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    • 71. 发明授权
    • Semiconductor memory device
    • 半导体存储器件
    • US07529130B2
    • 2009-05-05
    • US11389252
    • 2006-03-27
    • Haruki Toda
    • Haruki Toda
    • G11C16/06
    • G11C11/5642G11C7/06G11C16/0483G11C16/28G11C2211/5631G11C2211/5634
    • A semiconductor memory device includes: a memory cell array with electrically rewritable and non-volatile memory cells arranged therein; and a sense amplifier circuit configured to read out data of the memory cell array, wherein a plurality of information cells, in each of which one of M(M≧2) physical quantity levels is written, and at least one reference cell, in which a reference physical quantity level is written, are defined in the memory cell array, and the sense amplifier circuit detects a cell current difference between the information cell and the reference cell selected simultaneously in the memory cell array to sense data defined by the M physical quantity levels of the information cell.
    • 半导体存储器件包括:具有布置在其中的电可重写和非易失性存储单元的存储单元阵列; 以及读出放大器电路,被配置为读出存储单元阵列的数据,其中写入了M(M> = 2)个物理量级别中的一个的多个信息单元和至少一个参考单元, 在存储单元阵列中定义参考物理量级别,并且读出放大器电路检测在存储单元阵列中同时选择的信息单元和参考单元之间的单元电流差,以感测由M个物理 信息单元的数量级别。
    • 74. 发明申请
    • RESISTANCE CHANGE MEMORY DEVICE
    • 电阻变化存储器件
    • US20070285966A1
    • 2007-12-13
    • US11761391
    • 2007-06-12
    • Haruki TodaKoichi Kubo
    • Haruki TodaKoichi Kubo
    • G11C11/36
    • G11C13/0007G11C13/0004G11C13/0011G11C13/0014G11C13/0016G11C13/004G11C2013/0042G11C2213/31G11C2213/32G11C2213/55G11C2213/56G11C2213/71G11C2213/72
    • A resistance change memory device including: a semiconductor substrate; at least one cell array formed above the semiconductor substrate to have a stack structure of a variable resistance element and an access element, the variable resistance element storing a high resistance state or a low resistance state in a non-volatile manner, the access element having such an off-state resistance value in a certain voltage range that is ten times or more as high as that in a select state; and a read/write circuit formed on the semiconductor substrate, wherein the variable resistance element includes: a recording layer formed of a composite compound containing at least one transition element and a cavity site for housing a cation ion; and electrodes formed on the opposite sides of the recording layer, one of the electrodes serving as a cation source in a write or erase mode for supplying a cation to the recording layer to be housed in the cavity site therein.
    • 一种电阻变化存储器件,包括:半导体衬底; 至少一个单元阵列形成在所述半导体衬底上方以具有可变电阻元件和存取元件的堆叠结构,所述可变电阻元件以非易失性方式存储高电阻状态或低电阻状态,所述存取元件具有 在选择状态下为十倍以上的一定电压范围内的截止电阻值; 以及形成在所述半导体基板上的读/写电路,其中所述可变电阻元件包括:由包含至少一个过渡元件的复合化合物和用于容纳阳离子离子的空腔位置形成的记录层; 以及形成在记录层的相对侧上的电极,其中一个电极用作写入或擦除模式中的阳离子源,用于将阳离子供应到要容纳在其中的空腔位置的记录层。
    • 77. 发明授权
    • Semiconductor memory device
    • 半导体存储器件
    • US07158444B2
    • 2007-01-02
    • US11299758
    • 2005-12-13
    • Haruki TodaShozo SaitoKaoru Tokushige
    • Haruki TodaShozo SaitoKaoru Tokushige
    • G11C8/18
    • G11C7/1036G11C7/1018G11C7/1072G11C7/22G11C11/4076G11C11/4096G11C2207/107
    • A semiconductor memory device comprises a memory cell array and a control circuit. The memory cell array has a plurality of memory cells arranged in rows and columns. The memory cells store data and are selected according to address signals. The control circuit is configured to receive a clock signal and a first control signal, and output a plurality of data in response to the clock signal after the first control signal is asserted. After the first control signal is asserted, an internal signal which responds to the clock signal transits N times (N is a positive integer and greater than or equal to 2), then output of the data is started. At least one of the data is output at the transition after the output begins.
    • 半导体存储器件包括存储单元阵列和控制电路。 存储单元阵列具有以行和列排列的多个存储单元。 存储单元存储数据,并根据地址信号进行选择。 控制电路被配置为接收时钟信号和第一控制信号,并且在第一控制信号被断言之后响应于时钟信号输出多个数据。 在第一控制信号置位之后,响应时钟信号的内部信号转换N次(N为正整数,大于或等于2),则数据的输出开始。 在输出开始后的转换中输出至少一个数据。
    • 78. 发明申请
    • Semiconductor memory device
    • 半导体存储器件
    • US20060239073A1
    • 2006-10-26
    • US11389252
    • 2006-03-27
    • Haruki Toda
    • Haruki Toda
    • G11C16/04
    • G11C11/5642G11C7/06G11C16/0483G11C16/28G11C2211/5631G11C2211/5634
    • A semiconductor memory device includes: a memory cell array with electrically rewritable and non-volatile memory cells arranged therein; and a sense amplifier circuit configured to read out data of the memory cell array, wherein a plurality of information cells, in each of which one of M(M>2) physical quantity levels is written, and at least one reference cell, in which a reference physical quantity level is written, are defined in the memory cell array, and the sense amplifier circuit detects a cell current difference between the information cell and the reference cell selected simultaneously in the memory cell array to sense data defined by the M physical quantity levels of the information cell.
    • 半导体存储器件包括:具有布置在其中的电可重写和非易失性存储单元的存储单元阵列; 以及读出放大器电路,被配置为读出存储单元阵列的数据,其中写入了M(M> 2)个物理量级别中的一个的多个信息单元和至少一个参考单元,其中 在存储单元阵列中定义参考物理量电平,并且读出放大器电路检测在存储单元阵列中同时选择的信息单元和参考单元之间的单元电流差,以检测由M个物理量定义的数据 信息单元的级别。
    • 79. 发明申请
    • Semiconductor memory device
    • 半导体存储器件
    • US20060209593A1
    • 2006-09-21
    • US11360536
    • 2006-02-24
    • Haruki Toda
    • Haruki Toda
    • G11C16/04
    • G11C11/56G11C7/1006G11C11/5621G11C11/5628G11C11/5642G11C16/0483G11C16/3436G11C16/3445G11C16/3459G11C2211/5621G11C2211/5641
    • A semiconductor memory device includes a memory cell array with memory cells arranged therein, each memory cell being settable to have one of plural physical quantity levels, simultaneously selected two memory cells constituting a pair cell serving as a data storage unit, wherein each memory cell is set to have one in N (where N is an integer equal to three or more) physical quantity levels, and each pair cell is set to have different physical quantity levels in two memory cells therein, thereby storing M-value data defined by M=2n (where M>N and “n” is an integer equal to two or more), the M-value data being defined by such M combination states that differences of the physical quantity levels in the two memory cells are different from each other.
    • 半导体存储器件包括存储单元阵列,存储单元布置在其中,每个存储器单元可设置为具有多个物理量级别中的一个,同时选择构成用作数据存储单元的配对单元的两个存储器单元,其中每个存储单元是 设置为N(其中N是等于三个或更多个的整数)物理量级别中的一个,并且每对单元被设置为在其中的两个存储器单元中具有不同的物理量级别,从而存储由M = (其中M> N和“n”是等于2或更大的整数),M值数据由这样的M组合定义,即两个物理量水平的差异 存储单元彼此不同。
    • 80. 发明申请
    • Phase change memory device
    • 相变存储器件
    • US20060197115A1
    • 2006-09-07
    • US10551702
    • 2003-04-03
    • Haruki Toda
    • Haruki Toda
    • H01L29/768
    • G11C13/0004G11C5/02G11C7/18G11C13/0007G11C2211/4013G11C2213/31G11C2213/71G11C2213/72H01L27/2409H01L27/2481H01L45/06H01L45/1233
    • A phase change memory device has a semiconductor substrate; a plurality of cell arrays stacked above the semiconductor substrate, each cell array having memory cells arranged in a matrix manner for storing resistance values as data that are determined by phase change of the memory cells, bit lines each commonly connecting one ends of plural memory cells arranged along a first direction of the matrix and word lines each commonly connecting the other ends of plural memory cells arranged along a second direction of the matrix; a read/write circuit formed on the semiconductor substrate as underlying the cell arrays for reading and writing data of the cell arrays; first and second vertical wirings disposed outside of first and second boundaries that define a cell layout region of the cell arrays in the first direction to connect the bit lines of the respective cell arrays to the read/write circuit; and third vertical wirings disposed outside of one of third and fourth boundaries that define the cell layout region in the second direction to connect the word lines of the respective cell arrays to the read/write circuit.
    • 相变存储器件具有半导体衬底; 多个单元阵列,堆叠在半导体衬底之上,每个单元阵列具有以矩阵方式布置的存储单元,用于存储电阻值,作为通过存储单元的相变确定的数据,各通常连接多个存储单元的一端的位线 沿着矩阵的第一方向布置,每个字线通常连接沿矩阵的第二方向布置的多个存储单元的另一端; 在半导体衬底上形成的用于读取和写入单元阵列数据的单元阵列的读/写电路; 布置在第一和第二边界之外的第一和第二垂直布线,其限定第一方向上的单元阵列的单元布局区域,以将各单元阵列的位线连接到读/写电路; 以及第三垂直布线,其布置在第三和第四边界之一之外,其限定第二方向上的单元布局区域,以将各单元阵列的字线连接到读/写电路。