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71. 发明授权

US5324813A Low dielectric constant fluorinated polymers and methods of fabrication thereof 失效
标题翻译：低介电常数氟化聚合物及其制造方法
公开(公告)号：US5324813A
公开(公告)日：1994-06-28
申请号：US918814
申请日：1992-07-22
申请人： Gareth G. Hougham , Jane M. Shaw , Alfred Viehbeck
发明人： Gareth G. Hougham , Jane M. Shaw , Alfred Viehbeck
IPC分类号： C08G73/10 , C08G69/26
CPC分类号： C08G73/1039
摘要： Low dielectric constant polyimides formed from an optionally fluorinated dianhydride and a fluorinated diamine are described. The fluorine containing constituents are sterically disposed so that the dipole moment of the constituents tend to cancel out. Since fluorine containing diamines are generally nonreactive, to achieve a polyimide of high enough molecular weight to be practically useful, a method of fabrication of a high molecular weight polymer from monomers of low reactivity is provided. The monomers, such as a diamine and dianhydride are provided in a solution within which a low molecular weight polyamic acid is formed. The solution is dried. The polyamic acid used is cured to a low molecular weight polyimide. The polyimide is redisolved, redryed and recured enough times to build up the molecular weight to a useful level. The method is applicable to fabricating other polymers of high molecular weight, such as polyamides, polyesters and polyurethanes.
摘要翻译：描述了由任选氟化二酐和氟化二胺形成的低介电常数聚酰亚胺。含氟成分被空间排列，使得成分的偶极矩倾向于抵消。由于含氟二胺通常是非反应性的，为了实现高分子量的聚酰亚胺实际上是有用的，提供了由低反应性单体制备高分子量聚合物的方法。在形成低分子量聚酰胺酸的溶液中提供单体，例如二胺和二酐。将溶液干燥。使用的聚酰胺酸固化成低分子量聚酰亚胺。将聚酰亚胺重新溶解，重新混合并再次回收足够的时间以将分子量建立到有用的水平。该方法适用于制造其它高分子量聚合物，如聚酰胺，聚酯和聚氨酯。

72. 发明授权

US4846929A Wet etching of thermally or chemically cured polyimide 失效
标题翻译：热蚀刻或化学固化的聚酰亚胺的湿蚀刻
公开(公告)号：US4846929A
公开(公告)日：1989-07-11
申请号：US218384
申请日：1988-07-13
申请人： Steven L. Bard , Claudius Feger , John J. Glenning , Gareth G. Hougham , Steven E. Molis , Walter P. Pawlowski , John J. Ritsko , Peter Slota, Jr. , Randy W. Snyder
发明人： Steven L. Bard , Claudius Feger , John J. Glenning , Gareth G. Hougham , Steven E. Molis , Walter P. Pawlowski , John J. Ritsko , Peter Slota, Jr. , Randy W. Snyder
IPC分类号： G03F7/26 , C08J7/12 , G03F7/40 , H01L21/306 , H01L21/311 , H05K1/03 , H05K3/00 , H05K3/10
CPC分类号： C08J7/12 , H01L21/31133 , H05K3/002 , C08J2379/08 , H05K1/0346 , H05K2201/0154 , H05K2203/0793 , H05K3/108
摘要： Polyimide is etched by contacting the polyimide with an aqueous solution of a metal hydroxide followed by contact with an acid followed by contact with an aqueous solution of a metal hydroxide. Etching of chemically cured polyimide can be enhanced by employing a presoaking in hot water. Also, partially etched chemically cured polyimide is removed with a concentrated acid solution.In preparing a metal coated polyimide structure for subsequent gold plating, two flash etching steps with the polyimide etch between are employed after developing the photoresist.

73. 发明申请

US20120121906A1 NEGATIVE COEFFICIENT THERMAL EXPANSION ENGINEERED PARTICLES FOR COMPOSITE FABRICATION 失效
标题翻译：负极系列热膨胀工程颗粒复合材料
公开(公告)号：US20120121906A1
公开(公告)日：2012-05-17
申请号：US13356778
申请日：2012-01-24
申请人： Gareth G. Hougham , Vijayeshwar D. Khanna , Xiao Hu Liu , Gerard McVicker
发明人： Gareth G. Hougham , Vijayeshwar D. Khanna , Xiao Hu Liu , Gerard McVicker
IPC分类号： B32B7/04 , B32B5/16 , B32B7/02
CPC分类号： B32B37/144 , B32B38/1866 , B32B2311/24 , Y10T428/249971 , Y10T428/2982
摘要： Methods for the fabrication of negative coefficient thermal expansion engineered elements, and particularly, wherein such elements provide for fillers possessing a low or even potentially zero coefficient thermal expansion and which are employable as fillers for polymers possessing high coefficients of thermal expansion. Further, disclosed are novel structures, which are obtained by the inventive methods.
摘要翻译：用于制造负系数热膨胀工程元件的方法，特别地，其中这些元件提供具有低或甚至潜在的零系数热膨胀的填料，并且其可用作具有高热膨胀系数的聚合物的填料。此外，公开了通过本发明方法获得的新颖结构。

74. 发明申请

US20090169886A1 NEGATIVE COEFFICIENT THERMAL EXPANSION ENGINEERED PARTICLES FOR COMPOSITE FABRICATION 有权
标题翻译：负极系列热膨胀工程颗粒复合材料
公开(公告)号：US20090169886A1
公开(公告)日：2009-07-02
申请号：US11967459
申请日：2007-12-31
申请人： Gareth G. Hougham , Vijayeshwar D. Khanna , Xiao Hu Liu , Gerard McVicker
发明人： Gareth G. Hougham , Vijayeshwar D. Khanna , Xiao Hu Liu , Gerard McVicker
IPC分类号： B32B5/16 , B23K26/20
CPC分类号： B32B37/144 , B32B38/1866 , B32B2311/24 , Y10T428/249971 , Y10T428/2982
摘要： Methods for the fabrication of negative coefficient thermal expansion engineered elements, and particularly, wherein such elements provide for fillers possessing a low or even potentially zero coefficient thermal expansion and which are employable as fillers for polymers possessing high coefficients of thermal expansion. Further, disclosed are novel structures, which are obtained by the inventive methods.
摘要翻译：用于制造负系数热膨胀工程元件的方法，特别地，其中这些元件提供具有低或甚至潜在的零系数热膨胀的填料，并且其可用作具有高热膨胀系数的聚合物的填料。此外，公开了通过本发明方法获得的新颖结构。

75. 发明申请

US20090044405A1 Interposer with Electrical Contact Button and Method 审中-公开
标题翻译：内插器与电触点按钮和方法
公开(公告)号：US20090044405A1
公开(公告)日：2009-02-19
申请号：US12032008
申请日：2008-02-15
申请人： Gareth G. Hougham , Keith E. Fogel , Joanna Rosner , Paul A. Lauro , Sherif Goma , Joseph Zinter, JR.
发明人： Gareth G. Hougham , Keith E. Fogel , Joanna Rosner , Paul A. Lauro , Sherif Goma , Joseph Zinter, JR.
IPC分类号： H01R9/00
CPC分类号： H05K7/1069 , H01L23/49827 , H01L2924/0002 , H01L2924/09701 , H01R12/52 , H05K3/326 , H05K3/4092 , H05K3/42 , H05K2201/10378 , H05K2203/308 , Y10T29/49147 , Y10T29/49151 , Y10T29/49155 , Y10T29/49156 , Y10T29/49204 , Y10T29/49222 , H01L2924/00
摘要： An interposer having one or more hollow electrical contact buttons disposed in a carrier. The interposer is formed by disposing sacrificial posts in vias of the carrier. The electrical contact buttons are formed on the sacrificial posts by a metallizing process in desired pattern using a mask. The sacrificial posts are made of a material that thermally decomposes upon application of heat without altering the carrier or the electrical contact buttons.
摘要翻译：具有设置在载体中的一个或多个中空电触点按钮的插入器。中间层通过在载体的通孔中设置牺牲柱而形成。通过使用掩模的期望图案的金属化处理在牺牲柱上形成电接触按钮。牺牲柱由在施加热量时热分解而不改变载体或电触点按钮的材料制成。

76. 发明申请

US20090042414A1 LAND GRID ARRAY FABRICATION USING ELASTOMER CORE AND CONDUCTING METAL SHELL OR MESH 失效
标题翻译：使用弹性体芯和导电金属壳或网的土地网阵列制造
公开(公告)号：US20090042414A1
公开(公告)日：2009-02-12
申请号：US12249035
申请日：2008-10-10
申请人： Gareth G. Hougham , Keith E. Fogel , Paul A. Lauro , Joseph Zinter, JR.
发明人： Gareth G. Hougham , Keith E. Fogel , Paul A. Lauro , Joseph Zinter, JR.
IPC分类号： H01R12/00
CPC分类号： H01R13/2414 , H01R12/7082 , H01R12/714 , H01R43/007 , H05K3/4007 , H05K3/42 , H05K7/1061 , H05K2201/0133 , H05K2201/0367 , H05K2201/0959 , H05K2201/10378 , Y10S439/931 , Y10T442/109 , Y10T442/172
摘要： Methods for fabricating Land Grid Array (LGA) interposer contacts that are both conducting and elastic. Also provided are LGA interposer contacts as produced by the inventive methods. Provided is LGA type which utilizes a pure unfilled elastomer button core that is covered with an electrically-conductive material that is continuous from the top surface to the bottom surface of the button structure. In order to obviate the disadvantages and drawbacks which are presently encountered in the technology pertaining to the fabrication and structure of land grid arrays using electrically-conductive interposer contacts, there is provided both methods and structure for molding elastomer buttons into premetallized LGA carrier sheets, and wherein the non-conductive elastomer buttons are surface-metallized in order to convert them into conductive electrical contacts.
摘要翻译：制造导电和弹性的Land Grid Array（LGA）插入器触点的方法。还提供了通过本发明的方法制造的LGA插入器触点。提供了LGA型，其利用由从按钮结构的顶表面到底表面连续的导电材料覆盖的纯未填充弹性体按钮芯。为了消除在使用导电插入器触点的地面栅格阵列的制造和结构的技术中目前遇到的缺点和缺点，提供了用于将弹性体按钮模制成预金属化的LGA载体片的方法和结构，以及其中非导电弹性体按钮被表面金属化以便将它们转换为导电电触点。

77. 发明授权

US08449971B2 Thermal expansion control employing platelet fillers 有权
标题翻译：使用血小板填充剂的热膨胀控制
公开(公告)号：US08449971B2
公开(公告)日：2013-05-28
申请号：US13083803
申请日：2011-04-11
申请人： Gareth G. Hougham , Xiao H. Liu
发明人： Gareth G. Hougham , Xiao H. Liu
IPC分类号： B32B3/26
CPC分类号： C08L63/00 , B32B7/02 , B32B7/12 , B32B9/005 , B32B9/04 , B32B15/043 , B32B27/281 , B32B2250/02 , B32B2250/24 , C08G73/105 , C08G73/1067 , C08G73/1071 , C08K7/00 , C08K2201/002 , Y10T428/249953 , Y10T428/249967 , Y10T428/249969 , Y10T428/24997 , Y10T428/249975 , Y10T428/249981 , Y10T428/249987 , Y10T428/249991
摘要： Bilayer platelet fillers are employed to compensate for a positive coefficient of thermal expansion (CTE) of an embedding polymeric material, or even to provide a composite structure having a negative CTE to eliminate or alleviate thermomechanical stress and/or delamination during thermal cycling. A bilayer platelet includes two joined layers having different CTEs. The CTE mismatch induces bending of the bilayer platelets, thereby causing cavities at temperatures lower than the joining temperature at which the bilayers are joined. The decrease in the volume of the polymeric material and the bilayer platelets at low temperatures is compensated by an accompanying increase in the volume of the cavities so that the composite structure has a temperature independent volume, a low net CTE, or even a negative CTE.
摘要翻译：双层血小板填料用于补偿嵌入聚合材料的正热膨胀系数（CTE），或甚至提供具有负CTE的复合结构以消除或减轻热机械应力和/或热循环期间的分层。双层血小板包括具有不同CTE的两个接合层。 CTE不匹配引起双层片晶的弯曲，从而在低于双层结合的接合温度的温度下引起空腔。聚合物材料和双层血小板在低温下体积的减少通过伴随空腔体积的增加来补偿，使得复合结构具有不依赖于温度的体积，低净CTE或甚至负的CTE。

78. 发明授权

US07784669B2 Method and process for reducing undercooling in a lead-free tin-rich solder alloy 有权
标题翻译：在无铅富锡焊料合金中减少过冷的方法和工艺
公开(公告)号：US07784669B2
公开(公告)日：2010-08-31
申请号：US12536122
申请日：2009-08-05
申请人： Gareth G. Hougham , Kamalesh K. Srivastava , Sung K. Kang , Da-Yuan Shih , Brian R. Sundlof , S. Jay Chey , Donald W. Henderson , David R. Di Milia , Richard P. Ferlita , Roy A. Carruthers
发明人： Gareth G. Hougham , Kamalesh K. Srivastava , Sung K. Kang , Da-Yuan Shih , Brian R. Sundlof , S. Jay Chey , Donald W. Henderson , David R. Di Milia , Richard P. Ferlita , Roy A. Carruthers
IPC分类号： B23K35/24
CPC分类号： B23K1/19 , B23K35/262 , H05K3/3436 , H05K3/3463 , H05K2201/0215
摘要： Briefly, a novel material process is disclosed wherein one or more nucleation modifiers are added, in trace amounts, to a lead-free tin-rich solder alloy to produce a solder composition with reduce or suppressed undercooling temperature characteristics. The modifier being a substance which facilitates the reduction of extreme anisotropic properties associated with body-centered-tetragonal tin based lead-free solder. The addition of the nucleation modifiers to the solder alloy does not materially effect the solder composition's melting point. As such, balls of solder with the nucleated composition freeze while other solder balls within the array remain in the melt. This effectively enables one substrate to be pinned to another substrate by one or more predetermined solder balls to secure the package while the remaining solder joints are in the liquid state. Further, the addition of a trace amount of nucleation sites within the composition facilitates control over the number, size, and orientations of primary intermetallic compounds in tin rich crystallite grains. Moreover, trace amounts of one or more solid and/or insoluble nucleating modifiers within a given volume of solder reduces the size of average crystallites within the composition.
摘要翻译：简而言之，公开了一种新颖的材料方法，其中将一种或多种成核改性剂以微量添加到无铅富锡焊料合金中以产生具有降低或抑制的过冷温度特性的焊料组合物。该改性剂是有助于减少与体心四方锡锡基无铅焊料相关的极端各向异性的物质。将成核改性剂添加到焊料合金中不会实质上影响焊料组合物的熔点。因此，具有成核组合物的焊料球冻结，而阵列内的其它焊球保持在熔体中。这有效地使一个基板通过一个或多个预定的焊球被固定到另一个基板，以固定封装，而剩余的焊点处于液态。此外，在组合物中添加微量的成核位点有助于控制富锡微晶颗粒中初级金属间化合物的数量，尺寸和取向。此外，在给定体积的焊料中痕量的一种或多种固态和/或不溶性成核改性剂减少了组合物内平均微晶的尺寸。

79. 发明申请

US20100200271A1 ADDITIVES FOR GRAIN FRAGMENTATION IN Pb-FREE Sn-BASED SOLDER 有权
标题翻译：无铅锡基焊锡颗粒分散添加剂
公开(公告)号：US20100200271A1
公开(公告)日：2010-08-12
申请号：US12704592
申请日：2010-02-12
申请人： Charles L. Arvin , Alexandre Blander , Peter J. Brofman , Donald W. Henderson , Gareth G. Hougham , Hsichang Liu , Eric D. Perfecto , Srinivasa S.N. Reddy , Krystyna W. Semkow , Kamalesh K. Srivastava , Brian R. Sundlof , Julien Sylvestre , Renee L. Weisman
发明人： Charles L. Arvin , Alexandre Blander , Peter J. Brofman , Donald W. Henderson , Gareth G. Hougham , Hsichang Liu , Eric D. Perfecto , Srinivasa S.N. Reddy , Krystyna W. Semkow , Kamalesh K. Srivastava , Brian R. Sundlof , Julien Sylvestre , Renee L. Weisman
IPC分类号： H01B5/00 , H01R43/00
CPC分类号： H01B1/02 , B23K35/0244 , B23K35/262 , B23K35/36 , B23K35/3602 , B82Y30/00 , C22C13/00 , H01B13/00 , H01L23/49866 , H01L2924/0002 , H05K3/3436 , H05K3/3463 , H05K2201/0209 , H05K2201/0257 , Y10T29/49117 , H01L2924/00
摘要： In one embodiment of the present invention, inert nano-sized particles having dimensions from 1 nm to 1,000 nm are added into a solder ball. The inert nano-sized particles may comprise metal oxides, metal nitrides, metal carbides, metal borides, etc. The inert nano-sized particles may be a single compound, or may be a metallic material having a coating of a different material. In another embodiment of the present invention, a small quantity of at least one elemental metal that forms stable high melting intermetallic compound with tin is added to a solder ball. The added at least one elemental metal forms precipitates of intermetallic compounds with tin, which are dispersed as fine particles in the solder.
摘要翻译：在本发明的一个实施方案中，将尺寸为1nm至1000nm的惰性纳米尺寸颗粒加入到焊球中。惰性纳米尺寸颗粒可以包括金属氧化物，金属氮化物，金属碳化物，金属硼化物等。惰性纳米尺寸颗粒可以是单一化合物，或者可以是具有不同材料的涂层的金属材料。在本发明的另一个实施方案中，将少量与锡形成稳定的高熔点金属间化合物的元素金属添加到焊料球中。添加的至少一种元素金属与锡形成金属间化合物的沉淀物，其作为细颗粒分散在焊料中。

80. 发明授权

US07648369B2 Interposer with electrical contact button and method 失效
标题翻译：内插器与电气接触按钮和方法
公开(公告)号：US07648369B2
公开(公告)日：2010-01-19
申请号：US11561273
申请日：2006-11-17
申请人： Gareth G. Hougham , Keith E. Fogel , Joanna Rosner , Paul A. Lauro , Sherif Goma , Joseph Zinter, Jr.
发明人： Gareth G. Hougham , Keith E. Fogel , Joanna Rosner , Paul A. Lauro , Sherif Goma , Joseph Zinter, Jr.
IPC分类号： H01R12/00
CPC分类号： H05K7/1069 , H01L23/49827 , H01L2924/0002 , H01L2924/09701 , H01R12/52 , H05K3/326 , H05K3/4092 , H05K3/42 , H05K2201/10378 , H05K2203/308 , Y10T29/49147 , Y10T29/49151 , Y10T29/49155 , Y10T29/49156 , Y10T29/49204 , Y10T29/49222 , H01L2924/00
摘要： An interposer having one or more hollow electrical contact buttons disposed in a carrier. The interposer is formed by disposing sacrificial posts in vias of the carrier. The electrical contact buttons are formed on the sacrificial posts by a metallizing process in desired pattern using a mask. The sacrificial posts are made of a material that thermally decomposes upon application of heat without altering the carrier or the electrical contact buttons.
摘要翻译：具有设置在载体中的一个或多个中空电触点按钮的插入器。中间层通过在载体的通孔中设置牺牲柱而形成。通过使用掩模的期望图案的金属化处理在牺牲柱上形成电接触按钮。牺牲柱由在施加热量时热分解而不改变载体或电触点按钮的材料制成。

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