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    • 78. 发明申请
    • Apparatus for manufacturing a semiconductor device
    • 用于制造半导体器件的装置
    • US20070137567A1
    • 2007-06-21
    • US11706951
    • 2007-02-16
    • Takashi ShimizuAkihito Yamamoto
    • Takashi ShimizuAkihito Yamamoto
    • C23C16/00
    • C23C16/455C23C16/4405C23C16/52
    • An apparatus for manufacturing a semiconductor device, including a process chamber which holds a substrate to be subjected to a prescribed process, a gas inlet pipe which introduces a process gas into the process chamber, a gas outlet pipe which discharges the gas from the process chamber to outside the process chamber, component-measuring devices which measure components of the gas in the process chamber or at least two different gases, concentration-measuring devices which measure concentration of each component of the gas in the process chamber, or the concentration of each component of at least two different gases, and a control device which adjusts the components of the process gas, the concentration of each component of the process gas and an atmosphere in the process chamber, on the basis of values measured by the component-measuring device and concentration-measuring device.
    • 一种用于制造半导体器件的装置,包括:保持要进行规定处理的基板的处理室;将处理气体引入处理室的气体导入管,从处理室排出气体的气体出口管 在处理室外部,测量处理室中的气体成分或至少两种不同气体的组分测量装置,测量处理室中气体的每个组分的浓度的浓度测量装置,或每个 至少两种不同气体的组分,以及控制装置,其基于由部件测量装置测量的值来调节处理气体的组分,处理气体的每个组分的浓度和处理室中的气氛 和浓度测定装置。
    • 79. 发明申请
    • Processing system and operating method of processing system
    • 处理系统和处理系统的操作方法
    • US20050284575A1
    • 2005-12-29
    • US11196398
    • 2005-08-04
    • Kazuhide HasebeAtsushi EndoMitsuhiro OkadaJun OgawaAkihito YamamotoTakashi NakaoMasaki KamimuraYukihiro Ushiku
    • Kazuhide HasebeAtsushi EndoMitsuhiro OkadaJun OgawaAkihito YamamotoTakashi NakaoMasaki KamimuraYukihiro Ushiku
    • C23C16/44H01L21/00C23F1/00B44C1/22
    • H01L21/67248C23C16/4405H01L21/67109
    • A processing system of the present invention includes: a reaction container in which a substrate to be processed is placed, a process-gas supplying mechanism that supplies a process gas into the reaction container at a process to the substrate, a cleaning-gas supplying mechanism that supplies a corrosive cleaning gas into the reaction container at a cleaning process, a gas-discharging-way member connected to the reaction chamber, a heating unit that heats a specific portion of the reaction container and the gas-discharging-way member, a temperature detecting unit that detects a temperature of the specific portion, a temperature controlling unit that controls the heating unit based on a detection value detected by the temperature detecting unit in such a manner that the specific portion becomes to a predetermined target temperature, and a temperature changing unit that changes the target temperature between at the process to the substrate and at the cleaning process. By means of the temperature changing unit, the target temperature is set to a temperature at which adhesion of reaction by-products to the specific portion may be inhibited, at the process to the substrate, while the target temperature is set to a temperature at which corrosion of the specific portion may be inhibited, at the cleaning process.
    • 本发明的处理系统包括:反应容器,其中放置有待处理的基板,处理气体供给机构,其将处理气体在处理过程中提供给反应容器;清洗气体供给机构 在清洁过程中向反应容器提供腐蚀性清洁气体,连接到反应室的气体排出构件,加热反应容器的特定部分的加热单元和气体排出通路构件, 温度检测单元,其检测特定部分的温度;温度控制单元,其基于由温度检测单元检测的检测值以特定部分变为预定目标温度的方式控制加热单元;温度控制单元, 改变单元,其在过程到基板和清洁过程之间改变目标温度。 通过温度变化单元,将目标温度设定为在基板处理时可以抑制反应副产物对特定部分的粘附的温度,同时将目标温度设定为温度 在清洗过程中可能会抑制特定部分的腐蚀。