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    • 61. 发明授权
    • Method of producing a piezoelectric/electrostrictive device
    • 制造压电/电致伸缩器件的方法
    • US06766568B2
    • 2004-07-27
    • US10237495
    • 2002-09-09
    • Koji IkedaFumitake TakahashiKazuyoshi Shibata
    • Koji IkedaFumitake TakahashiKazuyoshi Shibata
    • H04R1700
    • H01L41/43G11B5/483G11B5/4873H01L41/0946H01L41/273Y10T29/42Y10T29/43Y10T29/435Y10T29/49126Y10T29/49798
    • A method of producing a piezoelectric/electrostrictive device having a base including a pair of movable parts opposing each other, a fixing part that connects the movable parts with each other at one end thereof, and mounting parts that extend for a predetermined length while holding slit-shaped gaps of a predetermined width along inside surfaces of said movable parts by being turned around at the other end of said movable parts, said piezoelectric/electrostrictive device having a piezoelectric/electrostrictive element disposed on at least one outside surface of said movable parts of said base, wherein a base block obtained by laminating and calcining a large number of ceramic green sheets is adopted as a material for forming said base, and the base including said movable parts, said fixing part, and said mounting parts is formed by cutting said base block at a predetermined site along a lamination direction of said ceramic green sheets.
    • 一种制造压电/电致伸缩器件的方法,该压电/电致伸缩器件具有包括彼此相对的一对可动部件的基部,一端连接可动部件的固定部件,同时保持狭缝而延伸规定长度的安装部件 所述压电/电致伸缩装置具有压电/电致伸缩元件,所述压电/电致伸缩元件设置在所述可移动部分的至少一个外表面上,所述压电/电致伸缩元件设置在所述可移动部分的至少一个外表面上, 所述基底,其中通过层压和煅烧大量陶瓷生片而获得的基底块被用作形成所述基底的材料,并且包括所述可移动部分,所述固定部分和所述安装部分的基底通过切割所述基部 基块沿着所述陶瓷生片的层叠方向在预定位置。
    • 63. 发明授权
    • Method of making thick film pressure and temperature sensors on a stainless steel diaphragm
    • 在不锈钢隔膜上制作厚膜压力和温度传感器的方法
    • US06725514B2
    • 2004-04-27
    • US10159821
    • 2002-05-31
    • James I. MoyerJoseph M. Ratell
    • James I. MoyerJoseph M. Ratell
    • H04R1700
    • G01L19/147G01K7/183G01L9/0055G01L19/0092Y10T29/42Y10T29/49085Y10T29/49099Y10T29/49101Y10T29/49103Y10T29/49155
    • A method of making a low-cost metal diaphragm sensor that integrates both pressure and temperature sensing in a single sensor assembly utilizes thick-film processing to form a circuit including stress and temperature sensitive elements on the outboard or exposed surface of a thin metal diaphragm separating the circuit from a pressurized fluid. Only a thin layer of dielectric separates the stress and temperature sensitive elements from the diaphragm surface. The stress sensitive elements respond to mechanical stressing of the diaphragm due to the presence of the pressurized fluid, while the temperature sensitive element responds to the temperature of the pressurized fluid. The thermal capacity of the fluid greatly exceeds that of the diaphragm, so that the temperature responsive characteristic of the temperature sensitive element accurately reflects the temperature of the pressurized fluid.
    • 制造在单个传感器组件中将压力和温度感测集成在一起的低成本金属膜片传感器的方法利用厚膜处理来形成包括应力和温度敏感元件的电路,该元件在薄金属隔膜分隔件的外侧或暴露表面上 来自加压流体的电路。 只有薄层的介质将应力和温度敏感元件与隔膜表面分开。 应力敏感元件由于加压流体的存在而响应于隔膜的机械应力,而温度敏感元件响应加压流体的温度。 流体的热容量大大超过隔膜的热容量,使得温度敏感元件的温度响应特性能够精确地反映加压流体的温度。
    • 67. 发明授权
    • Method of manufacturing and mounting electronic devices to limit the effects of parasitics
    • 制造和安装电子设备以限制寄生效应的方法
    • US06675450B1
    • 2004-01-13
    • US09698175
    • 2000-10-30
    • Linus Albert FetterYiu-Huen WongMichael George Zierdt
    • Linus Albert FetterYiu-Huen WongMichael George Zierdt
    • H04R1700
    • H03H9/172G01R31/2824H01L24/81H01L2224/8121H01L2224/81815H01L2924/01019H01L2924/14H03H3/02H03H9/02125Y10T29/42Y10T29/49144Y10T29/49155Y10T29/49156H01L2924/00
    • A method of producing and mounting electronic devices to negate the effects of parasitics on device performance. In one aspect, the substrate surface of the device is coated with a thin, etch-resistant film during fabrication that acts as a barrier to allow removal of substrate material beneath the film, creating a suspended structure upon which the remaining layers of circuitry rest. Alternatively the device is made with a film that is integral to the device, and that acts as the supporting membrane. To mount the device on a carrier or package, solder bumps are applied near the ends of the conductors of the device, and the die is then secured to a carrier or package, and positioned so that leads extending from the conductors mate up with bonding strips on the carrier or package. The solder bumps are then reflowed or melted to establish electrical connection between leads of the device and corresponding bonding strips of the carrier. The resultant electronic device is essentially immune to the effects or parasitic capacitanaces and parasitic inductances, with the device as mounted being further configured so as to tune out any residual parasitics which may still exist after fabrication.
    • 一种制造和安装电子设备以消除寄生效应对设备性能的方法。 在一个方面,在制造期间,器件的衬底表面涂覆有薄的耐蚀刻膜,其用作屏障以允许去除膜下方的衬底材料,产生悬挂结构,剩余的电路层在其上休息。 或者,该装置由与装置成一体的膜制成,并且用作支撑膜。 为了将器件安装在载体或封装上,在器件的导体的端部附近施加焊料凸块,然后将管芯固定到载体或封装上,并将其定位成使得从导体延伸的引线与接合条配合 在载体或包装上。 焊料凸块然后被回流或熔化,以在器件的引线和载体的相应接合条之间建立电连接。 所得到的电子器件基本上免受影响或寄生电容和寄生电感的影响,安装的器件被进一步配置以便调出在制造之后仍然存在的任何残留寄生效应。