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热词
    • 75. 发明授权
    • Multi-layer wiring
    • 多层接线
    • US5539227A
    • 1996-07-23
    • US510184
    • 1995-08-02
    • Hirofumi Nakano
    • Hirofumi Nakano
    • H01L23/482H01L23/522H01L23/532H01L23/535H01L29/43
    • H01L23/4821H01L23/5222H01L23/53242H01L2924/0002
    • A method of producing a multi-layer wiring, first kind layer wirings formed on a semiconductor substrate are covered by an insulating film, a part of a second kind layer wiring is formed at a prescribed region of the surface of the insulating film, and, thereafter, the remaining part of the second kind layer wiring and the third kind layer wiring are formed in the same process so that the remaining part of the second kind layer wiring and the first kind layer wiring cross each other in an airbridge structure and the third kind layer wiring and a part of the second kind layer wiring also cross each other in an airbridge structure. The portion of the second kind layer wiring other than the portion that crosses with the third kind layer wiring in an airbridge structure, is produced with the first kind layer wiring in an airbridge structure in the process of producing the third kind layer wiring. Therefore, at least one of the crossing parts between the first kind layer wiring and the second kind layer wiring can be formed in an airbridge structure, and as a result, a multi-layer wiring that has reduced inter-layer capacitance over all of the multi-layer wiring structure is obtained by the number of process steps as in the prior art.
    • 制造多层布线的方法,在半导体基板上形成的第一种类布线被绝缘膜覆盖,在绝缘膜表面的规定区域形成第二种类布线的一部分, 此后,第二种类布线和第三种类布线的剩余部分以相同的工艺形成,使得第二种类布线和第一种布线布线的剩余部分在空中桥梁结构中彼此交叉,而第三层布线 种类层布线和第二种类布线的一部分也在空气桥结构中彼此交叉。 在制造第三种类布线的过程中,利用空气桥结构中的第一种布线制造第二种类布线以外的与空中桥结构中的第三类布线交叉的部分的部分。 因此,能够以空气桥式结构形成第一种类布线和第二种类布线之间的交叉部分中的至少一方,结果,能够减少层间电容 通过现有技术中的工艺步骤的数量获得多层布线结构。