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1. 发明授权

US06725514B2 Method of making thick film pressure and temperature sensors on a stainless steel diaphragm 有权
标题翻译：在不锈钢隔膜上制作厚膜压力和温度传感器的方法
公开(公告)号：US06725514B2
公开(公告)日：2004-04-27
申请号：US10159821
申请日：2002-05-31
申请人： James I. Moyer , Joseph M. Ratell
发明人： James I. Moyer , Joseph M. Ratell
IPC分类号： H04R1700
CPC分类号： G01L19/147 , G01K7/183 , G01L9/0055 , G01L19/0092 , Y10T29/42 , Y10T29/49085 , Y10T29/49099 , Y10T29/49101 , Y10T29/49103 , Y10T29/49155
摘要： A method of making a low-cost metal diaphragm sensor that integrates both pressure and temperature sensing in a single sensor assembly utilizes thick-film processing to form a circuit including stress and temperature sensitive elements on the outboard or exposed surface of a thin metal diaphragm separating the circuit from a pressurized fluid. Only a thin layer of dielectric separates the stress and temperature sensitive elements from the diaphragm surface. The stress sensitive elements respond to mechanical stressing of the diaphragm due to the presence of the pressurized fluid, while the temperature sensitive element responds to the temperature of the pressurized fluid. The thermal capacity of the fluid greatly exceeds that of the diaphragm, so that the temperature responsive characteristic of the temperature sensitive element accurately reflects the temperature of the pressurized fluid.
摘要翻译：制造在单个传感器组件中将压力和温度感测集成在一起的低成本金属膜片传感器的方法利用厚膜处理来形成包括应力和温度敏感元件的电路，该元件在薄金属隔膜分隔件的外侧或暴露表面上来自加压流体的电路。只有薄层的介质将应力和温度敏感元件与隔膜表面分开。应力敏感元件由于加压流体的存在而响应于隔膜的机械应力，而温度敏感元件响应加压流体的温度。流体的热容量大大超过隔膜的热容量，使得温度敏感元件的温度响应特性能够精确地反映加压流体的温度。

2. 发明授权

US06536286B1 Pressure sensor connector 有权
标题翻译：压力传感器连接器
公开(公告)号：US06536286B1
公开(公告)日：2003-03-25
申请号：US09702920
申请日：2000-10-30
申请人： James I. Moyer , Joseph M. Ratell , Daniel A. Lawlyes , Paul J. Pitzer , Perry L. Martinson , Steven T. Reyburn
发明人： James I. Moyer , Joseph M. Ratell , Daniel A. Lawlyes , Paul J. Pitzer , Perry L. Martinson , Steven T. Reyburn
IPC分类号： G01L1302
CPC分类号： G01L19/143 , G01L19/0069 , G01L19/0084 , G01L19/148
摘要： A pressure sensor connector (10) for use with a pressure sensor element (12) that includes a plurality of pressure sensor terminals (13). The pressure sensor connector (10) includes a housing (18), a plurality of connector terminals (20) and a flexible circuit (22). A plurality of electrical pathways (24), formed on the flexible circuit (22), connect each of the plurality of connector terminals (20) to a corresponding pressure sensor terminal (13).
摘要翻译：一种与包括多个压力传感器端子（13）的压力传感器元件（12）一起使用的压力传感器连接器（10）。压力传感器连接器（10）包括壳体（18），多个连接器端子（20）和柔性电路（22）。形成在柔性电路（22）上的多个电路（24）将多个连接器端子（20）中的每一个连接到相应的压力传感器端子（13）。

3. 发明申请

US20080066956A1 Electronic enclosure with continuous ground contact surface 失效
标题翻译：具有连续接地面的电子外壳
公开(公告)号：US20080066956A1
公开(公告)日：2008-03-20
申请号：US11523985
申请日：2006-09-20
申请人： Daniel A. Lawlyes , Joseph M. Ratell
发明人： Daniel A. Lawlyes , Joseph M. Ratell
IPC分类号： H05K7/14
CPC分类号： H05K5/062 , H05K9/0073
摘要： An enclosure for electronic circuitry is provided which has a first housing member having at least one protrusion formed in a wall and a second housing member having at least one slot for receiving the at least one protrusion and securing the second housing member to the first housing member. The second housing member and the first housing member have one or more continuous electrical ground contact surfaces. The second housing member is secured to the first housing member so that there is an interference fit between the at least one protrusion and at least one slot and so that there are one or more continuous electrical ground contact surfaces between the first housing member and the second housing member. A method of assembling an enclosure for electronic circuitry is provided.
摘要翻译：提供了一种用于电子电路的外壳，其具有第一壳体构件，该第一壳体构件具有形成在壁中的至少一个突出部和第二壳体构件，该第二壳体构件具有用于容纳至少一个突起的至少一个狭槽并将第二壳体构件固定到第一壳体构件。第二壳体构件和第一壳体构件具有一个或多个连续的电接地表面。第二壳体构件被固定到第一壳体构件，使得在至少一个突起和至少一个狭槽之间存在过盈配合，并且使得在第一壳体构件和第二壳体构件之间存在一个或多个连续的电接地表面住房成员提供了一种组装用于电子电路的外壳的方法。

4. 发明授权

US06447342B1 Pressure sensor connector 有权
标题翻译：压力传感器连接器
公开(公告)号：US06447342B1
公开(公告)日：2002-09-10
申请号：US09851876
申请日：2001-05-10
申请人： Daniel A. Lawlyes , Joseph M. Ratell
发明人： Daniel A. Lawlyes , Joseph M. Ratell
IPC分类号： H01R13502
CPC分类号： G01L19/0084 , H01R13/5216
摘要： A pressure sensor connector (10) for use with a pressure sensor element (12) that includes a plurality of pressure sensor terminals (13). The pressure sensor connector (10) includes a cap (18), a plurality of connector terminals (20) and a frame element (22). A plurality of contacts (24), included in the frame element (22), connect each of the plurality of connector terminals (20) to a corresponding pressure sensor terminal (13).
摘要翻译：一种与包括多个压力传感器端子（13）的压力传感器元件（12）一起使用的压力传感器连接器（10）。压力传感器连接器（10）包括盖（18），多个连接器端子（20）和框架元件（22）。包括在框架元件（22）中的多个触点（24）将多个连接器端子（20）中的每一个连接到相应的压力传感器端子（13）。

5. 发明授权

US07608924B2 Liquid cooled power electronic circuit comprising stacked direct die cooled packages 有权
标题翻译：液冷电力电子电路包括堆叠的直接模具冷却封装
公开(公告)号：US07608924B2
公开(公告)日：2009-10-27
申请号：US11800003
申请日：2007-05-03
申请人： Bruce A. Myers , Joseph M. Ratell
发明人： Bruce A. Myers , Joseph M. Ratell
IPC分类号： H01L23/473
CPC分类号： H01L23/473 , H01L23/367 , H01L23/3677 , H01L23/4012 , H01L25/117 , H01L2924/0002 , H01L2924/00
摘要： A plurality of direct die cooled semiconductor power device packages are vertically stacked with both coolant and electrical interfacing to form a liquid cooled power electronic circuit. The packages are individually identical, and selectively oriented prior to stacking in order to form the desired circuit connections and laterally stagger the package leads.
摘要翻译：多个直接模具冷却的半导体功率器件封装件以冷却剂和电接口两者垂直堆叠形成液冷电力电子电路。这些包装件是单独相同的，并且在堆叠之前选择性地取向以形成所需的电路连接并横向错开封装引线。

6. 发明授权

US07563992B2 Electronic enclosure with continuous ground contact surface 失效
标题翻译：具有连续接地面的电子外壳
公开(公告)号：US07563992B2
公开(公告)日：2009-07-21
申请号：US11523985
申请日：2006-09-20
申请人： Daniel A. Lawlyes , Joseph M. Ratell
发明人： Daniel A. Lawlyes , Joseph M. Ratell
IPC分类号： H01R13/502
CPC分类号： H05K5/062 , H05K9/0073
摘要： An enclosure for electronic circuitry is provided which has a first housing member having at least one protrusion formed in a wall and a second housing member having at least one slot for receiving the at least one protrusion and securing the second housing member to the first housing member. The second housing member and the first housing member have one or more continuous electrical ground contact surfaces. The second housing member is secured to the first housing member so that there is an interference fit between the at least one protrusion and at least one slot and so that there are one or more continuous electrical ground contact surfaces between the first housing member and the second housing member. A method of assembling an enclosure for electronic circuitry is provided.
摘要翻译：提供了一种用于电子电路的外壳，其具有第一壳体构件，该第一壳体构件具有形成在壁中的至少一个突出部和第二壳体构件，该第二壳体构件具有用于容纳至少一个突起的至少一个狭槽并将第二壳体构件固定到第一壳体构件。第二壳体构件和第一壳体构件具有一个或多个连续的电接地表面。第二壳体构件被固定到第一壳体构件，使得在至少一个突起和至少一个狭槽之间存在过盈配合，并且使得在第一壳体构件和第二壳体构件之间存在一个或多个连续的电接地表面住房成员提供了一种组装用于电子电路的外壳的方法。

7. 发明授权

US4647894A Novel designs for packaging circuit protection devices 失效
标题翻译：包装电路保护装置的新颖设计
公开(公告)号：US4647894A
公开(公告)日：1987-03-03
申请号：US711907
申请日：1985-03-14
申请人： Joseph M. Ratell
发明人： Joseph M. Ratell
IPC分类号： H01H69/02 , H01C1/022 , H01C7/02 , H01H37/76 , H01H69/00 , H01C7/10
CPC分类号： H01C7/027 , H01C1/022
摘要： Circuit protection devices which comprise a PTC conductive polymer element and an enclosure, and which are less likely to cause damage to other electrical components through release of carbonaceous dust. On the interior surface of the enclosure, there is a projection or other disconformity which is spaced apart from the electrodes and which provides a site for arc initiation. In this way, the danger of erosion creating a hole in the enclosure is reduced. Preferably each of the electrodes is surrounded by a projection.
摘要翻译：包括PTC导电聚合物元件和外壳的电路保护装置，并且不太可能通过释放碳质粉尘而损坏其它电气部件。在外壳的内表面上，存在与电极间隔开的突起或其它不连续性，并提供电弧起始的位置。以这种方式，减少了在外壳中形成孔的侵蚀的危险。优选地，每个电极被突起包围。

8. 发明申请

US20080272485A1 Liquid cooled power electronic circuit comprising stacked direct die cooled packages 有权
标题翻译：液冷电力电子电路包括堆叠的直接模具冷却封装
公开(公告)号：US20080272485A1
公开(公告)日：2008-11-06
申请号：US11800003
申请日：2007-05-03
申请人： Bruce A. Myers , Joseph M. Ratell
发明人： Bruce A. Myers , Joseph M. Ratell
IPC分类号： H01L23/473
CPC分类号： H01L23/473 , H01L23/367 , H01L23/3677 , H01L23/4012 , H01L25/117 , H01L2924/0002 , H01L2924/00
摘要： A plurality of direct die cooled semiconductor power device packages are vertically stacked with both coolant and electrical interfacing to form a liquid cooled power electronic circuit. The packages are individually identical, and selectively oriented prior to stacking in order to form the desired circuit connections and laterally stagger the package leads.
摘要翻译：多个直接模具冷却的半导体功率器件封装件以冷却剂和电接口两者垂直堆叠形成液冷电力电子电路。这些包装件是单独相同的，并且在堆叠之前选择性地取向以形成所需的电路连接并横向错开封装引线。

9. 发明授权

US4647896A Materials for packaging circuit protection devices 失效
标题翻译：封装材料电路保护装置
公开(公告)号：US4647896A
公开(公告)日：1987-03-03
申请号：US711908
申请日：1985-03-14
申请人： Joseph M. Ratell
发明人： Joseph M. Ratell
IPC分类号： H01C1/022 , H01C7/02 , H01C7/10
CPC分类号： H01C1/022 , H01C7/027
摘要： Circuit protection devices which have a PTC conductive polymer element and an enclosure which is spaced apart from the PTC element and at least a part of whose interior surface is composed of a material which has an oxygen index of at least 70 and has a thermoset polymer, preferably an alkyd resin, and a filler, such as alumina trihydrate, which, when heated in the absence of air, decomposes to give a gaseous by-product.
摘要翻译：具有PTC导电聚合物元件的电路保护装置和与PTC元件间隔开的外壳，并且其内表面的至少一部分由氧指数为至少70的材料组成并具有热固性聚合物，优选醇酸树脂，以及填充剂，例如三水合氧化铝，其在不存在空气的情况下加热分解以产生气态副产物。

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