会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 73. 发明授权
    • Method of forming gate dielectric layer
    • 形成栅极电介质层的方法
    • US07214631B2
    • 2007-05-08
    • US10906008
    • 2005-01-31
    • Yu-Ren WangYing-Wei YenLiyuan ChengKuo-Tai Huang
    • Yu-Ren WangYing-Wei YenLiyuan ChengKuo-Tai Huang
    • H01L21/31H01L21/469
    • H01L21/0214H01L21/02332H01L21/0234H01L21/28202H01L21/3144H01L29/518
    • A method for forming a gate dielectric layer is described. A silicon oxide layer is formed on a semiconductor substrate. Then, a first and a second nitrogen doping processes are performed in sequence to the silicon oxide layer using plasma comprising inert gas and gaseous nitrogen to form a gate dielectric layer. The first nitrogen doping process is performed at a lower power, a lower pressure and a higher inert gas to nitrogen gas ratio than those at the second nitrogen doping process. The combination of the deeper nitrogen distribution of the first nitrogen doping process and the shallower nitrogen distribution of the second nitrogen doping process produces a flatter total nitrogen distribution profile so that leakage current from electron tunneling through the gate dielectric layer can be reduced.
    • 描述了形成栅介质层的方法。 在半导体衬底上形成氧化硅层。 然后,使用包含惰性气体和气态氮的等离子体,依次对氧化硅层进行第一和第二氮掺杂工艺以形成栅极电介质层。 第一氮掺杂过程在低功率,低压和高惰性气体与氮气比之下进行,与第二氮掺杂过程相比。 第一氮掺杂过程的较深氮分布和第二氮掺杂过程的较浅氮分布的组合产生更平坦的总氮分布分布,从而可以减少来自电介质穿过栅介质层的漏电流。
    • 74. 发明申请
    • METHOD OF FABRICATING A DIELECTRIC LAYER
    • 制作电介质层的方法
    • US20070082503A1
    • 2007-04-12
    • US11163218
    • 2005-10-11
    • Yun-Ren WangYing-Wei YenChien-Hua LungShu-Yen ChanKuo-Tai Huang
    • Yun-Ren WangYing-Wei YenChien-Hua LungShu-Yen ChanKuo-Tai Huang
    • H01L21/31H01L21/469
    • H01L21/02332H01L21/02337H01L21/0234H01L21/3144
    • A method of fabricating a dielectric layer is described. A substrate is provided, and a dielectric layer is formed over the substrate. The dielectric layer is performed with a nitridation process. The dielectric layer is performed with a first annealing process. A first gas used in the first annealing process includes inert gas and oxygen. The first gas has a first partial pressure ratio of inert gas to oxygen. The dielectric layer is performed with the second annealing process. A second gas used in the second annealing includes inert gas and oxygen. The second gas has a second partial pressure ratio of inert gas to oxygen, and the second partial pressure ratio is smaller than the first partial pressure ratio. At least one annealing temperature of the two annealing processes is equal to or greater than 950° C. The invention improves uniformity of nitrogen dopants distributed in dielectric layer.
    • 描述制造介电层的方法。 提供衬底,并且在衬底上形成电介质层。 介电层通过氮化处理进行。 介电层通过第一退火工艺进行。 在第一退火工艺中使用的第一种气体包括惰性气体和氧气。 第一气体具有惰性气体与氧的第一分压比。 介电层通过第二退火工艺进行。 在第二退火中使用的第二气体包括惰性气体和氧气。 第二气体具有惰性气体与氧气的第二分压比,第二分压比小于第一分压比。 两个退火工艺的至少一个退火温度等于或大于950℃。本发明改善了分布在介电层中的氮掺杂剂的均匀性。
    • 78. 发明申请
    • PROCESS FOR DEPOSITING BTBAS-BASED SILICON NITRIDE FILMS
    • 用于沉积基于BTBAS的氮化硅膜的方法
    • US20060062913A1
    • 2006-03-23
    • US10711414
    • 2004-09-17
    • Yun-Ren WangYing-Wei YenHao-Hsiang ChangTsai-Fu Hsiao
    • Yun-Ren WangYing-Wei YenHao-Hsiang ChangTsai-Fu Hsiao
    • C23C16/00
    • C23C16/345C23C16/4412
    • A chemical vapor deposition (CVD) system comprises a tubular furnace, at least one BTBAS supply piping line connected to a base portion of the tubular furnace, an exhaust piping line connected to an upper portion of the tubular furnace, a bypass line connecting the BTBAS supply piping line with the exhaust piping line, and a vacuum pump connected to the exhaust piping line, wherein the bypass line is initially interrupted. A batch of wafers is placed into a tube of the tubular furnace. Nitrogen-containing gas and carrier gas are flowed into the tube. BTBAS is flowed into the tube through the BTBAS supply piping line. A silicon nitride deposition process is then carried out in the tube to deposit a BTBAS-based silicon nitride film on the wafers. Upon completion of the silicon nitride deposition process, the BTBAS supply piping line is blocked and the initially interrupted bypass line is opened.
    • 化学气相沉积(CVD)系统包括管式炉,连接到管状炉的基部的至少一个BTBAS供应管线,连接到管式炉的上部的排气管线,连接BTBAS的旁通管 与排气管线一起供给管线,以及连接到排气管线的真空泵,其中旁路管线最初被中断。 将一批晶片放入管式炉的管中。 含氮气体和载气流入管中。 BTBAS通过BTBAS电源管线流入管。 然后在管中进行氮化硅沉积工艺,以在晶片上沉积基于BTBAS的氮化硅膜。 完成氮化硅沉积工艺后,BTBAS供电管线被堵塞,最初中断的旁路管路被打开。
    • 79. 发明授权
    • Soft picture/graphics classification system and method
    • 软图片/图形分类系统和方法
    • US06947597B2
    • 2005-09-20
    • US09965880
    • 2001-09-28
    • Ying-wei LinStuart A. SchweidJeng-nan ShiauRaja BalaZhigang Fan
    • Ying-wei LinStuart A. SchweidJeng-nan ShiauRaja BalaZhigang Fan
    • G06K9/20G06T5/00H04N1/40G06K9/62
    • H04N1/40062G06K9/00456
    • A method and system for image processing, in conjunction with classification of images between natural pictures and synthetic graphics, using SGLD texture (e.g., variance, bias, skewness, and fitness), color discreteness (e.g., R_L, R_U, and R_V normalized histograms), or edge features (e.g., pixels per detected edge, horizontal edges, and vertical edges) is provided. In another embodiment, a picture/graphics classifier using combinations of SGLD texture, color discreteness, and edge features is provided. In still another embodiment, a “soft” image classifier using combinations of two (2) or more SGLD texture, color discreteness, and edge features is provided. The “soft” classifier uses image features to classify areas of an input image in picture, graphics, or fuzzy classes.
    • 一种用于图像处理的方法和系统,结合使用SGLD纹理(例如,方差,偏差,偏度和适应度)的自然图像和合成图像之间的图像分类,颜色离散性(例如,R_L,R_U和R_V归一化直方图 )或边缘特征(例如,每个检测到的边缘的像素,水平边缘和垂直边缘)。 在另一个实施例中,提供了使用SGLD纹理,颜色离散性和边缘特征的组合的图片/图形分类器。 在另一个实施例中,提供了使用两(2)或更多SGLD纹理,颜色离散性和边缘特征的组合的“软”图像分类器。 “软”分类器使用图像特征来对图像,图形或模糊类中的输入图像的区域进行分类。