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    • 71. 发明授权
    • Server and method for managing monitored data
    • 管理监控数据的服务器和方法
    • US09037704B2
    • 2015-05-19
    • US13543885
    • 2012-07-09
    • Chung-I LeeYi-Guo WangKuan-Chiao PengJian HuangYi-Ming Lu
    • Chung-I LeeYi-Guo WangKuan-Chiao PengJian HuangYi-Ming Lu
    • G06F15/173H04L12/26
    • H04L43/04
    • A monitoring server receives the latest monitored data and corresponding monitoring time from monitoring devices connected to the server at a specified time interval. The monitoring server records monitored data of each monitoring item and the corresponding monitoring time to a pointed node of a device data list, and adds the monitored data and the corresponding monitoring time, which are recorded in the pointed node of the device data list, into a monitored data list. When a web server requests real-time monitored data, corresponding monitored data is read from the device data list and sent to the web server. When the web server requests historical monitored data of an designated period, corresponding monitored data of the designated period is read from the monitored data list and sent to the web server.
    • 监控服务器以指定的时间间隔从连接到服务器的监控设备接收最新的监控数据和相应的监控时间。 监视服务器将每个监控项目的监视数据和对设备数据列表的指向节点的相应监视时间进行记录,并将记录在设备数据列表的指向节点中的监视数据和相应的监视时间添加到 监控数据列表。 当Web服务器请求实时监控数据时,从设备数据列表中读取相应的监控数据,并将其发送到Web服务器。 当Web服务器请求指定时段的历史监视数据时,从监视数据列表中读取指定时段的对应监视数据,并将其发送到Web服务器。
    • 72. 发明授权
    • Power off delay circuit and power supply system
    • 断电延时电路和电源系统
    • US08810075B2
    • 2014-08-19
    • US13186460
    • 2011-07-19
    • Yi-Guo Chiu
    • Yi-Guo Chiu
    • H02J9/06
    • H02J9/06Y10T307/625Y10T307/826
    • A power off delay circuit includes a first diode with an anode receiving input power and a boost transformer circuit connected to a cathode of the first diode. The boost transformer circuit outputs power signals to a load circuit, and includes a capacitor, a primary winding, a first secondary winding, and a second secondary winding. The capacitor is charged when an input power is on, and discharges when the input power is off. The first secondary winding boosts power flowing through the primary winding and the first switch branch to charge the capacitor via the third switch branch when the input power is on. The capacitor discharges via the second secondary winding and the fourth switch branch when the input power is off, and the primary winding boosts discharging power of the capacitor, and outputs boosted discharging power to the load circuit via the second switch branch.
    • 断电延迟电路包括具有阳极接收输入功率的第一二极管和连接到第一二极管的阴极的升压变压器电路。 升压变压器电路将功率信号输出到负载电路,并且包括电容器,初级绕组,第一次级绕组和第二次级绕组。 当输入电源打开时,电容器充电,当输入电源关闭时放电。 当输入电源接通时,第一次级绕组增加流过初级绕组和第一开关分支的功率经由第三开关支路对电容器充电。 当输入电源关闭时,电容器经由第二次级绕组和第四开关支路放电,并且初级绕组升高电容器的放电功率,并且经由第二开关支路将升压的放电电力输出到负载电路。
    • 77. 发明授权
    • Method for chemical mechanical polishing a substrate
    • 化学机械抛光基材的方法
    • US08119529B2
    • 2012-02-21
    • US12432021
    • 2009-04-29
    • Yi GuoZhendong Liu
    • Yi GuoZhendong Liu
    • H01L21/302
    • H01L21/31053B24B37/0056B24B37/044C09G1/02
    • A method for chemical mechanical polishing of a substrate, comprising: providing a substrate, wherein the substrate comprises silicon dioxide; providing a chemical mechanical polishing composition, wherein the chemical mechanical polishing composition comprises: water, an abrasive; a diquaternary cation according to formula (I); and optionally a quaternary alkylammonium compound; providing a chemical mechanical polishing pad; creating dynamic contact at an interface between the chemical mechanical polishing pad and the substrate; and dispensing the chemical mechanical polishing composition onto the chemical mechanical polishing pad at or near the interface between the chemical mechanical polishing pad and the substrate; wherein the chemical mechanical polishing composition has a pH of 2 to 6; wherein the chemical mechanical polishing composition exhibits a silicon dioxide removal rate of at least 1,500 Å/min.
    • 一种用于基板的化学机械抛光的方法,包括:提供基板,其中所述基板包括二氧化硅; 提供化学机械抛光组合物,其中所述化学机械抛光组合物包括:水,研磨剂; 式(I)的二季阳离子; 和任选的季烷基铵化合物; 提供化学机械抛光垫; 在化学机械抛光垫和基底之间的界面处产生动态接触; 以及将化学机械抛光组合物分配到化学机械抛光垫或化学机械抛光垫与基底之间界面附近的化学机械抛光垫上; 其中所述化学机械抛光组合物的pH为2至6; 其中化学机械抛光组合物的二氧化硅去除率至少为1500埃/分钟。
    • 79. 发明申请
    • METHOD OF POLISHING A SUBSTRATE COMPRISING POLYSILICON AND AT LEAST ONE OF SILICON OXIDE AND SILICON NITRIDE
    • 抛光包含多晶硅和至少一种氧化硅和氮化硅的基材的方法
    • US20110230050A1
    • 2011-09-22
    • US12724990
    • 2010-03-16
    • Yi GuoZhendong LiuKancharla-Arun Kumar ReddyGuangyun Zhang
    • Yi GuoZhendong LiuKancharla-Arun Kumar ReddyGuangyun Zhang
    • H01L21/306
    • H01L21/31053C09G1/02
    • A method for chemical mechanical polishing of a substrate is provided, comprising: providing a substrate, wherein the substrate comprises polysilicon and at least one of silicon oxide and silicon nitride; providing a chemical mechanical polishing composition, comprising, as initial components: water; an abrasive; and an alkyl aryl polyether sulfonate compound, wherein the alkyl aryl polyether sulfonate compound has a hydrophobic portion having an alkyl group bound to an aryl ring and a nonionic acyclic hydrophilic portion having 4 to 100 carbon atoms; providing a chemical mechanical polishing pad with a polishing surface; moving the polishing surface relative to the substrate; dispensing the chemical mechanical polishing composition onto the polishing surface; and, abrading at least a portion of the substrate to polish the substrate; wherein at least some of the polysilicon is removed from the substrate; and, wherein at least some of the at least one of silicon oxide and silicon nitride is removed from the substrate.
    • 提供了一种用于基板的化学机械抛光的方法,包括:提供基板,其中所述基板包括多晶硅和氧化硅和氮化硅中的至少一种; 提供化学机械抛光组合物,其包含作为初始组分的水; 研磨剂 烷基芳基聚醚磺酸酯化合物,其中烷基芳基聚醚磺酸酯化合物具有与芳环结合的烷基的疏水部分和具有4至100个碳原子的非离子非环状亲水部分; 提供具有抛光表面的化学机械抛光垫; 相对于衬底移动抛光表面; 将化学机械抛光组合物分配到抛光表面上; 并且研磨所述衬底的至少一部分以抛光所述衬底; 其中所述多晶硅中的至少一些从所述衬底移除; 并且其中所述至少一种氧化硅和氮化硅中的至少一种从所述衬底去除。