the impurity region by means of ion implantation and the like. Also a process for fabricating a thin film transistor, which comprises forming a gate electrode, a gate insulating film, and an amorphous silicon film on a substrate, implanting impurities into the amorphous silicon film to form source and drain regions as the impurity regions, introducing a catalyst element into the impurity region by adhering a coating containing the catalyst element of by means of ion doping and the like, and annealing the resulting structure at a temperature lower than the deformation temperature of the substrate to activate the doped impurities.
    • 一种制造薄膜晶体管的方法,包括使非晶硅膜结晶,在其上形成栅极绝缘膜和栅电极,以自对准的方式注入杂质,粘附含有催化剂元素的涂层,其加速了 硅膜,并在低于衬底的变形温度的温度下退火所得到的结构,以激活掺杂的杂质。 否则,可以通过离子注入等将催化剂元素引入到杂质区域中而将其结合到结构中。 还有一种制造薄膜晶体管的方法,其包括在衬底上形成栅电极,栅极绝缘膜和非晶硅膜,将杂质注入到非晶硅膜中以形成源区和漏区作为杂质区,引入 通过使含有催化剂元素的涂层通过离子掺杂等粘合而将催化剂元素进入杂质区域,并在低于基板的变形温度的温度下对所得结构退火以活化掺杂的杂质。
    • 73. 发明授权
    • Semiconductor device forming method
    • 半导体器件形成方法
    • US06140165A
    • 2000-10-31
    • US709111
    • 1996-09-06
    • Hongyong ZhangToru TakayamaYasuhiko TakemuraAkiharu MiyanagaHisashi Ohtani
    • Hongyong ZhangToru TakayamaYasuhiko TakemuraAkiharu MiyanagaHisashi Ohtani
    • H01L21/20H01L21/336H01L21/77H01L21/84
    • H01L29/045H01L21/02532H01L21/02672H01L27/1277H01L27/1296H01L29/66757G09G2300/0408
    • In thin film transistors (TFTs) having an active layer of crystalline silicon adapted for mass production, a catalytic element is introduced into doped regions of an amorphous silicon film by ion implantation or other means. This film is crystallized at a temperature below the strain point of the glass substrate. Further, a gate insulating film and a gate electrode are formed. Impurities are introduced by a self-aligning process. Then, the laminate is annealed below the strain point of the substrate to activate the dopant impurities. On the other hand, Nickel or other element is also used as a catalytic element for promoting crystallization of an amorphous silicon film. First, this catalytic element is applied in contact with the surface of the amorphous silicon film. The film is heated at 450 to 650.degree. C. to create crystal nuclei. The film is further heated at a higher temperature to grow the crystal grains. In this way, a crystalline silicon film having improved crystallinity is formed.
    • 在具有适于批量生产的结晶硅有源层的薄膜晶体管(TFT)中,通过离子注入或其它方式将催化元素引入到非晶硅膜的掺杂区域中。 该膜在低于玻璃基板的应变点的温度下结晶。 此外,形成栅极绝缘膜和栅电极。 杂质通过自对准过程引入。 然后,层压体在基板的应变点以下退火以活化掺杂剂杂质。 另一方面,镍或其他元素也用作促进非晶硅膜结晶的催化元素。 首先,将该催化元件与非晶硅膜的表面接触。 将膜在450至650℃下加热以产生晶核。 将膜进一步在较高温度下加热以生长晶粒。 以这种方式,形成具有改善的结晶度的晶体硅膜。