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    • 73. 发明申请
    • SPLIT POLY-SiGe/POLY-Si ALLOY GATE STACK
    • 分散多晶硅/多晶硅合金栅极堆叠
    • US20070293031A1
    • 2007-12-20
    • US11847384
    • 2007-08-30
    • Kevin ChanJia ChenShih-Fen HuangEdward Nowak
    • Kevin ChanJia ChenShih-Fen HuangEdward Nowak
    • H01L21/3205
    • H01L21/2807H01L21/28052H01L21/28061H01L21/823835H01L21/823842H01L29/4916H01L29/4925H01L29/665
    • A multi-layered gate electrode stack structure of a field effect transistor device is formed on a silicon nano crystal seed layer on the gate dielectric. The small grain size of the silicon nano crystal layer allows for deposition of a uniform and continuous layer of poly-SiGe with a [Ge] of up to at least 70% using in situ rapid thermal chemical vapor deposition (RTCVD). An in-situ purge of the deposition chamber in a oxygen ambient at rapidly reduced temperatures results in a thin SiO2 or SixGeyOz interfacial layer of 3 to 4 A thick. The thin SiO2 or SixGeyOz interfacial layer is sufficiently thin and discontinuous to offer little resistance to gate current flow yet has sufficient [O] to effectively block upward Ge diffusion during heat treatment to thereby allow silicidation of the subsequently deposited layer of cobalt. The gate electrode stack structure is used for both nFETs and pFETs.
    • 在栅极电介质上的硅纳米晶种子层上形成场效应晶体管器件的多层栅电极堆叠结构。 硅纳米晶体层的小晶粒尺寸允许使用原位快速热化学气相沉积(RTCVD)沉积高达至少70%的[Ge]的均匀且连续的多晶硅层。 在快速降低的温度下在氧气环境中原位吹扫沉积室导致薄的SiO 2或Si x O x O O 3至4厚的界面层。 薄的SiO 2或Si x Si 2 O 3界面层足够薄且不连续以提供很小的电阻 到栅极电流仍具有足够的[O]以在热处理期间有效地阻挡Ge扩散,从而允许后续沉积的钴的硅化物。 栅电极堆叠结构用于nFET和pFET两者。
    • 78. 发明申请
    • ASYMMETRIC FIELD EFFECT TRANSISTORS (FETs)
    • 非对称场效应晶体管(FET)
    • US20060244077A1
    • 2006-11-02
    • US10908095
    • 2005-04-27
    • Edward Nowak
    • Edward Nowak
    • H01L29/76
    • H01L29/7391H01L29/785H01L29/7856H01L29/78624
    • A semiconductor structure and a method for forming the same. The structure includes (a) a semiconductor channel region, (b) a semiconductor source block in direct physical contact with the semiconductor channel region; (c) a source contact region in direct physical contact with the semiconductor source block, wherein the source contact region comprises a first electrically conducting material, and wherein the semiconductor source block physically isolates the source contact region from the semiconductor channel region, and (d) a drain contact region in direct physical contact with the semiconductor channel region, wherein the semiconductor channel region is disposed between the semiconductor source block and the drain contact region, and wherein the drain contact region comprises a second electrically conducting material; and (e) a gate stack in direct physical contact with the semiconductor channel region.
    • 半导体结构及其形成方法。 该结构包括(a)半导体沟道区,(b)与半导体沟道区直接物理接触的半导体源块; (c)与半导体源极块直接物理接触的源极接触区域,其中源极接触区域包括第一导电材料,并且其中半导体源极块将源极接触区域与半导体沟道区域物理隔离,并且(d )与所述半导体沟道区域直接物理接触的漏极接触区域,其中所述半导体沟道区域设置在所述半导体源极块和所述漏极接触区域之间,并且其中所述漏极接触区域包括第二导电材料; 和(e)与半导体沟道区直接物理接触的栅叠层。