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71. 发明授权

US08115300B2 Wiring substrate and manufacturing method thereof, and semiconductor apparatus 有权
标题翻译：配线基板及其制造方法以及半导体装置
公开(公告)号：US08115300B2
公开(公告)日：2012-02-14
申请号：US11763053
申请日：2007-06-14
申请人： Shigetsugu Muramatsu , Tsuyoshi Kobayashi , Takashi Kurihara
发明人： Shigetsugu Muramatsu , Tsuyoshi Kobayashi , Takashi Kurihara
IPC分类号： H01L23/12
CPC分类号： H05K3/4647 , H01L21/486 , H01L23/49827 , H01L2224/16225 , H01L2224/48227 , H05K1/111 , H05K3/108 , H05K3/4007 , H05K2201/0367 , H05K2201/09909 , Y02P70/611
摘要： In a semiconductor apparatus, a semiconductor element is mounted on a wiring substrate. Wiring patterns and protrusions are formed on a surface of a substrate with the wiring patterns extending on tops of the protrusions. The surface of the substrate on which the wiring patterns are formed are covered with an insulating layer. Surfaces of connection parts of the wiring patterns formed on the tops of the protrusions are formed with the surfaces of the connection parts exposed to a surface of the insulating layer on a level with the surface of the insulating layer or in a position lower than the surface of the insulating layer. The connection parts are formed as pads for connection formed in alignment with connection electrodes of the semiconductor element. The semiconductor element is mounted by making electrical connection to the connection parts by flip chip bonding.
摘要翻译：在半导体装置中，将半导体元件安装在布线基板上。布线图案和突起形成在基板的表面上，布线图案在突起的顶部延伸。其上形成有布线图案的基板的表面被绝缘层覆盖。形成在突起的顶部上的布线图形的连接部分的表面形成有连接部分的表面暴露于绝缘层的表面与绝缘层的表面或低于表面的位置的绝缘层。连接部分形成为与半导体元件的连接电极对准形成的用于连接的焊盘。半导体元件通过倒装芯片接合与连接部分进行电连接来安装。

72. 发明申请

US20110285326A1 DISPLAY DEVICE SUBSTRATE AND MANUFACTURING METHOD THEREFOR 审中-公开
标题翻译：显示器件基板及其制造方法
公开(公告)号：US20110285326A1
公开(公告)日：2011-11-24
申请号：US13147554
申请日：2010-02-02
申请人： Masaru Kajitani , Takashi Kurihara , Yukiya Nishioka
发明人： Masaru Kajitani , Takashi Kurihara , Yukiya Nishioka
IPC分类号： H05B37/02 , H01J9/24
CPC分类号： H01L27/3253 , H01L27/3246
摘要： A display device substrate to be bonded to a driving substrate provided with a driving circuit for driving a plurality of organic electroluminescent elements, the display device substrate comprising a substrate main body; a plurality of organic electroluminescent elements provided on the substrate main body; a bank sectioning the plurality of organic electroluminescent elements on the substrate main body; a protruding pedestal provided on the substrate main body; and a first connecting electrode arranged so as to extend from the organic electroluminescent element and over the pedestal, wherein in a state where the display device substrate has been bonded to the driving substrate, the pedestal is arranged at a position where the first connecting electrode arranged on the pedestal is connected with a second connecting electrode that the driving circuit has, and the bank and the pedestal have the same height.
摘要翻译：一种显示装置用基板，其与被配置有驱动多个有机电致发光元件的驱动电路的驱动基板接合，所述显示装置用基板包括基板主体; 设置在所述基板主体上的多个有机电致发光元件; 在所述基板主体上划分所述多个有机电致发光元件的堤; 设置在基板主体上的突出台座; 以及第一连接电极，其从所述有机电致发光元件延伸并且在所述基座上方布置，其中在所述显示装置基板已经接合到所述驱动基板的状态下，所述基座被布置在所述第一连接电极布置在基座上与驱动电路所具有的第二连接电极连接，堤岸和基座具有相同的高度。

73. 发明授权

US07691473B2 Fiber-reinforced composite material, method for manufacturing the same, and applications thereof 有权
标题翻译：纤维增强复合材料及其制造方法及其应用
公开(公告)号：US07691473B2
公开(公告)日：2010-04-06
申请号：US12250778
申请日：2008-10-14
申请人： Hiroyuki Yano , Junji Sugiyama , Masaya Nogi , Shin-ichiro Iwamoto , Keishin Handa , Akira Nagai , Takao Miwa , Yoshitaka Takezawa , Toshiyuki Miyadera , Takashi Kurihara , Tohru Matsuura , Nobutatsu Koshoubu , Tohru Maruno
发明人： Hiroyuki Yano , Junji Sugiyama , Masaya Nogi , Shin-ichiro Iwamoto , Keishin Handa , Akira Nagai , Takao Miwa , Yoshitaka Takezawa , Toshiyuki Miyadera , Takashi Kurihara , Tohru Matsuura , Nobutatsu Koshoubu , Tohru Maruno
IPC分类号： B32B27/38
CPC分类号： G02B6/122 , B82Y30/00 , C08J5/005 , C08J5/04 , C08L101/00 , G02B6/10 , G02B6/4214 , G02B2006/12104 , G02B2006/12107 , H05K1/0366 , H05K2201/0108 , H05K2201/0251 , Y10T428/249924 , Y10T428/249928 , Y10T428/24994 , Y10T428/2965 , Y10T428/31518 , Y10T428/31525 , C08L2666/26
摘要： The present invention relates to a fiber-reinforced composite material and a method for manufacturing the same, and also relates to a transparent multilayered sheet, a circuit board, and an optical waveguide.
摘要翻译：纤维增强复合材料及其制造方法技术领域本发明涉及纤维增强复合材料及其制造方法，还涉及透明多层片材，电路基板和光波导。

74. 发明申请

US20090258460A1 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件的制造方法
公开(公告)号：US20090258460A1
公开(公告)日：2009-10-15
申请号：US12418637
申请日：2009-04-06
申请人： Kiyoshi Oi , Takashi Kurihara
发明人： Kiyoshi Oi , Takashi Kurihara
IPC分类号： H01L21/56
CPC分类号： H01L21/563 , H01L24/27 , H01L2224/29109 , H01L2224/29111 , H01L2224/2919 , H01L2224/73203 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/0132 , H01L2924/0133 , H01L2924/0134 , H01L2924/14 , H01L2924/1579 , H01L2924/0105 , H01L2924/01047 , H01L2924/0103 , H01L2924/01083 , H01L2924/01049 , H01L2924/0665
摘要： A manufacturing method of a semiconductor device includes a film state underfill resin adhering step wherein film state underfill resin in a semi-cured state is adhered on the first surface of the board main body without forming a gap between the first surface of the board main body and the pad; a flattening step wherein an upper surface of the film state underfill resin is flattened; a chip connecting step wherein the semiconductor chip is pressed onto the upper surface of the film state underfill resin after the flattening step so that the semiconductor chip is flip chip connected to the pad; and an underfill resin forming step wherein the film state underfill resin is cured so that the underfill resin is formed between the semiconductor chip and the wiring board.
摘要翻译：半导体器件的制造方法包括膜状态底部填充树脂粘合工序，其中半固化状态下的膜状态底部填充树脂粘附在板主体的第一表面上，而不在板主体的第一表面之间形成间隙和垫; 平坦化步骤，其中膜状态底部填充树脂的上表面变平; 芯片连接步骤，其中在平坦化步骤之后半导体芯片被压到膜状态底部填充树脂的上表面上，使得半导体芯片被倒装芯片连接到焊盘; 以及底部填充树脂形成步骤，其中所述膜状态底部填充树脂被固化，使得所述底部填充树脂形成在所述半导体芯片和所述布线板之间。

75. 发明申请

US20090123726A1 FIBER-REINFORCED COMPOSITE MATERIAL, METHOD FOR MANUFACTURING THE SAME, AND APPLICATIONS THEREOF 有权
标题翻译：纤维增强复合材料，其制造方法及其应用
公开(公告)号：US20090123726A1
公开(公告)日：2009-05-14
申请号：US12250778
申请日：2008-10-14
申请人： Hiroyuki YANO , Junji Sugiyama , Masaya Nogi , Shin-ichiro Iwamoto , Keishin Handa , Akira Nagai , Takao Miwa , Yoshitaka Takezawa , Toshiyuki Miyadera , Takashi Kurihara , Tohru Matsuura , Nobutatsu Koshoubu , Tohru Maruno
发明人： Hiroyuki YANO , Junji Sugiyama , Masaya Nogi , Shin-ichiro Iwamoto , Keishin Handa , Akira Nagai , Takao Miwa , Yoshitaka Takezawa , Toshiyuki Miyadera , Takashi Kurihara , Tohru Matsuura , Nobutatsu Koshoubu , Tohru Maruno
IPC分类号： D04H13/00
CPC分类号： G02B6/122 , B82Y30/00 , C08J5/005 , C08J5/04 , C08L101/00 , G02B6/10 , G02B6/4214 , G02B2006/12104 , G02B2006/12107 , H05K1/0366 , H05K2201/0108 , H05K2201/0251 , Y10T428/249924 , Y10T428/249928 , Y10T428/24994 , Y10T428/2965 , Y10T428/31518 , Y10T428/31525 , C08L2666/26
摘要： The present invention relates to a fiber-reinforced composite material and a method for manufacturing the same, and also relates to a transparent multilayered sheet, a circuit board, and an optical waveguide.
摘要翻译：纤维增强复合材料及其制造方法技术领域本发明涉及纤维增强复合材料及其制造方法，还涉及透明多层片材，电路基板和光波导。

76. 发明申请

US20090115958A1 Lliquid Crystal Display Element 失效
标题翻译：液晶显示元件
公开(公告)号：US20090115958A1
公开(公告)日：2009-05-07
申请号：US11991793
申请日：2006-09-12
申请人： Takashi Kurihara , Yasuhiro Kume , Kazuhiko Tamai , Takaaki Okamoto , Shinya Saeki
发明人： Takashi Kurihara , Yasuhiro Kume , Kazuhiko Tamai , Takaaki Okamoto , Shinya Saeki
IPC分类号： G02F1/1333
CPC分类号： G02F1/13718 , G02F2001/133773
摘要： A liquid crystal display element of the present invention is arranged so that a material layer having dielectric anisotropy includes a chiral material and a liquid crystal material with a nematic liquid crystal phase, and 0.25≦d/p≦0.50 is satisfied assuming that the thickness of the material layer is d and the chiral pitch length of the liquid crystal material is p.
摘要翻译：本发明的液晶显示元件被布置成具有介电各向异性的材料层包括手性材料和具有向列液晶相的液晶材料，并且0.25 <= d / p <= 0.50，材料层的厚度为d，液晶材料的手性节距为p。

77. 发明申请

US20090060438A1 OPTICAL FIBER AND PRODUCTION METHOD THEREOF 有权
标题翻译：光纤及其制作方法
公开(公告)号：US20090060438A1
公开(公告)日：2009-03-05
申请号：US12261815
申请日：2008-10-30
申请人： Atsushi Mori , Masao Kato , Kouji Enbutsu , Shinichi Aozasa , Kiyoshi Oikawa , Takashi Kurihara , Kazuo Fujiura , Makoto Shimizu , Kouji Shikano
发明人： Atsushi Mori , Masao Kato , Kouji Enbutsu , Shinichi Aozasa , Kiyoshi Oikawa , Takashi Kurihara , Kazuo Fujiura , Makoto Shimizu , Kouji Shikano
IPC分类号： G02B6/036
CPC分类号： C03B37/01211 , C03B37/0122 , C03B37/01268 , C03B37/02781 , C03B2201/30 , C03B2201/60 , C03B2201/86 , C03B2203/10 , C03B2203/12 , C03B2203/14 , C03B2203/16 , C03B2203/22 , C03B2203/42 , C03B2205/10 , C03C13/048 , G02B6/02028 , G02B6/02214 , G02B6/02252 , G02B6/02266 , G02B6/02276 , G02B6/02333 , G02B6/02338 , G02B6/02347 , G02B6/02361 , G02B6/02366 , G02B6/02371 , G02B6/03627 , G02B6/03633 , G02B6/03644
摘要： An optical fiber, which has a zero-material dispersion wavelength equal to or greater than 2 μm, and a high nonlinear susceptibility χ3 equal to or greater than 1×10−12 esu, and uses tellurite glass having sufficient thermal stability for processing into a low loss fiber, employs a PCF structure or HF structure having strong confinement into a core region. This enables light to propagate at a low loss. The size and geometry of air holes formed in the core region, and the spacing between adjacent air holes make it possible to control the zero dispersion wavelength within an optical telecommunication window (1.2-1.7 μm), and to achieve large nonlinearity with a nonlinear coefficient γ equal to or greater than 500 W−1 km−1.
摘要翻译：具有等于或大于2μm的零材料分散波长和等于或大于1×10-12埃的高非线性磁化率chi3的光纤，并且使用具有足够热稳定性的碲化物玻璃加工成低损耗纤维，采用具有强限制的核心区域的PCF结构或HF结构。这使得光以低损耗传播。在核心区域形成的空气孔的尺寸和几何形状以及相邻气孔之间的间隔使得可以在光通信窗口（1.2-1.7μm）内控制零色散波长，并且通过非线性系数实现大的非线性等于或大于500W-1km-1。

78. 发明授权

US07492975B2 Optical switch, optical modulator and wavelength variable filter 有权
标题翻译：光开关，光调制器和波长可变滤波器
公开(公告)号：US07492975B2
公开(公告)日：2009-02-17
申请号：US10547493
申请日：2004-03-18
申请人： Seiji Toyoda , Kazuo Fujiura , Masahiro Sasaura , Koji Enbutsu , Makoto Shimokozono , Tadayuki Imai , Akiyuki Tate , Touru Matsuura , Takashi Kurihara , Hiroshi Fushimi
发明人： Seiji Toyoda , Kazuo Fujiura , Masahiro Sasaura , Koji Enbutsu , Makoto Shimokozono , Tadayuki Imai , Akiyuki Tate , Touru Matsuura , Takashi Kurihara , Hiroshi Fushimi
IPC分类号： G02F1/035
CPC分类号： G02F1/3551 , G02B6/12011 , G02B6/12023 , G02B2006/12142 , G02B2006/12145 , G02F1/225 , G02F1/3136 , G02F1/3137 , G02F1/365 , G02F2001/212 , G02F2201/124 , G02F2203/50
摘要： The present invention provides an optical switch, an optical modulator, and a wavelength variable filter each of which has a simple configuration, which requires only a low driving voltage, which is independent of polarization, and which can operate at high speed. An optical switch according to the present invention includes a 3-dB coupler (16) placed on an input, a 3-dB coupler (17) placed on an output, and two optical waveguides connecting the input-side 3-dB coupler and the output-side 3-dB coupler together. The optical switch also includes a phase modulating section (18) that applies electric fields to one or both of the two optical waveguides. At least two optical waveguides are a crystal material including KTaxNb1-xO3 (0
摘要翻译：本发明提供了一种光开关，光调制器和波长可变滤波器，每个滤波器具有简单的结构，其仅需要与极化无关的低驱动电压，并且可以高速运行。根据本发明的光开关包括放置在输入端的3-dB耦合器（16），放置在输出端的3-dB耦合器（17）和连接输入侧3-dB耦合器和输出端3 dB耦合器。光开关还包括对两个光波导中的一个或两个施加电场的相位调制部分（18）。至少两个光波导是包括KTaxNb1-xO3（0

79. 发明申请

US20080222880A1 SURGE PROTECTOR 有权
标题翻译：防护器
公开(公告)号：US20080222880A1
公开(公告)日：2008-09-18
申请号：US12106744
申请日：2008-04-21
申请人： Yasuhiro Shato , Tuyoshi Ogi , Miki Adachi , Sung-Gyoo Lee , Takashi Kurihara , Toshiaki Ueda
发明人： Yasuhiro Shato , Tuyoshi Ogi , Miki Adachi , Sung-Gyoo Lee , Takashi Kurihara , Toshiaki Ueda
IPC分类号： H01H69/02
CPC分类号： H01T4/12 , Y10T29/49082 , Y10T29/49107 , Y10T29/49128
摘要： A surge protector coated with an oxide layer having an excellent chemical stability at the high temperature range and excellent adherence with respect to main discharge electrodes. The surge protector includes a column-shaped ceramic member that has a conductive film divided by a discharge gap interposed therebetween; a pair of main discharge electrode members opposite to each other on both ends of the column-shaped ceramic member to come in contact with the conductive film; and a cylindrical ceramic tube which is fitted to the pair of main discharge electrode members opposite to each other to seal both the column-shaped ceramic member and sealing gas inside thereof. Oxide films are formed on main discharge surfaces of at least the protrusive supporting portions of the pair of main discharge electrode members opposite to each other, by performing an oxidation treatment, respectively.
摘要翻译：具有在高温范围内具有优异化学稳定性的氧化物层和相对于主放电电极具有优异粘附性的电涌保护器。浪涌保护器包括柱状陶瓷构件，其具有通过插入其间的放电间隙分隔的导电膜; 一对在柱状陶瓷构件的两端彼此相对的主放电电极构件，以与导电膜接触; 和一对圆筒状的陶瓷管，该圆筒形陶瓷管与一对相对的主放电电极部件嵌合，以密封柱状陶瓷部件和内部的密封气体。通过分别进行氧化处理，分别在一对主放电电极部件的至少突出支撑部的主放电面上形成氧化膜。

80. 发明申请

US20070290306A1 WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR APPARATUS 有权
标题翻译：配线基板及其制造方法及半导体装置
公开(公告)号：US20070290306A1
公开(公告)日：2007-12-20
申请号：US11763053
申请日：2007-06-14
申请人： Shigetsugu Muramatsu , Tsuyoshi Kobayashi , Takashi Kurihara
发明人： Shigetsugu Muramatsu , Tsuyoshi Kobayashi , Takashi Kurihara
IPC分类号： H01L21/00 , H01L23/02
CPC分类号： H05K3/4647 , H01L21/486 , H01L23/49827 , H01L2224/16225 , H01L2224/48227 , H05K1/111 , H05K3/108 , H05K3/4007 , H05K2201/0367 , H05K2201/09909 , Y02P70/611
摘要： In a semiconductor apparatus, a semiconductor element is mounted on a wiring substrate. Wiring patterns and protrusions are formed on a surface of a substrate with the wiring patterns extending on tops of the protrusions. The surface of the substrate on which the wiring patterns are formed are covered with an insulating layer. Surfaces of connection parts of the wiring patterns formed on the tops of the protrusions are formed with the surfaces of the connection parts exposed to a surface of the insulating layer on a level with the surface of the insulating layer or in a position lower than the surface of the insulating layer. The connection parts are formed as pads for connection formed in alignment with connection electrodes of the semiconductor element. The semiconductor element is mounted by making electrical connection to the connection parts by flip chip bonding.
摘要翻译：在半导体装置中，将半导体元件安装在布线基板上。布线图案和突起形成在基板的表面上，布线图案在突起的顶部延伸。其上形成有布线图案的基板的表面被绝缘层覆盖。形成在突起的顶部上的布线图形的连接部分的表面形成有连接部分的表面暴露于绝缘层的表面与绝缘层的表面或低于表面的位置的绝缘层。连接部分形成为与半导体元件的连接电极对准形成的用于连接的焊盘。半导体元件通过倒装芯片接合与连接部分进行电连接来安装。

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