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    • 61. 发明申请
    • Manufacturing aware design and design aware manufacturing
    • 制造意识设计和设计意识制造
    • US20060265682A1
    • 2006-11-23
    • US11214472
    • 2005-08-28
    • Akira Fujimura
    • Akira Fujimura
    • G06F17/50G06F19/00
    • G03F7/70125
    • Some embodiments of the invention provide a process for designing and manufacturing an integrated circuit (“IC”). The process selects a wiring configuration and an illumination configuration. The process uses the selected wiring configuration to design an IC layout. The process then uses the selected illumination configuration to manufacture the IC based on the designed IC layout. Some embodiments concurrently select an optimal pair of wiring and illumination configurations. Other embodiments select an illumination configuration based on the selected wiring configuration. Yet other embodiments select a wiring configuration based on the selected illumination configuration. In some embodiments, selecting the illumination configuration entails selecting at least one stepper lens for the IC layout, where the stepper lens illuminates at least one mask for at least one particular layer of the IC layout. In some embodiments, this selection entails selecting a stepper lens for each particular layer of the IC layout. Also, in some embodiments, selecting the wiring configuration entails defining the width and/or spacing of the routes along different directions on at least one particular wiring layer of the IC layout. In some embodiments, this selection entails selecting width and/or spacing of routes along different directions on each particular layer of the IC layout.
    • 本发明的一些实施例提供了一种用于设计和制造集成电路(“IC”)的方法。 该过程选择接线配置和照明配置。 该过程使用选定的接线配置来设计IC布局。 然后,该过程使用所选择的照明配置来基于设计的IC布局来制造IC。 一些实施例同时选择一对最佳布线和照明配置。 其他实施例基于所选择的布线配置来选择照明配置。 其他实施例基于所选择的照明配置来选择布线配置。 在一些实施例中,选择照明配置需要为IC布局选择至少一个步进透镜,其中步进透镜照亮IC布局的至少一个特定层的至少一个掩模。 在一些实施例中,该选择需要为IC布局的每个特定层选择步进透镜。 此外,在一些实施例中,选择布线配置需要在IC布局的至少一个特定布线层上限定沿着不同方向的路线的宽度和/或间隔。 在一些实施例中,该选择需要选择在IC布局的每个特定层上沿不同方向的路线的宽度和/或间隔。
    • 63. 发明申请
    • Exposure method and apparatus
    • 曝光方法和装置
    • US20060197934A1
    • 2006-09-07
    • US11363038
    • 2006-02-28
    • Kenji Yamazoe
    • Kenji Yamazoe
    • G03B27/72
    • G03F7/70125G03F1/00G03F7/70566
    • An exposure method for exposing a dense contact hole pattern onto a plate via a projection optical system includes the step of illuminating one of a binary mask and an attenuated phase shifting mask which one has the dense contact hole pattern by utilizing light from a light source and an illumination optical system, wherein the illuminating step uses an off-axis illumination that is polarized in a tangential direction when a value that is directed to half of a interval between centers of two adjacent contact holes in the dense contact hole pattern and is normalized by λ/NA is 0.25×√2 or smaller, where λ is a wavelength of the light, and NA is a numerical aperture of the projection optical system at an image side.
    • 通过投影光学系统将致密接触孔图案暴露在板上的曝光方法包括通过利用来自光源的光来照亮具有致密接触孔图案的二值掩模和衰减相移掩模之一的步骤,以及 照明光学系统,其中当针对致密接触孔图案中的两个相邻接触孔的中心之间的间隔的一半的值并且通过如下方式进行归一化时,照明步骤使用在切线方向上极化的离轴照明 λ/ NA为0.25×2或更小,其中λ是光的波长,NA是投影光学系统在像侧的数值孔径。