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1. 发明申请

US20100290664A1 Detection system for detecting appearances of many electronic elements and methods of using the same 有权
标题翻译：用于检测许多电子元件外观的检测系统及其使用方法
公开(公告)号：US20100290664A1
公开(公告)日：2010-11-18
申请号：US12453636
申请日：2009-05-18
申请人： Bily Wang , Kuei-Pao Chen , Hsin-Cheng Chen , Ming-Hao Chou , Ren-Chun Ni
发明人： Bily Wang , Kuei-Pao Chen , Hsin-Cheng Chen , Ming-Hao Chou , Ren-Chun Ni
IPC分类号： G06K9/00
CPC分类号： G06T7/0006 , G06T2207/30164
摘要： A detection system for detecting appearances of many electronic elements includes a rotary module, a feeding module and a detection module. The rotary module has a base structure and a hollow transparent rotary structure disposed on the base structure. The feeding module is disposed beside one side of the hollow transparent rotary structure in order to sequentially guide the electronic elements to the top surface of the hollow transparent rotary structure. The detection module has a plurality of detection units sequentially disposed around the hollow transparent rotary structure. Each detection unit is composed of an image-sensing element for sensing the electronic elements, an image-capturing element for capturing surface images of the electronic elements and a classifying element for classifying the electronic elements.
摘要翻译：用于检测许多电子元件的外观的检测系统包括旋转模块，馈送模块和检测模块。旋转模块具有底座结构和设置在基座结构上的中空透明旋转结构。馈送模块设置在中空透明旋转结构的一侧旁边，以便顺序地将电子元件引导到中空透明旋转结构的顶表面。检测模块具有多个依次设置在中空透明旋转结构周围的检测单元。每个检测单元由用于感测电子元件的图像感测元件，用于捕获电子元件的表面图像的图像捕获元件和用于分类电子元件的分类元件组成。

2. 发明授权

US08107720B2 Detection system for detecting appearances of many electronic elements and methods of using the same 有权
标题翻译：用于检测许多电子元件外观的检测系统及其使用方法
公开(公告)号：US08107720B2
公开(公告)日：2012-01-31
申请号：US12453636
申请日：2009-05-18
申请人： Bily Wang , Kuei-Pao Chen , Hsin-Cheng Chen , Ming-Hao Chou , Ren-Chun Ni
发明人： Bily Wang , Kuei-Pao Chen , Hsin-Cheng Chen , Ming-Hao Chou , Ren-Chun Ni
IPC分类号： G06K9/00
CPC分类号： G06T7/0006 , G06T2207/30164
摘要： A detection system for detecting appearances of many electronic elements includes a rotary module, a feeding module and a detection module. The rotary module has a base structure and a hollow transparent rotary structure disposed on the base structure. The feeding module is disposed beside one side of the hollow transparent rotary structure in order to sequentially guide the electronic elements to the top surface of the hollow transparent rotary structure. The detection module has a plurality of detection units sequentially disposed around the hollow transparent rotary structure. Each detection unit is composed of an image-sensing element for sensing the electronic elements, an image-capturing element for capturing surface images of the electronic elements and a classifying element for classifying the electronic elements.
摘要翻译：用于检测许多电子元件的外观的检测系统包括旋转模块，馈送模块和检测模块。旋转模块具有底座结构和设置在基座结构上的中空透明旋转结构。馈送模块设置在中空透明旋转结构的一侧旁边，以便顺序地将电子元件引导到中空透明旋转结构的顶表面。检测模块具有多个依次设置在中空透明旋转结构周围的检测单元。每个检测单元由用于感测电子元件的图像感测元件，用于捕获电子元件的表面图像的图像捕获元件和用于分类电子元件的分类元件组成。

3. 发明授权

US08525524B2 Multi-track detection system for detecting the appearance of electronic elements 有权
标题翻译：用于检测电子元件外观的多轨道检测系统
公开(公告)号：US08525524B2
公开(公告)日：2013-09-03
申请号：US13169086
申请日：2011-06-27
申请人： Bily Wang , Kuei-Pao Chen , Hsin-Cheng Chen , Ren-Chun Ni
发明人： Bily Wang , Kuei-Pao Chen , Hsin-Cheng Chen , Ren-Chun Ni
IPC分类号： G01R31/02
CPC分类号： H01L21/67271 , G01R31/2893
摘要： A multi-track detection system for detecting the appearance of electronic elements includes a rotary module, a feeding module, an unvibrated module, a detection module, and a classification module. The rotary module includes a hollow transparent rotary structure having at least two annular guiding areas on the top surface thereof, and the electronic elements are sequentially arranged on the two annular guiding area. The feeding module has two V-shaped feeding grooves for guiding the electronic elements. The unvibrated module includes an unvibrated guiding block having two V-shaped unvibrated guiding grooves respectively communicated with the two V-shaped feeding grooves and respectively corresponding to the two annular guiding areas. The electronic elements on the V-shaped feeding grooves are sequentially transmitted onto the two annular guiding areas through two V-shaped unvibrated guiding grooves, thus each electronic element can be detected by the detection module and classified by the classification module, respectively.
摘要翻译：用于检测电子元件外观的多轨道检测系统包括旋转模块，馈送模块，非校准模块，检测模块和分类模块。旋转模块包括中空透明旋转结构，其在其顶表面上具有至少两个环形引导区域，并且电子元件依次布置在两个环形引导区域上。馈送模块具有用于引导电子元件的两个V形馈电槽。未经校准的模块包括具有分别与两个V形供给槽连通且分别对应于两个环形导向区域的两个V形未经校准的引导槽的未经校准的引导块。 V形供给槽上的电子元件通过两个V形的未经校准的导向槽依次传送到两个环形引导区域，因此每个电子元件可被检测模块分别检测并由分类模块分类。

4. 发明授权

US08873920B2 Light-guiding cover structure 有权
标题翻译：导光罩结构
公开(公告)号：US08873920B2
公开(公告)日：2014-10-28
申请号：US13425829
申请日：2012-03-21
申请人： Bily Wang , Kuei-Pao Chen , Hsin-Cheng Chen , Cheng-Chin Chiu
发明人： Bily Wang , Kuei-Pao Chen , Hsin-Cheng Chen , Cheng-Chin Chiu
IPC分类号： G02B6/00
CPC分类号： G02B6/4298 , G01J2001/4252 , G01R31/2635 , G02B6/3616 , G02B6/3644
摘要： A light-guiding cover structure includes a top cover unit and a light-guiding unit. The top cover unit has a plurality of receiving spaces formed therein. The light-guiding unit includes a plurality of light-guiding groups, wherein each light-guiding group includes a plurality of optical fiber cables received in the corresponding receiving space, and each optical fiber cable has two opposite ends exposed from the bottom surface of the top cover unit and respectively facing at least one light-emitting device and at least one light-sensing device that have been disposed under the top cover unit. Therefore, the optical fiber cables received in the corresponding receiving space, thus when the light-guiding cover structure is applied to the LED package chip classification system, the aspect of the LED package chip classification system can be enhanced.
摘要翻译：导光罩结构包括顶盖单元和导光单元。顶盖单元具有形成在其中的多个接收空间。导光单元包括多个导光组，其中每个导光组包括容纳在相应接收空间中的多根光纤电缆，并且每根光纤电缆具有两个相对端从第并且分别面向至少一个发光装置和已经设置在顶盖单元下的至少一个光感测装置。因此，光纤电缆在相应的接收空间中被接收，因此当导光盖结构被应用于LED封装芯片分类系统时，可以提高LED封装芯片分类系统的方面。

5. 发明授权

US08686310B2 Packaged chip detection and classification device 有权
标题翻译：封装芯片检测和分类装置
公开(公告)号：US08686310B2
公开(公告)日：2014-04-01
申请号：US13170705
申请日：2011-06-28
申请人： Bily Wang , Kuei-Pao Chen , Hsin-Cheng Chen
发明人： Bily Wang , Kuei-Pao Chen , Hsin-Cheng Chen
IPC分类号： B07C5/344
CPC分类号： B07C5/00 , B07C5/344 , G01R31/01 , G01R31/2893
摘要： A packaged chip detection and classification device includes a rotation unit for transporting a plurality of packaged chips, a packaged chip detection unit, and a packaged chip classification unit. The rotation unit includes a rotary turntable, a plurality of receiving portions formed on the rotary turntable, and a plurality of suction-exhaust openings respectively formed in the receiving portions. Each receiving portion is used to selectively receive at least one of the packaged chips. The packaged chip detection unit includes a packaged chip detection module adjacent to the rotation unit for detecting each packaged chip. The packaged chip classification unit includes a packaged chip classification module adjacent to the rotation unit for classifying the packaged chips. Therefore, the packaged chip detection and classification device can be used to detect and classify no-lead packaged chips by matching the rotation unit, the packaged chip detection unit, and the packaged chip classification unit.
摘要翻译：封装芯片检测和分类装置包括用于传输多个封装芯片的转动单元，封装芯片检测单元和封装芯片分类单元。旋转单元包括旋转转盘，形成在旋转转盘上的多个接收部分和分别形成在接收部分中的多个抽吸排气口。每个接收部分用于选择性地接收至少一个封装的芯片。封装芯片检测单元包括与用于检测每个封装芯片的旋转单元相邻的封装芯片检测模块。封装芯片分类单元包括与旋转单元相邻的封装芯片分类模块，用于对封装芯片进行分类。因此，封装芯片检测和分类装置可以通过匹配旋转单元，封装芯片检测单元和封装芯片分类单元来检测和分类无铅封装芯片。

6. 发明授权

US08519458B2 Light-emitting element detection and classification device 有权
标题翻译：发光元件检测及分类装置
公开(公告)号：US08519458B2
公开(公告)日：2013-08-27
申请号：US13182425
申请日：2011-07-13
申请人： Bily Wang , Kuei-Pao Chen , Hsin-Cheng Chen
发明人： Bily Wang , Kuei-Pao Chen , Hsin-Cheng Chen
IPC分类号： H01L31/113 , G01N21/01
CPC分类号： G01R31/01 , G01R31/2635
摘要： A light-emitting element detection and classification device includes a rotation unit for transporting a plurality of light-emitting elements, a chip detection unit, and a chip classification unit. The rotation unit includes at least one rotary turntable, a plurality of receiving portions formed on the rotary turntable, and a plurality of suction-exhaust dual-purpose openings respectively disposed in the receiving portions, each receiving portion selectively receives at least one of the light-emitting elements. Each light-emitting element is an LED package chip having a positive electrode pad and a negative electrode pad disposed on the bottom side thereof. The chip detection unit includes at least one chip detection module adjacent to the rotation unit for detecting each light-emitting element. The chip classification unit includes at least one chip classification module adjacent to the rotation unit for classifying the LED package chips that have been detected by the at least one chip detection module.
摘要翻译：发光元件检测和分类装置包括用于传送多个发光元件的旋转单元，芯片检测单元和芯片分类单元。旋转单元包括至少一个旋转转盘，形成在旋转转台上的多个接收部分和分别设置在接收部分中的多个吸排二重用开口，每个接收部分选择性地接收至少一个光 - 发行元素。每个发光元件是具有设置在其底侧上的正极焊盘和负极焊盘的LED封装芯片。芯片检测单元包括与用于检测每个发光元件的旋转单元相邻的至少一个芯片检测模块。芯片分类单元包括与旋转单元相邻的至少一个芯片分类模块，用于对由至少一个芯片检测模块检测到的LED封装芯片进行分类。

7. 发明授权

US08710387B2 LED package chip classification system 有权
标题翻译： LED封装芯片分类系统
公开(公告)号：US08710387B2
公开(公告)日：2014-04-29
申请号：US13204616
申请日：2011-08-05
申请人： Bily Wang , Kuei-Pao Chen , Hsin-Cheng Chen
发明人： Bily Wang , Kuei-Pao Chen , Hsin-Cheng Chen
IPC分类号： B07C5/00
CPC分类号： G01R31/01 , G01R31/2635
摘要： An LED package chip classification system includes a rotation unit for transporting a plurality of LED package chips, a chip test unit, and a chip classification unit. The rotation unit includes a rotary turntable, a plurality of receiving portions formed on the rotary turntable, and a plurality of suction-exhaust dual-purpose openings respectively disposed in the receiving portions. Each LED package chip has a positive electrode pad and a negative electrode pad disposed on the bottom side thereof. The chip test unit includes a chip test module adjacent to the rotation unit for testing each LED package chip. The chip classification unit includes a plurality of chip classification modules adjacent to the rotation unit for classifying the LED package chips. Therefore, the LED package chips can be classified by matching the rotation unit, the chip test unit, and the chip classification unit.
摘要翻译： LED封装芯片分类系统包括用于传输多个LED封装芯片的转动单元，芯片测试单元和芯片分类单元。旋转单元包括旋转转盘，形成在旋转转台上的多个接收部分和分别设置在接收部分中的多个抽吸排气双重用途开口。每个LED封装芯片具有设置在其底侧上的正极焊盘和负极焊盘。芯片测试单元包括与旋转单元相邻的芯片测试模块，用于测试每个LED封装芯片。芯片分类单元包括与用于分类LED封装芯片的旋转单元相邻的多个芯片分类模块。因此，可以通过匹配旋转单元，芯片测试单元和芯片分类单元来分类LED封装芯片。

8. 发明授权

US08031930B2 Testing system and testing method for inspecting electonic devices 有权
标题翻译：用于检查电子设备的测试系统和测试方法
公开(公告)号：US08031930B2
公开(公告)日：2011-10-04
申请号：US12285184
申请日：2008-09-30
申请人： Bily Wang , Kuei-Pao Chen , Hsin-Cheng Chen , Ming-Hao Chou
发明人： Bily Wang , Kuei-Pao Chen , Hsin-Cheng Chen , Ming-Hao Chou
IPC分类号： G06K9/00
CPC分类号： G01N21/95 , G01N21/8806
摘要： A testing system for inspecting electronic devices includes a first transparent disk, a first image capturing unit disposed under the first transparent disk, a second disk disposed next to the first transparent disk, a guiding unit disposed on adjacent area between the transparent disk and the second disk, and a plurality of second image capturing units disposed around the second disk. A plurality of electronic devices is continuingly supplied onto the first transparent disk and the first image capturing unit is used for capturing the images of the bottom surfaces of the electronic devices. Then, the electronic devices are guided to the second disk via the guiding unit and the second image capturing units are used for capturing the images of other surfaces of the electronic devices. A testing method for electronic devices is further disclosed.
摘要翻译：用于检查电子设备的测试系统包括第一透明盘，设置在第一透明盘下方的第一图像捕获单元，邻近第一透明盘设置的第二盘，设置在透明盘与第二透明盘之间相邻区域上的引导单元盘，以及设置在第二盘周围的多个第二图像捕获单元。多个电子设备被连续地提供到第一透明盘上，并且第一图像捕获单元用于捕获电子设备的底面的图像。然后，电子设备经由引导单元被引导到第二盘，并且第二图像捕获单元用于捕获电子设备的其他表面的图像。进一步公开了一种电子设备的测试方法。

9. 发明申请

US20100166290A1 DIE DEFECT INSPECTING SYSTEM WITH A DIE DEFECT INSPECTING FUNCTION AND A METHOD OF USING THE SAME 审中-公开
标题翻译：具有缺陷检查功能的DIE缺陷检查系统及其使用方法
公开(公告)号：US20100166290A1
公开(公告)日：2010-07-01
申请号：US12489878
申请日：2009-06-23
申请人： Bily Wang , Kuei-Pao Chen , Hsin-Cheng Chen , Chien-Chi Huang , Chung-Yi Tsai
发明人： Bily Wang , Kuei-Pao Chen , Hsin-Cheng Chen , Chien-Chi Huang , Chung-Yi Tsai
IPC分类号： G06K9/00
CPC分类号： G01N21/9501 , G01N21/95607 , H01L22/12
摘要： A die defect inspecting system with a die defect inspecting function includes a wafer-positioning module, an image-capturing module, a die-sucking module, a die defect analyzing module, a die-classifying module and a control module. The image-capturing module is disposed beside one side of the wafer-positioning module in order to capture an image of each die. The die-sucking module is disposed above the wafer-positioning module and the image-capturing module in order to suck each die from the wafer-positioning module to a position above the image-capturing module for capturing a back image of a back surface of each die. The die defect analyzing module is electrically connected to the image-capturing module in order to judge whether the back image of the back surface of each die passes inspection standard.
摘要翻译：具有模具缺陷检查功能的模具缺陷检查系统包括晶片定位模块，图像捕获模块，模具吸收模块，模具缺陷分析模块，模具分类模块和控制模块。图像捕获模块设置在晶片定位模块的一侧旁边，以便捕获每个模具的图像。模具吸附模块设置在晶片定位模块和图像捕获模块上方，以便将每个模具从晶片定位模块吸入到图像捕获模块上方的位置，用于捕获背景图像每个死亡。模具缺陷分析模块电连接到图像捕获模块，以便判断每个模具的背面的背面图像是否经过检查标准。

10. 发明申请

US20090251815A1 Testing system and testing method for inspecting electonic devices 有权
标题翻译：用于检查电子设备的测试系统和测试方法
公开(公告)号：US20090251815A1
公开(公告)日：2009-10-08
申请号：US12285184
申请日：2008-09-30
申请人： Bily Wang , Kuei-Pao Chen , Hsin-Cheng Chen , Ming-Hao Chou
发明人： Bily Wang , Kuei-Pao Chen , Hsin-Cheng Chen , Ming-Hao Chou
IPC分类号： G11B27/36
CPC分类号： G01N21/95 , G01N21/8806
摘要： A testing system for inspecting electronic devices includes a first transparent disk, a first image capturing unit disposed under the first transparent disk, a second disk disposed next to the first transparent disk, a guiding unit disposed on adjacent area between the transparent disk and the second disk, and a plurality of second image capturing units disposed around the second disk. A plurality of electronic devices is continuingly supplied onto the first transparent disk and the first image capturing unit is used for capturing the images of the bottom surfaces of the electronic devices. Then, the electronic devices are guided to the second disk via the guiding unit and the second image capturing units are used for capturing the images of other surfaces of the electronic devices. A testing method for electronic devices is further disclosed.
摘要翻译：用于检查电子设备的测试系统包括第一透明盘，设置在第一透明盘下方的第一图像捕获单元，邻近第一透明盘设置的第二盘，设置在透明盘和第二透明盘之间的相邻区域上的引导单元盘，以及设置在第二盘周围的多个第二图像捕获单元。多个电子设备被连续地提供到第一透明盘上，并且第一图像捕获单元用于捕获电子设备的底面的图像。然后，电子设备经由引导单元被引导到第二盘，并且第二图像捕获单元用于捕获电子设备的其他表面的图像。进一步公开了一种电子设备的测试方法。

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