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71. 发明申请

US20050197730A1 System and method for process contamination prevention for semiconductor manufacturing 有权
标题翻译：用于半导体制造的工艺污染防止系统和方法
公开(公告)号：US20050197730A1
公开(公告)日：2005-09-08
申请号：US10791930
申请日：2004-03-03
申请人： Chih-Wei Hsu , Span Lu , Kuang-Huan Hsu , Chen-Yung Lin , Shui-Tien Lin , Chun-Hung Lin
发明人： Chih-Wei Hsu , Span Lu , Kuang-Huan Hsu , Chen-Yung Lin , Shui-Tien Lin , Chun-Hung Lin
IPC分类号： G06F17/50 , G06F19/00 , H01L21/00
CPC分类号： G05B19/41875 , Y02P90/22
摘要： Provided are a system and method for preventing contamination in a semiconductor manufacturing environment. The method includes comparing one or more attributes associated with a product, such as a substrate, with one or more attributes associated with an operation. If the comparison indicates that the product is not compatible with the operation, then the operation is suspended with respect to the product. If the comparison indicates that the product is compatible with the operation, then the operation is performed on the product.
摘要翻译：提供一种用于防止半导体制造环境中的污染的系统和方法。该方法包括将与产品（例如底物）相关联的一个或多个属性与与操作相关联的一个或多个属性进行比较。如果比较表明该产品与该操作不兼容，则该操作将相对于该产品暂停。如果比较表示产品与操作兼容，则对产品执行操作。

72. 发明申请

US20050169053A1 Window-based flash memory storage system and management and access methods thereof 有权
标题翻译：基于窗口的闪存存储系统及其管理和访问方法
公开(公告)号：US20050169053A1
公开(公告)日：2005-08-04
申请号：US11096997
申请日：2005-03-31
申请人： Chun-Hung Lin , Chih-Hung Wang , Chun-Hao Kuo
发明人： Chun-Hung Lin , Chih-Hung Wang , Chun-Hao Kuo
IPC分类号： G06F12/06 , G06F11/16 , G06F12/00 , G06F12/02 , G06F12/08 , G06F13/00 , G11C7/10 , G11C11/34 , G11C16/00 , G11C16/06 , G11C29/00
CPC分类号： G06F12/0246 , G06F11/1068 , G06F11/1435 , G06F12/0292 , G06F2212/7203
摘要： A window-based flash memory storage system and a management and an access method therefor are proposed. The window-based flash memory storage system includes a window-based region and a redundant reserved region; wherein the window-based region is used to store a number of windows, each window being associated with a number of physical blocks. The redundant reserved region includes a dynamic-link area, a window-information area, a dynamic-link information area, and an boot-information area; wherein the dynamic-link area includes a plurality of dynamic allocation blocks, each being allocatable to any window. The window-information area is used to store a specific window-information set that is dedicated to a certain window within a specific range of data storage space. The dynamic-link information area is used to record the status of the allocation of the dynamic allocation blocks to the windows.
摘要翻译：提出了一种基于窗口的闪存存储系统及其管理和访问方法。基于窗口的闪存存储系统包括基于窗口的区域和冗余保留区域; 其中基于窗口的区域用于存储多个窗口，每个窗口与多个物理块相关联。冗余保留区域包括动态链路区域，窗口信息区域，动态链路信息区域和引导信息区域; 其中所述动态链接区域包括多个动态分配块，每个动态分配块可分配给任何窗口。窗口信息区域用于存储专用于数据存储空间的特定范围内的特定窗口的特定窗口信息集。动态链接信息区域用于将动态分配块的分配状态记录到窗口。

73. 发明授权

US06854713B2 Diaphragm valve 失效
标题翻译：隔膜阀
公开(公告)号：US06854713B2
公开(公告)日：2005-02-15
申请号：US10394001
申请日：2003-03-24
申请人： Chun-Hung Lin , Chen-Der Tsai , Chin-Ching Wu , Jung-Chen Ho , Hann-Tsong Wang
发明人： Chun-Hung Lin , Chen-Der Tsai , Chin-Ching Wu , Jung-Chen Ho , Hann-Tsong Wang
IPC分类号： F16K1/42 , F16K7/16 , F16K7/12
CPC分类号： F16K7/16 , F16K1/425
摘要： The diaphragm valve uses a metal dish-type diaphragm set to control the inflow and outflow of fluid. The metal dish-type diaphragm set is above an air flow channel to control the stem above the metal dish-type diaphragm set, and the air will be blocked by pressing the metal dish-type diaphragm to make it fit the metal valve base in the air flow channel; this non-metal valve base is fixed in the air flow channel by a fixed shrunk ring with a taper cross section, and the in-between metal diaphragm in the metal dish-type diaphragm set is annular in the center to reduce the metallic friction between metal diaphragms, to increase application times and to lower the leakage rate of the diaphragm valve.
摘要翻译：隔膜阀采用金属盘式隔膜套来控制流体的流入和流出。金属盘式隔膜组件位于空气流通道上方，用于控制金属盘式隔膜组件上方的杆，空气将通过按压金属盘型隔膜而阻塞，使其与金属阀座底座相配合气流通道; 该非金属阀座通过具有锥形横截面的固定收缩环固定在空气流动通道中，并且金属盘形隔膜组中的金属隔膜在中心是环形的，以减少金属间的金属摩擦金属隔膜，以增加施工时间并降低隔膜阀的泄漏率。

74. 发明授权

US06211574B1 Semiconductor package with wire protection and method therefor 有权
标题翻译：具有电线保护的半导体封装及其方法
公开(公告)号：US06211574B1
公开(公告)日：2001-04-03
申请号：US09292742
申请日：1999-04-16
申请人： Su Tao , Chun-Hung Lin , Tai-Chun Huang
发明人： Su Tao , Chun-Hung Lin , Tai-Chun Huang
IPC分类号： H01L2348
CPC分类号： H01L23/16 , H01L21/56 , H01L24/48 , H01L24/49 , H01L2224/05599 , H01L2224/4899 , H01L2224/49171 , H01L2224/85399 , H01L2224/8592 , H01L2924/00014 , H01L2924/181 , H01L2924/3862 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： A semiconductor package includes a semiconductor die mounted on an upper surface of a substrate. A number of wire bonds electrically connect between a number of bonding pads on the upper surface of the substrate and a number of bonding pads on an upper surface of the semiconductor die. A fixing portion surrounds the semiconductor die and covers a mediate portion of each wire bond. Encapsulating material is molded over the semiconductor die and the wire bonds to form an encapsulant. In an alternative embodiment, the fixing portion is provided on the upper surface of the substrate adjacent to a mold gate of the substrate where the wire sweeping is most likely to occur while molding. The fixing portion does not cover the semiconductor die to avoid thermal strain acting on the semiconductor die due to the different coefficients of thermal expansion between the fixing portion and the encapsulant.
摘要翻译：半导体封装包括安装在基板的上表面上的半导体管芯。多个引线键合电连接在衬底的上表面上的多个接合焊盘和半导体管芯的上表面上的多个接合焊盘之间。固定部围绕半导体管芯并覆盖每个引线接合的中间部分。封装材料被模制在半导体管芯上并且引线键合以形成密封剂。在替代实施例中，固定部分设置在与基板的模具浇口相邻的基板的上表面上，其中在模制时最可能发生金属丝扫掠。由于固定部和密封剂之间的热膨胀系数不同，固定部不覆盖半导体管芯，以避免作用在半导体管芯上的热应变。

75. 发明公开

US20230295627A1 Novel Replicase Cycling Reaction (RCR) and the Related SamRNA Designs Thereof 审中-公开
公开(公告)号：US20230295627A1
公开(公告)日：2023-09-21
申请号：US18156231
申请日：2023-01-18
申请人： Shi-Lung Lin , Sam Lin , Chun-Hung Lin
发明人： Shi-Lung Lin , Sam Lin , Chun-Hung Lin
IPC分类号： C12N15/113 , C12N9/12 , C12Q1/686
CPC分类号： C12N15/113 , C12N9/127 , C12Q1/686 , C12N2310/141 , C12Y207/07048
摘要： This invention generally relates to a novel composition of RNA/mRNA medicines as well as vaccines produced by using replicase- and/or RNA-dependent RNA polymerase (RdRp)-mediated RNA cycling reaction (RCR). The present invention is useful for developing a variety of self-amplifying RNA/mRNA (samRNA) medicines and vaccines containing at least a replicase/RdRp-binding site in the 5′- or 3′-end, or both, of any desired RNA molecule, including but not limited to antisense RNA (aRNA), small interferring RNA (siRNA), short hairpin RNA (shRNA), microRNA (miRNA)/miRNA precursor, long non-coding RNA (lnRNA) and mRNA. These RNA molecules can be either in single-stranded or in double-stranded, or mixed, conformation. The samRNA so obtained is useful not only for producing RNA-based vaccines and/or medicines but also for generating the mRNA-associated proteins, peptides, and/or antibodies under a proper in-vitro or in-cell translation condition. The replicase/RdRp-binding sites used in samRNA are derived or modified from coronaviral (e.g. COVID-19) and/or hepatitis C viral (HCV) RNA-dependent RNA polymerases (RdRp) in either single-stranded or double-stranded compositions.

76. 发明授权

US09502360B2 Stress compensation layer for 3D packaging 有权
标题翻译：应力补偿层用于3D包装
公开(公告)号：US09502360B2
公开(公告)日：2016-11-22
申请号：US13348449
申请日：2012-01-11
申请人： Chun-Hung Lin , Yu-Feng Chen , Han-Ping Pu , Hung-Jui Kuo
发明人： Chun-Hung Lin , Yu-Feng Chen , Han-Ping Pu , Hung-Jui Kuo
IPC分类号： H01L23/52 , H01L23/00 , H01L25/10 , H01L23/31 , H01L21/56 , H01L23/498
CPC分类号： H01L23/562 , H01L21/565 , H01L23/3121 , H01L23/3128 , H01L23/49822 , H01L25/105 , H01L2224/16225 , H01L2225/1023 , H01L2225/1058 , H01L2924/01322 , H01L2924/15311 , H01L2924/15321 , H01L2924/18161 , H01L2924/3511 , H01L2924/00
摘要： A stress compensation for use in packaging, and a method of forming, is provided. The stress compensation layer is placed on an opposing side of a substrate from an integrated circuit die. The stress compensation layer is designed to counteract at least some of the stress exerted structures on the die side of the substrate, such as stresses exerted by a molding compound that at least partially encapsulates the first integrated circuit die. A package may also be electrically coupled to the substrate.
摘要翻译：提供了用于包装的应力补偿，以及形成方法。应力补偿层从集成电路管芯放置在衬底的相对侧上。应力补偿层被设计成抵抗基板的模具侧上的应力施加结构中的至少一些，例如由至少部分地封装第一集成电路管芯的模制化合物施加的应力。封装还可以电耦合到衬底。

77. 发明授权

US09418947B2 Mechanisms for forming connectors with a molding compound for package on package 有权
标题翻译：用于在包装上封装的模塑料形成连接器的机构
公开(公告)号：US09418947B2
公开(公告)日：2016-08-16
申请号：US13406031
申请日：2012-02-27
申请人： Yu-Feng Chen , Chun-Hung Lin , Han-Ping Pu , Ming-Da Cheng , Kai-Chiang Wu
发明人： Yu-Feng Chen , Chun-Hung Lin , Han-Ping Pu , Ming-Da Cheng , Kai-Chiang Wu
IPC分类号： H01L23/48 , H01L23/00 , H01L25/10 , H01L23/498
CPC分类号： H01L25/0657 , H01L21/565 , H01L23/3107 , H01L23/49816 , H01L23/562 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L25/105 , H01L25/50 , H01L2224/03334 , H01L2224/0384 , H01L2224/0391 , H01L2224/0401 , H01L2224/05075 , H01L2224/05147 , H01L2224/05166 , H01L2224/05181 , H01L2224/05571 , H01L2224/06181 , H01L2224/11334 , H01L2224/1184 , H01L2224/1191 , H01L2224/13005 , H01L2224/13012 , H01L2224/13013 , H01L2224/13014 , H01L2224/13022 , H01L2224/13023 , H01L2224/13078 , H01L2224/131 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/13139 , H01L2224/13147 , H01L2224/13155 , H01L2224/16145 , H01L2224/16147 , H01L2224/16225 , H01L2224/17181 , H01L2224/32145 , H01L2224/73204 , H01L2224/81191 , H01L2224/81193 , H01L2224/81815 , H01L2225/06513 , H01L2225/06517 , H01L2225/1023 , H01L2225/1058 , H01L2225/1088 , H01L2924/00014 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/12042 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00012 , H01L2924/207 , H01L2924/206 , H01L2924/00 , H01L2224/05552
摘要： The described embodiments of mechanisms of forming connectors for package on package enable smaller connectors with finer pitch, which allow smaller package size and additional connections. The conductive elements on one package are partially embedded in the molding compound of the package to bond with contacts or metal pads on another package. By embedding the conductive elements, the conductive elements may be made smaller and there are is gaps between the conductive elements and the molding compound. A pitch of the connectors can be determined by adding a space margin to a maximum width of the connectors. Various types of contacts on the other package can be bonded to the conductive elements.
摘要翻译：所描述的形成用于封装封装的连接器的机构的实施例使得具有更细间距的较小连接器能够实现更小的封装尺寸和附加的连接。一个封装上的导电元件部分地嵌入封装的模制化合物中，以与另一封装上的触点或金属焊盘结合。通过嵌入导电元件，可以使导电元件更小，并且在导电元件和模塑料之间存在间隙。可以通过将连接器的最大宽度添加空间余量来确定连接器的间距。另一个封装上的各种类型的触点可以结合到导电元件上。

78. 发明授权

US08510564B2 Automatic configuration and continuation of federation relationships 有权
标题翻译：自动配置和继续联盟关系
公开(公告)号：US08510564B2
公开(公告)日：2013-08-13
申请号：US12852209
申请日：2010-08-06
申请人： David J. Nicholson , David Lewis Fisher , Michael D. Ritche , Chun-Hung Lin , Christopher B. Dove , Kavitha Radhakrishnan
发明人： David J. Nicholson , David Lewis Fisher , Michael D. Ritche , Chun-Hung Lin , Christopher B. Dove , Kavitha Radhakrishnan
IPC分类号： H04L9/32
CPC分类号： H04L63/0815 , H04L63/0876 , H04L63/126
摘要： Embodiments are directed to establishing the integrity of a portion of data on at least one level of a plurality of network stack levels and automatically continuing an established federation relationship between at least two federation computer systems. In an embodiment, a first federation computer system receives a digital signature corresponding to a computer system signed by a digital signature which includes the computer system's identity and other federation relationship information configured to establish a trusted federation relationship between a first federation computer system and a second federation computer system. The first federation computer system attempts to validate the received digital signature at a first level of a network stack and determines that the validation at the first network stack layer was unsuccessful. The first federation computer system then validates the received digital signature at a second, different level of the network stack.
摘要翻译：实施例涉及在多个网络堆栈级别的至少一个级别上建立数据的一部分的完整性，并且自动地在至少两个联合计算机系统之间继续建立的联合关系。在一个实施例中，第一联合计算机系统接收与由数字签名签名的计算机系统相对应的数字签名，数字签名包括计算机系统的身份和其他联合关系信息，其被配置为在第一联合计算机系统和第二联合计算机系统之间建立信任的联合关系联合计算机系统。第一联合计算机系统尝试在网络堆栈的第一级验证接收到的数字签名，并确定第一网络堆栈层的验证不成功。第一联合计算机系统然后在网络堆栈的第二个不同级别验证所接收的数字签名。

79. 发明申请

US20130048248A1 HEAT PIPE MANUFACTURING METHOD AND HEAT PIPE THEREOF 审中-公开
标题翻译：热管制造方法及其热管
公开(公告)号：US20130048248A1
公开(公告)日：2013-02-28
申请号：US13218424
申请日：2011-08-25
申请人： Chun-Hung Lin , Han-Lin Chen , Chang-Yin Chen
发明人： Chun-Hung Lin , Han-Lin Chen , Chang-Yin Chen
IPC分类号： F28D15/04 , B21D53/02
CPC分类号： B21C37/154 , B21C37/16 , F28D15/0233 , F28D15/046 , Y10T29/49353
摘要： A heat pipe includes a step pipe, a mesh, and a supporting component. The step pipe has an evaporating section and two condensing sections. The condensing sections are on the two ends of the step pipe, respectively. The evaporating section lies between the two condensing sections. The inner spaces of the two condensing sections and the evaporating section are interconnected. The peripheral dimension of the evaporating section is larger than the peripheral dimension of each of the condensing sections. The mesh is contained in the step pipe and located inside the evaporating section. The supporting component is contained in the step pipe and wrapped in the mesh. The combination of these structures increases air's flow rate inside the heat pipe and improves the heat pipe's heat conduction efficiency.
摘要翻译：热管包括台阶管，网和支撑构件。步进管具有蒸发段和两个冷凝段。冷凝段分别位于台阶管的两端。蒸发部分位于两个冷凝部分之间。两个冷凝部分和蒸发部分的内部空间相互连接。蒸发部分的周边尺寸大于每个冷凝部分的周边尺寸。网状物包含在台阶管中，位于蒸发段内。支撑部件包含在台阶管中并包裹在网中。这些结构的组合增加了热管内空气的流量，提高了热管的热传导效率。

80. 发明申请

US20120288981A1 METHOD OF MANUFACTURING SOLAR CELL WITH TWO EXPOSED SURFACES OF ARC LAYER DISPOED AT DIFFERENT LEVELS 有权
标题翻译：在不同水平上制造具有两层暴露的ARC层的太阳能电池的方法
公开(公告)号：US20120288981A1
公开(公告)日：2012-11-15
申请号：US13549814
申请日：2012-07-16
申请人： Sheng Yung Liu , Chin-Tien Yang , Chun-Hung Lin
发明人： Sheng Yung Liu , Chin-Tien Yang , Chun-Hung Lin
IPC分类号： H01L31/18
CPC分类号： H01L31/022433 , H01L31/02168 , Y02E10/50 , Y02E10/52
摘要： A method of manufacturing a solar cell includes the steps of: providing a substrate having a front side, a back side and a doped region; forming a conductor layer on the front side; firing the conductor layer at a temperature such that the conductor layer is formed with a first portion embedded into the doped region and a second portion other than the first portion; forming an anti-reflection coating (ARC) layer on the front side and the second portion, wherein the ARC layer covers the conductor layer so that the second portion of the conductor layer is disposed in the ARC layer; and removing the ARC layer on the conductor layer so that the conductor layer has an exposed surface exposed out of the ARC layer, wherein the exposed surface of the conductor layer is substantially flush with a first exposed surface of the ARC layer.
摘要翻译：一种制造太阳能电池的方法包括以下步骤：提供具有正面，背面和掺杂区域的基板; 在前侧形成导体层; 在使得导体层形成有嵌入掺杂区域的第一部分和除了第一部分之外的第二部分的温度下烧制导体层; 在前侧和第二部分形成防反射涂层（ARC）层，其中ARC层覆盖导体层，使得导体层的第二部分设置在ARC层中; 以及去除所述导体层上的所述ARC层，使得所述导体层具有暴露在所述ARC层外部的暴露表面，其中所述导体层的所述暴露表面基本上与所述ARC层的第一暴露表面齐平。

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