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71. 发明授权

US08525524B2 Multi-track detection system for detecting the appearance of electronic elements 有权
标题翻译：用于检测电子元件外观的多轨道检测系统
公开(公告)号：US08525524B2
公开(公告)日：2013-09-03
申请号：US13169086
申请日：2011-06-27
申请人： Bily Wang , Kuei-Pao Chen , Hsin-Cheng Chen , Ren-Chun Ni
发明人： Bily Wang , Kuei-Pao Chen , Hsin-Cheng Chen , Ren-Chun Ni
IPC分类号： G01R31/02
CPC分类号： H01L21/67271 , G01R31/2893
摘要： A multi-track detection system for detecting the appearance of electronic elements includes a rotary module, a feeding module, an unvibrated module, a detection module, and a classification module. The rotary module includes a hollow transparent rotary structure having at least two annular guiding areas on the top surface thereof, and the electronic elements are sequentially arranged on the two annular guiding area. The feeding module has two V-shaped feeding grooves for guiding the electronic elements. The unvibrated module includes an unvibrated guiding block having two V-shaped unvibrated guiding grooves respectively communicated with the two V-shaped feeding grooves and respectively corresponding to the two annular guiding areas. The electronic elements on the V-shaped feeding grooves are sequentially transmitted onto the two annular guiding areas through two V-shaped unvibrated guiding grooves, thus each electronic element can be detected by the detection module and classified by the classification module, respectively.
摘要翻译：用于检测电子元件外观的多轨道检测系统包括旋转模块，馈送模块，非校准模块，检测模块和分类模块。旋转模块包括中空透明旋转结构，其在其顶表面上具有至少两个环形引导区域，并且电子元件依次布置在两个环形引导区域上。馈送模块具有用于引导电子元件的两个V形馈电槽。未经校准的模块包括具有分别与两个V形供给槽连通且分别对应于两个环形导向区域的两个V形未经校准的引导槽的未经校准的引导块。 V形供给槽上的电子元件通过两个V形的未经校准的导向槽依次传送到两个环形引导区域，因此每个电子元件可被检测模块分别检测并由分类模块分类。

72. 发明授权

US08198800B2 LED chip package structure in order to prevent the light-emitting efficiency of fluorescent powder from decreasing due to high temperature and method for making the same 有权
标题翻译： LED芯片封装结构，以防止荧光粉的发光效率由于高温而降低，并且制造它们的方法
公开(公告)号：US08198800B2
公开(公告)日：2012-06-12
申请号：US12232931
申请日：2008-09-26
申请人： Bily Wang , Shih-Yu Wu , Wen-Kuei Wu
发明人： Bily Wang , Shih-Yu Wu , Wen-Kuei Wu
IPC分类号： H01J1/62 , H01J63/04
CPC分类号： H01L33/507 , H01L25/0753 , H01L33/60 , H01L2224/48091 , H01L2924/181 , H01L2933/0041 , H01L2924/00014 , H01L2924/00012
摘要： An LED chip package structure in order to prevent the light-emitting efficiency of fluorescent powder from decreasing due to high temperature includes a substrate unit, a light-emitting unit, a transparent colloid body unit, a fluorescent colloid body unit and a frame unit. The light-emitting unit has a plurality of LED chips electrically arranged on the substrate unit. The transparent colloid body unit has a plurality of transparent colloid bodies respectively covering the LED chips. The fluorescent colloid body unit has a plurality of fluorescent colloid bodies respectively covering the transparent colloid bodies. The frame unit is covering the peripheries of each transparent colloid body and each fluorescent colloid body in order to expose the top surfaces of the fluorescent colloid body.
摘要翻译：为了防止荧光粉的发光效率由于高温而降低的LED芯片封装结构包括基板单元，发光单元，透明胶体主体单元，荧光胶体主体单元和框架单元。发光单元具有电子地布置在基板单元上的多个LED芯片。透明胶体体单元具有分别覆盖LED芯片的多个透明胶体。荧光胶体主体单元具有分别覆盖透明胶体的多个荧光胶体。框架单元覆盖每个透明胶体和每个荧光胶体的周边，以暴露荧光胶体的顶表面。

73. 发明授权

US08162510B2 LED chip package structure with multifunctional integrated chips and a method for making the same 有权
标题翻译：具有多功能集成芯片的LED芯片封装结构及其制造方法
公开(公告)号：US08162510B2
公开(公告)日：2012-04-24
申请号：US12285027
申请日：2008-09-29
申请人： Bily Wang , Shih-Yu Wu , Wen-Kuei Wu
发明人： Bily Wang , Shih-Yu Wu , Wen-Kuei Wu
IPC分类号： H01L33/00
CPC分类号： F21K9/00 , Y10S362/80
摘要： A LED chip package structure with multifunctional integrated chips includes a substrate unit, a light-emitting unit, a chip unit, and a package colloid unit. The light-emitting unit has a plurality of LED chips electrically arranged on the substrate unit. The chip unit is electrically arranged on the substrate unit, and the chip unit is arranged between the light-emitting unit and a power source. The package colloid unit covers the LED chips. The package colloid unit is a strip fluorescent colloid corresponding to the LED chips.
摘要翻译：具有多功能集成芯片的LED芯片封装结构包括基板单元，发光单元，芯片单元和封装胶体单元。发光单元具有电子地布置在基板单元上的多个LED芯片。芯片单元电气地布置在基板单元上，并且芯片单元布置在发光单元和电源之间。封装胶体单元覆盖LED芯片。封装胶体单元是对应于LED芯片的条形荧光胶体。

74. 发明授权

US08079737B2 Reflection-type light-emitting module with high heat-dissipating and high light-generating efficiency 有权
标题翻译：反射式发光模块具有散热性好，发光效率高的特点
公开(公告)号：US08079737B2
公开(公告)日：2011-12-20
申请号：US12426621
申请日：2009-04-20
申请人： Bily Wang , Ping-Chou Yang , Yu-Jen Cheng
发明人： Bily Wang , Ping-Chou Yang , Yu-Jen Cheng
IPC分类号： F21V7/00
CPC分类号： F21V29/51 , F21K9/233 , F21V7/0008 , F21V7/041 , F21V7/048 , F21V7/09 , F21V29/507 , F21V29/717 , F21V29/773 , F21Y2115/10
摘要： A reflection-type light-emitting module with high heat-dissipating and high light-generating efficiency includes a reflection-type lampshade unit, a heat pipe unit and a light-emitting unit. The reflection-type lampshade unit has an open casing, a receiving space formed in the open casing, and a first reflective structure is disposed in the receiving space and on an inner surface of the open casing. The heat pipe unit is received in the receiving space and is disposed on the open casing. The light-emitting unit is disposed on the heat pipe unit, and the light-emitting unit has a light-emitting face facing the inner surface of the open casing.
摘要翻译：具有散热高，发光效率高的反射型发光模块包括反射式灯罩单元，热管单元和发光单元。反射型灯罩单元具有敞开的壳体，形成在开放式壳体中的容纳空间，并且第一反射结构设置在容纳空间中和开口壳体的内表面上。热管单元被容纳在接收空间中并且设置在开放的壳体上。发光单元设置在热管单元上，并且发光单元具有面向开口壳体的内表面的发光面。

75. 发明授权

US08053904B2 Semiconductor chip package structure for achieving flip-chip type electrical connection without using wire-bonding process and method for making same 有权
标题翻译：用于实现倒装芯片型电连接而不使用引线接合工艺的半导体芯片封装结构及其制造方法
公开(公告)号：US08053904B2
公开(公告)日：2011-11-08
申请号：US12648646
申请日：2009-12-29
申请人： Bily Wang , Hung-Chou Yang , Jeng-Ru Chang
发明人： Bily Wang , Hung-Chou Yang , Jeng-Ru Chang
IPC分类号： H01L23/12 , H01L33/00
CPC分类号： H01L21/561 , H01L21/565 , H01L21/568 , H01L23/3121 , H01L24/03 , H01L24/05 , H01L24/48 , H01L24/96 , H01L33/62 , H01L2224/04042 , H01L2224/05599 , H01L2224/24137 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01078 , H01L2924/09701 , H01L2924/12041 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor chip package structure for achieving flip-chip electrical connection without using a wire-bonding process includes a package unit, a semiconductor chip, a first insulative layer, first conductive layers, a second insulative layer, and second conductive layers. The package unit has a receiving groove. The semiconductor chip is received in the receiving groove and has a plurality of conductive pads disposed on its top surface. The first insulative layer is formed between the conductive pads to insulate the conductive pads. The first conductive layers are formed on the first insulative layer and the package unit, and one side of each first conductive layer is electrically connected to the corresponding conductive pad. The second insulative layer is formed between the first conductive layers in order to insulate the first conductive layers from each other. The second conductive layers are respectively formed on the other opposite sides of the first conductive layers.
摘要翻译：用于在不使用引线接合工艺的情况下实现倒装芯片电连接的半导体芯片封装结构包括封装单元，半导体芯片，第一绝缘层，第一导电层，第二绝缘层和第二导电层。包装单元具有接收槽。半导体芯片被容纳在接收槽中并且具有设置在其顶表面上的多个导电焊盘。第一绝缘层形成在导电焊盘之间以使导电焊盘绝缘。第一导电层形成在第一绝缘层和封装单元上，并且每个第一导电层的一侧电连接到相应的导电焊盘。第二绝缘层形成在第一导电层之间，以使第一导电层彼此绝缘。第二导电层分别形成在第一导电层的另一相对侧上。

76. 发明授权

US08003413B2 Penetrating hole type LED chip package structure using a ceramic material as a substrate and method for manufacturing the same 有权
标题翻译：使用陶瓷材料作为基板的穿透孔型LED芯片封装结构及其制造方法
公开(公告)号：US08003413B2
公开(公告)日：2011-08-23
申请号：US12314168
申请日：2008-12-05
申请人： Bily Wang , Jonnie Chuang , Chia-Hung Chen
发明人： Bily Wang , Jonnie Chuang , Chia-Hung Chen
IPC分类号： H01L21/00
CPC分类号： H01L33/483 , H01L33/62 , H01L2224/05571 , H01L2224/05573 , H01L2224/16 , H01L2224/48091 , H01L2224/48247 , H01L2924/09701 , H01L2924/00014
摘要： An LED chip package structure includes a ceramic substrate, a conductive unit, a hollow ceramic casing, many LED chips, and a package colloid. The ceramic substrate has a main body, many protrusions extended from the main body, many penetrating holes respectively penetrating through the protrusions, and many half through holes formed on a lateral side of the main body and respectively formed between each two protrusions. The conductive unit has many first conductive layers respectively formed on the protrusions, many second conductive layers respectively formed on inner surfaces of the half through holes and a bottom face of the main body, and many third conductive layers respectively filled in the penetrating holes. The hollow ceramic casing is fixed on the main body to form a receiving space. The LED chips is received in the receiving space. The package colloid is filled in the receiving space for covering the LED chips.
摘要翻译： LED芯片封装结构包括陶瓷基板，导电单元，中空陶瓷外壳，许多LED芯片和封装胶体。陶瓷基板具有主体，从主体延伸的许多突起，分别穿过突起的许多穿透孔和形成在主体的侧面上并分别形成在每个两个突起之间的许多半通孔。导电单元具有分别形成在突起上的许多第一导电层，分别形成在半通孔的内表面上的许多第二导电层和主体的底面，以及分别填充在穿透孔中的许多第三导电层。中空陶瓷壳体固定在主体上以形成容纳空间。 LED芯片被接收在接收空间中。包装胶体填充在用于覆盖LED芯片的接收空间中。

77. 发明申请

US20110156083A1 Light emission module with high-efficiency light emission and high-efficiency heat dissipation and applications thereof 审中-公开
公开(公告)号：US20110156083A1
公开(公告)日：2011-06-30
申请号：US12845612
申请日：2010-07-28
申请人： Bily Wang , Feng-Hui Chuang , Wen-Kuei Wu
发明人： Bily Wang , Feng-Hui Chuang , Wen-Kuei Wu
IPC分类号： H01L33/62 , H05K1/11
CPC分类号： H05K1/0206 , F21K9/00 , F21Y2115/10 , H01L25/0753 , H01L33/64 , H01L2224/48091 , H05K2201/09145 , H05K2201/09227 , H05K2201/10106 , H01L2924/00014 , H01L2924/00
摘要： A light emission module is provided. The light emission module includes a substrate, a plurality of LED chips disposed on the substrate, a fluorescent colloid and a package colloid surrounding the plurality of LED chips. The substrate includes a substrate body and a plurality of chip pads disposed thereon for carrying the LED chips. A plurality of via holes is formed passing through the chip pads and the substrate body to enhance the heat dissipation of the LED chips. The fluorescent colloid and the package colloid both have light guide structures to improve the color stability and the capacity to process the light shape of the light emission module.

78. 发明授权

US07842964B2 Front and rear covering type LED package structure and method for packaging the same 有权
标题翻译：前后盖式LED封装结构及封装方法相同
公开(公告)号：US07842964B2
公开(公告)日：2010-11-30
申请号：US12003523
申请日：2007-12-28
申请人： Bily Wang , Jonnie Chuang , Hui-Yen Huang , Chao-Yuan Huang
发明人： Bily Wang , Jonnie Chuang , Hui-Yen Huang , Chao-Yuan Huang
IPC分类号： H01L29/861
CPC分类号： H01L33/486 , H01L33/62 , H01L2224/05571 , H01L2224/05573 , H01L2224/16245 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/00012 , H01L2224/05599
摘要： A front and rear covering type LED package structure includes an insulating body, a substrate unit, at least one light-emitting element, and a package colloid. The insulating body has a receiving space. The substrate unit has two electrode pins separated from each other. Each electrode pin has one side covered by the insulating body. Each electrode pin has another side bent into a U-shape and exposed outside the insulating body in order to cover two opposite lateral sides and front and rear sides of the insulating body by a front and rear covering method. The at least one light-emitting element is received in the receiving space and electrically connected with the two electrode pins of the substrate unit. The package colloid is filled into the receiving space of the insulating body.
摘要翻译：前后覆盖型LED封装结构包括绝缘体，基板单元，至少一个发光元件和封装胶体。绝缘体具有接收空间。基板单元具有彼此分离的两个电极引脚。每个电极针的一侧被绝缘体覆盖。每个电极销的另一侧弯曲成U形并暴露在绝缘体外部，以便通过前后覆盖方法覆盖绝缘体的两个相对的侧面和前后两侧。所述至少一个发光元件被容纳在所述接收空间中并且与所述基板单元的两个电极引脚电连接。封装胶体填充到绝缘体的接收空间中。

79. 发明授权

US07749781B2 Method for manufacturing a light-emitting diode having high heat-dissipating efficiency 有权
标题翻译：具有高散热效率的发光二极管的制造方法
公开(公告)号：US07749781B2
公开(公告)日：2010-07-06
申请号：US11757355
申请日：2007-06-02
申请人： Bily Wang , Jonnie Chuang , Miko Huang
发明人： Bily Wang , Jonnie Chuang , Miko Huang
IPC分类号： H01L21/00
CPC分类号： H01L33/64 , H01L33/62 , H01L33/647 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： A method for manufacturing a light-emitting diode having a high heat-dissipating efficiency forms a thickened metal into a plurality of supports. The support has a first electrode and a second electrode thereon. The first electrode is formed with a trough. The chip that emits a visible light or an invisible light is adhered in the trough. Then, two leads are welded on the chip. One end of each of the two leads is welded to the first and second electrodes respectively. Various glues are dotted on the chip, adhesive, leads and the support. Finally, the glue is formed into a seat and lens having a packaged chip, adhesive, leads and support by means of a hot press-forming process.
摘要翻译：一种具有高散热效率的发光二极管的制造方法，将增厚的金属形成为多个支撑体。支撑体上具有第一电极和第二电极。第一电极形成有槽。发射可见光或不可见光的芯片粘附在槽中。然后，将两根引线焊接在芯片上。两个引线中的每一个的一端分别焊接到第一和第二电极。各种胶水点缀在芯片，粘合剂，引线和支架上。最后，胶水通过热压成型工艺形成具有封装芯片，粘合剂，引线和支撑体的座和透镜。

80. 发明授权

US07671373B2 LED chip package structure using a ceramic material as a substrate and a method for manufacturing the same 有权
标题翻译：使用陶瓷材料作为基板的LED芯片封装结构及其制造方法
公开(公告)号：US07671373B2
公开(公告)日：2010-03-02
申请号：US11976478
申请日：2007-10-25
申请人： Bily Wang , Jonnie Chuang , Chia-Hung Chen
发明人： Bily Wang , Jonnie Chuang , Chia-Hung Chen
IPC分类号： H01L29/267 , H01L21/15 , H01L29/26 , H01L31/12 , H01L29/16 , H01L29/18 , H01L29/22 , H01L29/24 , H01L25/16
CPC分类号： H01L25/0753 , H01L33/486 , H01L2224/48091 , H01L2224/48247 , H01L2924/09701 , H01L2924/00014
摘要： An LED chip package structure using a ceramic material as a substrate includes a ceramic substrate, a conductive unit, a hollow ceramic casing, a plurality of LED chips, and a package colloid. The ceramic substrate has a main body, and a plurality of protrusions extended from three faces of the main body. The conductive unit has a plurality of conductive layers formed on the protrusions, respectively. The hollow casing is fixed on a top face of the main body to form a receiving space for exposing a top face of each conductive layer. The LED chips are received in the receiving space, and each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected to different conductive layers. In addition, the packaging colloid is filled into the receiving space for covering the LED chips.
摘要翻译：使用陶瓷材料作为基板的LED芯片封装结构包括陶瓷基板，导电单元，中空陶瓷外壳，多个LED芯片和封装胶体。陶瓷基板具有主体和从主体的三个面延伸的多个突起。导电单元具有分别形成在突起上的多个导电层。中空壳体固定在主体的顶面上，以形成用于暴露每个导电层顶面的容纳空间。 LED芯片被接收在接收空间中，并且每个LED芯片分别具有正极侧和负极侧，并且电连接到不同的导电层。此外，将包装胶体填充到用于覆盖LED芯片的接收空间中。

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