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    • 65. 发明授权
    • Semiconductor laser device
    • 半导体激光器件
    • US06826217B2
    • 2004-11-30
    • US10216319
    • 2002-08-12
    • Takashi Kimura
    • Takashi Kimura
    • H01S500
    • H01S5/2231H01S5/221H01S5/2218H01S5/2222H01S2301/18
    • A semiconductor laser device including a lower cladding layer stacked on a compound semiconductor substrate, an active layer stacked on the lower cladding layer, an upper first cladding layer stacked on the active layer, a ridge-shaped upper second cladding layer provided on the upper first cladding layer, current blocking layers provided on both sides of the upper second cladding layer, and a contact layer provided on the upper second cladding layer. The distance between the upper surface of the active layer and the upper surface of the upper second cladding layer is shorter than the distance between the lower surface of the lower cladding layer and the lower surface of the active layer.
    • 一种半导体激光器件,包括堆叠在化合物半导体衬底上的下包层,层叠在下包层上的有源层,堆叠在有源层上的上第一包覆层,设置在上第一上的脊形上第二覆层 包层,设置在上第二包层的两侧的电流阻挡层,以及设置在上第二包覆层上的接触层。 有源层的上表面与上第二包覆层的上表面之间的距离比下包层的下表面和活性层的下表面之间的距离短。
    • 66. 发明授权
    • Current blocking structure to improve semiconductor laser performance
    • 电流阻挡结构提高半导体激光器性能
    • US06813298B2
    • 2004-11-02
    • US10288707
    • 2002-11-06
    • Yuen Chuen ChanTeik Kooi OngYee Loy Lam
    • Yuen Chuen ChanTeik Kooi OngYee Loy Lam
    • H01S319
    • H01S5/227H01S5/06226H01S5/2222H01S5/2226H01S5/2277
    • The layer structure of a DC-PBH laser diode consists of an n-InP substrate (51), an n-InP buffer layer (52), an undoped-InGaAsP active layer (53), a p-Inp cladding layer (54), a p-InP current blocking layer (55), an n-InP current blocking layer (56), a p-InP cladding layer (57), and a p-InGaAsP contact layer (58). An additional layer of Fe-doped InP layer (55a) creates an acceptor level (Fe3+/Fe2+) near mid-band gap. The iron impurities are deep level traps, and will make the capacitance C2 less dependent of the impurity concentration of layer (56) which is normally doped with a concentration larger than 1×1018 cm−3 to lower the leakage current from p-InP blocking layer (57) to p-InP blocking layer (55) that does not contribute to light emission. The capacitance C2 and hence the overall capacitance Cp-n-p-n will be reduced with this Fe doped InP layer (55a) and consequently the displacement current through the current blocking structure during high speed operation will be lowered. In addition, as this Fe-doped InP layer is also a thermally stable semi-insulating material, a high resistivity layer is thus formed between the n-InP blocking layer (56) and P-InP blocking layer (55). Thus, this Fe doped InP layer (55a) will also effectively reduce the leakage current flowing through the p-n-p-n current blocking channel as mentioned above.
    • DC-PBH激光二极管的层结构由n-InP衬底(51),n-InP缓冲层(52),未掺杂的InGaAsP有源层(53),p-Inp覆层(54) ,p-InP电流阻挡层(55),n-InP电流阻挡层(56),p-InP包覆层(57)和p-InGaAsP接触层(58)。 附加的Fe掺杂的InP层(55a)在中间带隙附近产生受主能级(Fe 3+ / Fe 2+)。 铁杂质是深层陷阱,并且将使得电容C2较小地依赖于通常掺杂浓度大于1×10 18 cm -3的层(56)的杂质浓度以降低来自p的漏电流 -InP阻挡层(57)到不对发光有贡献的p-InP阻挡层(55)。 由于Fe掺杂InP层(55a),电容C2和整体电容Cp-n-p-n将被降低,因此在高速运行期间通过电流阻挡结构的位移电流将降低。 此外,由于该Fe掺杂InP层也是热稳定的半绝缘材料,因此在n-InP阻挡层(56)和P-InP阻挡层(55)之间形成高电阻率层。 因此,如上所述,该Fe掺杂InP层(55a)还将有效地减少流过p-n-p-n电流阻塞通道的漏电流。