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    • 71. 发明授权
    • Light emitting device having high optical output efficiency
    • 具有高光输出效率的发光器件
    • US07763898B2
    • 2010-07-27
    • US11589297
    • 2006-10-30
    • Satoshi TanakaNaochika HorioMasahiko Tsuchiya
    • Satoshi TanakaNaochika HorioMasahiko Tsuchiya
    • H01L27/15H01L29/18H01L31/12H01L33/00
    • H01L33/08H01L33/20H01L33/38H01L2924/0002H01L2933/0016H01L2924/00
    • A light emitting device includes a lower semiconductor layer of a first conductivity type; an optical emission layer formed on said lower semiconductor layer; an upper semiconductor layer of a second conductivity type opposite to said first conductivity type, said upper semiconductor layer being formed on said optical emission layer; a lower side electrode electrically connected to said lower semiconductor layer; and an upper side electrode electrically connected to said upper semiconductor layer, wherein said upper side electrode is formed on said upper semiconductor layer, and said upper semiconductor layer has a mesh pattern defining a plurality of sections each surrounded by said upper side electrode, and wherein at least one dent is disposed in at least one of said sections, said dent having a bottom reaching at least an upper surface of said lower semiconductor layer and having an opening with an upper edge spaced apart from said upper side electrode.
    • 发光器件包括第一导电类型的下半导体层; 形成在所述下半导体层上的光发射层; 与所述第一导电类型相反的第二导电类型的上半导体层,所述上半导体层形成在所述光发射层上; 电连接到所述下半导体层的下侧电极; 电连接到所述上半导体层的上侧电极,其中所述上侧电极形成在所述上半导体层上,并且所述上半导体层具有限定由所述上侧电极围绕的多个部分的网格图案,并且其中 至少一个凹痕设置在所述部分中的至少一个中,所述凹陷具有到达所述下半导体层的至少上表面的底部,并且具有开口,所述开口具有与所述上侧电极间隔开的上边缘。
    • 73. 发明申请
    • Light emitting device having high optical output efficiency
    • 具有高光输出效率的发光器件
    • US20070131941A1
    • 2007-06-14
    • US11589297
    • 2006-10-30
    • Satoshi TanakaNaochika HorioMasahiko Tsuchiya
    • Satoshi TanakaNaochika HorioMasahiko Tsuchiya
    • H01L33/00H01L31/12H01L27/15H01L29/26
    • H01L33/08H01L33/20H01L33/38H01L2924/0002H01L2933/0016H01L2924/00
    • A light emitting device includes a lower semiconductor layer of a first conductivity type; an optical emission layer formed on said lower semiconductor layer; an upper semiconductor layer of a second conductivity type opposite to said first conductivity type, said upper semiconductor layer being formed on said optical emission layer; a lower side electrode electrically connected to said lower semiconductor layer; and an upper side electrode electrically connected to said upper semiconductor layer, wherein said upper side electrode is formed on said upper semiconductor layer, and said upper semiconductor layer has a mesh pattern defining a plurality of sections each surrounded by said upper side electrode, and wherein at least one dent is disposed in at least one of said sections, said dent having a bottom reaching at least an upper surface of said lower semiconductor layer and having an opening with an upper edge spaced apart from said upper side electrode.
    • 发光器件包括第一导电类型的下半导体层; 形成在所述下半导体层上的光发射层; 与所述第一导电类型相反的第二导电类型的上半导体层,所述上半导体层形成在所述光发射层上; 电连接到所述下半导体层的下侧电极; 电连接到所述上半导体层的上侧电极,其中所述上侧电极形成在所述上半导体层上,并且所述上半导体层具有限定由所述上侧电极围绕的多个部分的网格图案,并且其中 至少一个凹痕设置在所述部分中的至少一个中,所述凹陷具有到达所述下半导体层的至少上表面的底部,并且具有开口,所述开口具有与所述上侧电极间隔开的上边缘。
    • 74. 发明授权
    • Gallium nitride compound semiconductor device
    • 氮化镓化合物半导体器件
    • US07193247B2
    • 2007-03-20
    • US11276653
    • 2006-03-09
    • Masahiko TsuchiyaNaochika HorioKenichi Morikawa
    • Masahiko TsuchiyaNaochika HorioKenichi Morikawa
    • H01L33/00
    • H01L33/40H01L21/28575H01L33/007H01L33/0095H01L2224/14
    • A GaN compound semiconductor device can be capable of free process design and can have optimum device characteristics. The device can include a group III nitride compound semiconductor laminate structure including an n-type GaN compound semiconductor layer and a p-type GaN compound semiconductor layer. An n electrode can be formed on the n-type GaN compound semiconductor layer, and a p electrode can be formed on the p-type GaN compound semiconductor layer. The n electrode preferably includes an Al layer of 1 to 10 nm, in contact with the n-type GaN compound semiconductor layer, and any metal layer of Rh, Ir, Pt, and Pd formed on the Al layer. The p electrode can be made of a 200 nm or less layer of of Pd, Pt, Rh, Pt/Rh, Pt/Ag, Rh/Ag, Pd/Rh, or Pd/Ag, in contact with the p-type GaN compound semiconductor layer. Both electrodes can make ohmic contact with respective n-type/p-type GaN semiconductors without application of active annealing.
    • GaN化合物半导体器件能够具有自由工艺设计并具有最佳的器件特性。 该装置可以包括包括n型GaN化合物半导体层和p型GaN化合物半导体层的III族氮化物化合物半导体层叠结构。 可以在n型GaN化合物半导体层上形成n电极,并且可以在p型GaN化合物半导体层上形成p电极。 n电极优选包括与n型GaN化合物半导体层接触的1〜10nm的Al层,以及形成在Al层上的任何Rh,Ir,Pt和Pd的金属层。 p电极可以由与p型GaN接触的Pd,Pt,Rh,Pt / Rh,Pt / Ag,Rh / Ag,Pd / Rh或Pd / Ag的200nm或更少的层制成 化合物半导体层。 两个电极都可以与相应的n型/ p型GaN半导体进行欧姆接触,而不需要主动退火。
    • 76. 发明授权
    • Gallium nitride compound semiconductor device and method of manufacturing the same
    • 氮化镓化合物半导体器件及其制造方法
    • US07049160B2
    • 2006-05-23
    • US10940690
    • 2004-09-15
    • Masahiko TsuchiyaNaochika HorioKenichi Morikawa
    • Masahiko TsuchiyaNaochika HorioKenichi Morikawa
    • H01L21/00
    • H01L33/40H01L21/28575H01L33/007H01L33/0095H01L2224/14
    • A GaN compound semiconductor device can be capable of free process design and can have optimum device characteristics. The device can include a group III nitride compound semiconductor laminate structure including an n-type GaN compound semiconductor layer and a p-type GaN compound semiconductor layer. An n electrode can be formed on the n-type GaN compound semiconductor layer, and a p electrode can be formed on the p-type GaN compound semiconductor layer. The n electrode preferably includes an Al layer of 1 to 10 nm, in contact with the n-type GaN compound semiconductor layer, and any metal layer of Rh, Ir, Pt, and Pd formed on the Al layer. The p electrode can be made of a 200 nm or less layer of of Pd, Pt, Rh, Pt/Rh, Pt/Ag, Rh/Ag, Pd/Rh, or Pd/Ag, in contact with the p-type GaN compound semiconductor layer. Both electrodes can make ohmic contact with respective n-type/p-type GaN semiconductors without application of active annealing.
    • GaN化合物半导体器件能够具有自由工艺设计并具有最佳的器件特性。 该装置可以包括包括n型GaN化合物半导体层和p型GaN化合物半导体层的III族氮化物化合物半导体层叠结构。 可以在n型GaN化合物半导体层上形成n电极,并且可以在p型GaN化合物半导体层上形成p电极。 n电极优选包括与n型GaN化合物半导体层接触的1〜10nm的Al层,以及形成在Al层上的任何Rh,Ir,Pt和Pd的金属层。 p电极可以由与p型GaN接触的Pd,Pt,Rh,Pt / Rh,Pt / Ag,Rh / Ag,Pd / Rh或Pd / Ag的200nm或更少的层制成 化合物半导体层。 两个电极都可以与相应的n型/ p型GaN半导体进行欧姆接触,而不需要主动退火。
    • 80. 发明授权
    • Drive shaft bearing structure for boat
    • 驱动轴轴承结构船
    • US06699084B2
    • 2004-03-02
    • US10219660
    • 2002-08-16
    • Tomohiro FuseMasahiko Tsuchiya
    • Tomohiro FuseMasahiko Tsuchiya
    • B63H2334
    • F16C19/54B63H11/08B63H23/321B63H23/36B63H2011/081B63H2023/327F16C33/6607F16C33/6622F16C33/76F16C35/061F16C2326/30
    • A bearing member for rotatably supporting a drive shaft for driving an impeller on a boat body configured to prevent wearing of an outside circumferential surface of a drive shaft and/or an inside circumferential surface of an inner lace. An inner lace makes contact with an outside circumferential surface of the drive shaft, and an outer lace is disposed on the outside of the inner lace with a rotary body dsiposed therebetween. A connecting member for rotating both the drive shaft and the inner lace is provided between the outside circumferential surface of the drive shaft and the inner lace. The connecting member is a ring-shaped elastic body pressed against the outside circumferential surface of the drive shaft and a side surface of the inner lace. Two bearing members are provided at an interval therebetween, and the connecting member is disposed between the bearing members.
    • 一种用于可旋转地支撑用于驱动船体上的叶轮的驱动轴的轴承构件,其构造成防止驱动轴的外周面和/或内花边的内周面的磨损。 内部花边与驱动轴的外周表面接触,并且外花边设置在内花边的外侧,旋转体在其间分开。 在驱动轴的外周表面和内花边之间设置用于使驱动轴和内花边旋转的连接构件。 连接构件是压靠在驱动轴的外周面和内花边的侧面的环状弹性体。 两个轴承部件间隔设置,连接部件配置在轴承部件之间。