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    • 77. 发明授权
    • Vibration type MEMS switch and fabricating method thereof
    • 振动型MEMS开关及其制造方法
    • US07528689B2
    • 2009-05-05
    • US11182775
    • 2005-07-18
    • Moon-chul LeeTae-sik ParkHee-moon Jeong
    • Moon-chul LeeTae-sik ParkHee-moon Jeong
    • H01P1/10H01H57/00
    • H01H59/0009H01H2059/0036H01H2059/0063
    • A vibration type MEMS switch and a method of fabricating the vibration type MEMS switch. The vibration type MEMS switch includes a vibrating body supplied with an alternating current voltage of a predetermined frequency to vibrate in a predetermined direction; and a stationary contact point spaced apart from the vibrating body along a vibration direction of the vibrating body. When a direct current voltage with a predetermined magnitude is applied to the stationary contact point, a vibration margin of the vibrating body is increased, the vibrating body contacts the stationary contact point and the vibration type MEMS switch is turned on. A first substrate is bonded to a second substrate to isolate the vibrating body in a sealed vacuum space. The vibration type MEMS switch is turned on and/off by a resonance.
    • 振动型MEMS开关和制造振动型MEMS开关的方法。 振动型MEMS开关包括:被提供有预定频率的交流电压的振动体以预定方向振动; 以及沿着振动体的振动方向与振动体间隔开的固定接触点。 当具有预定大小的直流电压被施加到固定触点时,振动体的振动边界增大,振动体接触固定触点,振动型MEMS开关导通。 将第一基板接合到第二基板,以在密封的真空空间中隔离振动体。 振动型MEMS开关由共振接通和断开。
    • 79. 发明授权
    • MEMS device and fabrication method thereof
    • MEMS器件及其制造方法
    • US07411261B2
    • 2008-08-12
    • US10773312
    • 2004-02-09
    • Eun-sung LeeChung-woo KimIn-sang SongJong-seok KimMoon-chul Lee
    • Eun-sung LeeChung-woo KimIn-sang SongJong-seok KimMoon-chul Lee
    • H01L29/84
    • B81B3/0078B81B2201/014B81B2203/0118B81B2203/0307B81B2203/04B81C2201/0107B81C2201/014H01H59/0009
    • A method for fabricating a MEMS device having a fixing part fixed to a substrate, a connecting part, a driving part, a driving electrode, and contact parts, includes patterning the driving electrode on the substrate; forming an insulation layer on the substrate; patterning the insulation layer and etching a fixing region and a contact region of the insulation layer; forming a metal layer over the substrate; planarizing the metal layer until the insulation layer is exposed; forming a sacrificial layer on the substrate; patterning the sacrificial layer to form an opening exposing a portion of the insulation layer and the metal layer in the fixing region; forming a MEMS structure layer on the sacrificial layer to partially fill the opening, thereby forming sidewalls therein; and selectively removing a portion of the sacrificial layer by etching so that a portion of the sacrificial layer remains in the fixing region.
    • 一种用于制造具有固定到基板上的固定部件,连接部件,驱动部件,驱动电极和接触部件的MEMS器件的方法,包括在所述基板上图形化所述驱动电极; 在所述基板上形成绝缘层; 图案化绝缘层并蚀刻绝缘层的固定区域和接触区域; 在衬底上形成金属层; 平坦化金属层直到绝缘层露出; 在所述基板上形成牺牲层; 图案化牺牲层以形成露出固定区域中绝缘层和金属层的一部分的开口; 在所述牺牲层上形成MEMS结构层以部分地填充所述开口,从而在其中形成侧壁; 并且通过蚀刻选择性地去除牺牲层的一部分,使得牺牲层的一部分保留在固定区域中。