专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

61. 发明申请

US20120160547A1 CORELESS LAYER BUILDUP STRUCTURE 有权
标题翻译：无线层建筑结构
公开(公告)号：US20120160547A1
公开(公告)日：2012-06-28
申请号：US12764993
申请日：2010-04-22
申请人： Timothy Antesberger , Rabindra N. Das , Frank D. Egitto , Voya R. Markovich , William E. Wilson
发明人： Timothy Antesberger , Rabindra N. Das , Frank D. Egitto , Voya R. Markovich , William E. Wilson
IPC分类号： H05K1/03 , H05K1/02 , H05K1/09 , H05K1/00
CPC分类号： H05K3/462 , H05K1/167 , H05K3/4069 , H05K3/4623 , H05K3/4632 , H05K2203/0191 , H05K2203/061 , H05K2203/063
摘要： A substrate for use in a PCB or PWB board having a coreless buildup layer and at least one metal and at least one dielectric layer. The coreless buildup dielectric layers can consist of at least partially cured thermoset resin and thermoplastic resin.
摘要翻译：一种用于PCB或PWB板的衬底，其具有无芯堆积层和至少一个金属和至少一个介电层。无芯堆积电介质层可由至少部分固化的热固性树脂和热塑性树脂组成。

62. 发明授权

US08198550B2 Printed circuit board and method of manufacturing the same 有权
标题翻译：印刷电路板及其制造方法
公开(公告)号：US08198550B2
公开(公告)日：2012-06-12
申请号：US12385003
申请日：2009-03-27
申请人： Jee Soo Mok , Je Gwang Yoo , Chang Sup Ryu
发明人： Jee Soo Mok , Je Gwang Yoo , Chang Sup Ryu
IPC分类号： H01R12/04
CPC分类号： H05K3/4069 , H05K3/06 , H05K3/107 , H05K3/28 , H05K3/4647 , H05K2201/0355 , H05K2201/0376 , H05K2201/09481 , H05K2203/0278 , H05K2203/1461 , Y10T29/49144 , Y10T29/49155
摘要： A printed circuit board and a method of manufacturing the printed circuit board, in which the printed circuit board includes an insulating layer, a circuit layer embedded in the insulating layer and having a connection pad that is embedded in the insulating layer such that one side of the connection pad is flush with a surface of the insulating layer, and insulating materials configured to protect the circuit layer from an external environment and having an opening through which the connection pad is exposed. The manufacturing process includes a step of pressing the circuit layer and the insulating material into the insulating layer to form a level surface while leaving the connection pads flush at the surface. The method makes the printed circuit board slim, and increases reliability and the degree of design freedom.
摘要翻译：一种印刷电路板和印刷电路板的制造方法，其中印刷电路板包括绝缘层，嵌入绝缘层中的电路层，并且具有嵌入在绝缘层中的连接焊盘，使得所述连接垫与所述绝缘层的表面齐平，以及被配置为保护所述电路层免受外部环境并且具有所述连接焊盘暴露的开口的绝缘材料。该制造方法包括将电路层和绝缘材料压入绝缘层中以形成水平表面，同时使连接垫在表面平齐的步骤。该方法使印刷电路板变薄，提高了可靠性和设计自由度。

63. 发明申请

US20120132458A1 FLEXIBLE CIRCUIT BOARD 有权
标题翻译：柔性电路板
公开(公告)号：US20120132458A1
公开(公告)日：2012-05-31
申请号：US13234551
申请日：2011-09-16
申请人： Noriaki SEKINE
发明人： Noriaki SEKINE
IPC分类号： H05K1/03
CPC分类号： H05K1/0393 , H05K1/0218 , H05K1/0219 , H05K1/118 , H05K3/4069 , H05K3/4614 , H05K3/4626 , H05K3/4652 , H05K3/4688 , H05K2201/0133 , H05K2201/0141 , H05K2201/0715
摘要： In a flexible circuit board, signal wirings and ground wirings are provided on one main surface of a base film formed of a thermoset resin. A coverlay film formed of a thermoplastic resin is adhered to and integrated with the signal wirings, ground wirings, and base film. External terminals 15 are disposed in a predetermined conductor pattern on one main surface of the coverlay film, and a plated layer is formed on each of the external terminals. A first ground layer and a rear side resin film are adhered in this order below the base film to be integrated.
摘要翻译：在柔性电路板中，信号布线和接地布线设置在由热固性树脂形成的基底膜的一个主表面上。由热塑性树脂形成的覆盖膜被粘附并与信号布线，接地布线和基底膜一体化。外部端子15以覆盖层膜的一个主表面上的规定的导体图形配置，并且在每个外部端子上形成镀层。第一接地层和后侧树脂膜在基膜下方依次粘合以一体化。

64. 发明申请

US20120118618A1 Printed circuit board and method for manufacturing the same 审中-公开
标题翻译：印刷电路板及其制造方法
公开(公告)号：US20120118618A1
公开(公告)日：2012-05-17
申请号：US12929480
申请日：2011-01-27
申请人： Byung Seung Min
发明人： Byung Seung Min
IPC分类号： H05K1/09 , H05K3/10 , H05K1/11
CPC分类号： H05K3/045 , H01L21/486 , H01L23/49827 , H01L2924/0002 , H05K3/1258 , H05K3/4069 , H05K2203/025 , Y10T29/49155 , H01L2924/00
摘要： Disclosed herein are a printed circuit board and a method for manufacturing the same. The method for manufacturing a printed circuit board includes: (a) forming at least one plate through hole penetrating through an insulating layer; (b) forming pattern grooves for implementing inner layer circuits on both surfaces of the insulating layer; and (c) filling the plate through hole and the pattern grooves with a conductive material. The method for manufacturing a printed circuit board may provide the printed circuit board having excellent heat radiating characteristics and reduce process cost.
摘要翻译：这里公开了一种印刷电路板及其制造方法。制造印刷电路板的方法包括：（a）形成穿过绝缘层的至少一个板通孔; （b）形成用于在绝缘层的两个表面上实现内层电路的图案槽; 和（c）用导电材料填充板通孔和图案槽。制造印刷电路板的方法可以提供具有优异散热特性并降低工艺成本的印刷电路板。

65. 发明授权

US08158503B2 Multilayer interconnection substrate and method of manufacturing the same 有权
标题翻译：多层互连基板及其制造方法
公开(公告)号：US08158503B2
公开(公告)日：2012-04-17
申请号：US11474453
申请日：2006-06-26
申请人： Tomoyuki Abe
发明人： Tomoyuki Abe
IPC分类号： H01L21/44
CPC分类号： H05K3/4614 , H01L21/486 , H01L23/49822 , H01L23/49827 , H01L2924/0002 , H05K3/3473 , H05K3/4069 , H05K3/4617 , H05K3/462 , H05K2201/0215 , H05K2201/10378 , H01L2924/00
摘要： A multilayer interconnection substrate is disclosed that includes a multilayer interconnection layer having at least a first interconnection layer and a second interconnection layer stacked with an insulating layer provided therebetween, and a connection via configured to electrically connect the first interconnection layer and the second interconnection layer. The connection via includes an internal conductor and a metal film covering the internal conductor. The internal conductor is an aggregate of metal particles.
摘要翻译：公开了一种多层互连衬底，其包括具有至少第一互连层和层叠有设置在其间的绝缘层的第二互连层的多层互连层，以及经配置以电连接第一互连层和第二互连层的连接通孔。连接通孔包括内部导体和覆盖内部导体的金属膜。内部导体是金属颗粒的聚集体。

66. 发明授权

US08115110B2 Printed circuit board minimizing undesirable signal reflections in a via and methods therefor 有权
标题翻译：印刷电路板最小化通孔中的不期望的信号反射及其方法
公开(公告)号：US08115110B2
公开(公告)日：2012-02-14
申请号：US11822137
申请日：2007-07-02
申请人： Leon M. Khilchenko , Mark W. Gailus
发明人： Leon M. Khilchenko , Mark W. Gailus
IPC分类号： H05K1/11
CPC分类号： H05K3/4038 , H05K1/0298 , H05K3/321 , H05K3/3447 , H05K3/4046 , H05K3/4069 , H05K2201/0305 , H05K2201/0919 , H05K2201/10234 , H05K2201/1059 , H05K2201/10992 , H05K2203/041 , H05K2203/1446 , Y10T29/4913 , Y10T29/49139 , Y10T29/49147 , Y10T29/49165
摘要： What is provided is a multi-layer PCB having a plurality of stacked dielectric layers, a conductor disposed on at least one of the plurality of dielectric layers, and a non-conductive via extending through at least a portion of the plurality of dielectric layers to intersect the conductor. A conductive body in an activated state is introduced into the non-conductive via, and upon contacting the conductor, the activated state conductive body adheres to the conductor. The activated state conductive body is then effected to a deactivated state, wherein the conductive body is affixed to the conductor to provide an electrical connection thereto.
摘要翻译：提供的是具有多个堆叠的电介质层的多层PCB，设置在多个电介质层中的至少一个介质层上的导体，以及延伸穿过多个电介质层的至少一部分的非导电通孔，与导体相交。处于激活状态的导电体被引入到非导电通孔中，并且在与导体接触时，活化状态导电体粘附到导体。然后使激活状态的导电体进入去激活状态，其中导电体固定到导体以提供与其的电连接。

67. 发明授权

US08115108B2 Flexible printed circuit board and manufacturing method for the same 有权
标题翻译：柔性印刷电路板及其制造方法相同
公开(公告)号：US08115108B2
公开(公告)日：2012-02-14
申请号：US12291892
申请日：2008-11-14
申请人： Nobuyuki Sakai
发明人： Nobuyuki Sakai
IPC分类号： H05K1/11
CPC分类号： H05K3/0061 , H05K1/0393 , H05K1/056 , H05K3/005 , H05K3/321 , H05K3/4069 , H05K3/4084 , H05K3/44 , H05K2201/091 , H05K2201/09554 , H05K2203/063 , Y10T29/49153 , Y10T29/49155 , Y10T29/49156
摘要： The insulation base side of single-sided FPC is turned to the die side, and the mounting surface side of ground circuit is turned to the upper side, and the FPC is placed on die (a). When the portion of ground circuit where the conduction is realized and metal reinforcing plate are punched by punch of which the clearance dimension is made to be 50 to 95% of the thickness of the material to be punched, hole sagging will be formed (b). The insulation base 1 side is turned up, electrically conductive adhesive and metal reinforcing plate are laminated in this order, heating pressing is performed with the press apparatus for metal reinforcing plate to be laminated (c). Thereby, laminated FPC is formed (d). At this time, since electrically conductive adhesive is injected into hole sagging by press pressing, the electrical connection of metal reinforcing plate and ground circuit can be attained by the interlaminar conduction by means of electrically conductive adhesive, and there is also no residual air.
摘要翻译：单面FPC的绝缘基底侧向模具侧转动，接地电路的安装面侧向上侧转动，将FPC放置在模具（a）上。当实现导通的接地电路的部分和金属加强板用冲孔冲压成冲孔材料厚度的50％至95％时，将形成孔下垂（b）。将绝缘基体1侧翻转，依次层压导电性粘合剂和金属加强板，用层叠（c）的金属加强板用加压装置进行加压加压。由此形成层叠FPC（d）。此时，由于通过压制将导电性粘合剂注入到孔下垂中，所以可以通过导电性粘合剂进行层间导电，可以实现金属加强板与接地电路的电连接，也不会有残留空气。

68. 发明申请

US20120031649A1 CORELESS LAYER BUILDUP STRUCTURE WITH LGA AND JOINING LAYER 有权
标题翻译：无缝层建筑结构与LGA和接合层
公开(公告)号：US20120031649A1
公开(公告)日：2012-02-09
申请号：US12764997
申请日：2010-04-22
申请人： Timothy Antesberger , Rabindra N. Das , Frank D. Egitto , Voya R. Markovich , William E. Wilson
发明人： Timothy Antesberger , Rabindra N. Das , Frank D. Egitto , Voya R. Markovich , William E. Wilson
IPC分类号： H05K1/02
CPC分类号： H05K3/4069 , H05K3/4614 , H05K3/462 , H05K3/4623 , H05K2203/063
摘要： A substrate for use in a PCB or PWB board having a coreless buildup layer and at least one metal and at least one dielectric layer. The coreless buildup dielectric layers can consist of at least partially cured thermoset resin and thermoplastic resin. The substrate may also contain land grid array (LGA) packaging.
摘要翻译：一种用于PCB或PWB板的衬底，其具有无芯堆积层和至少一个金属和至少一个介电层。无芯堆积电介质层可由至少部分固化的热固性树脂和热塑性树脂组成。衬底还可以包含焊盘阵列（LGA）封装。

69. 发明申请

US20120017437A1 CIRCUITIZED SUBSTRATE WITH CONDUCTIVE PASTE, ELECTRICAL ASSEMBLY INCLUDING SAID CIRCUITIZED SUBSTRATE AND METHOD OF MAKING SAID SUBSTRATE 有权
标题翻译：具有导电性浆料的电路基板，包括公知的基板的电气装置和制造基板的方法
公开(公告)号：US20120017437A1
公开(公告)日：2012-01-26
申请号：US13252256
申请日：2011-10-04
申请人： Rabindra N. Das , Kostas I. Papathomas , Voya R. Markovich
发明人： Rabindra N. Das , Kostas I. Papathomas , Voya R. Markovich
IPC分类号： H05K3/40
CPC分类号： H05K1/0313 , B23K26/382 , B23K26/40 , B23K2101/40 , B23K2103/16 , B23K2103/172 , B23K2103/52 , H01B1/22 , H01L2224/16225 , H01L2224/32245 , H01L2224/73253 , H01L2924/01322 , H01L2924/15311 , H05K1/097 , H05K3/4053 , H05K3/4069 , H05K3/462 , H05K3/4623 , H05K3/4641 , H05K2201/0257 , H05K2201/09536 , H05K2201/0959 , H05K2201/096 , H05K2201/09718 , H05K2201/10378 , H05K2203/0425 , H05K2203/1152 , Y10T29/49128 , Y10T29/49165 , H01L2924/00
摘要： A circuitized substrate which includes a conductive paste for providing electrical connections. The paste, in one embodiment, includes a metallic component including nano-particles and may include additional elements such as solder or other metal micro-particles, as well as a conducting polymer and organic. The particles of the paste composition sinter and, depending on what additional elements are added, melt as a result of lamination to thereby form effective contiguous circuit paths through the paste. A method of making such a substrate is also provided, as is an electrical assembly utilizing the substrate and including an electronic component such as a semiconductor chip coupled thereto.
摘要翻译：一种电路化基板，包括用于提供电连接的导电浆料。在一个实施方案中，糊状物包括包含纳米颗粒的金属组分，并且可以包括附加元素，例如焊料或其它金属微粒，以及导电聚合物和有机物。糊料组合物的颗粒烧结并且根据添加的另外的元素而熔化，因为层压，从而形成通过糊料的有效连续的电路。还提供了制造这种基板的方法，以及利用该基板并且包括诸如与其耦合的半导体芯片的电子部件的电组件。

70. 发明申请

US20120012379A1 Printed circuit board 审中-公开
标题翻译：印刷电路板
公开(公告)号：US20120012379A1
公开(公告)日：2012-01-19
申请号：US13200355
申请日：2011-09-23
申请人： Ho-Sik Park , Keung-Jin Sohn , Joon-Sik Shin , Sang-Youp Lee , Joung-Gul Ryu , Jung-Hwan Park , Jee-Soo Mok
发明人： Ho-Sik Park , Keung-Jin Sohn , Joon-Sik Shin , Sang-Youp Lee , Joung-Gul Ryu , Jung-Hwan Park , Jee-Soo Mok
IPC分类号： H05K1/11
CPC分类号： H05K3/4069 , H05K3/20 , H05K3/281 , H05K3/4602 , H05K3/4647 , H05K3/4658 , H05K3/4682 , H05K2201/09481 , H05K2203/0156 , H05K2203/066 , H05K2203/1189 , Y10T29/49124
摘要： A printed circuit board including: an insulation layer; a first pattern buried in one surface of the insulation layer; a first resin layer laminated on one surface of the insulation layer to cover the first pattern; a second pattern buried in the other surface of the insulation layer; a via electrically connecting the first pattern with the second pattern; and a second resin layer laminated on the other surface of the insulation layer to cover the second pattern.
摘要翻译：一种印刷电路板，包括：绝缘层; 绝缘层的一个表面中的第一图案; 层叠在所述绝缘层的一个表面上以覆盖所述第一图案的第一树脂层; 掩埋在所述绝缘层的另一个表面中的第二图案; 通孔，电连接第一图案与第二图案; 以及层叠在所述绝缘层的另一表面上以覆盖所述第二图案的第二树脂层。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式