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61. 发明申请

US20020062926A1 Resin composition with excellent dielectric property 审中-公开
标题翻译：具有优良介电性能的树脂组合物
公开(公告)号：US20020062926A1
公开(公告)日：2002-05-30
申请号：US09859032
申请日：2001-05-16
申请人： Industrial Technology Research Institute
发明人： Hsien-Yin Tsai , Joung-Yei Chen , Hsi-Hsin Shih , Chi-Lan Li , Wei-Han Liao
IPC分类号： B32B031/20
CPC分类号： H05K1/0353 , B32B15/14 , C08F8/00 , C08F8/18 , C08F283/06 , C08G59/38 , C08J7/047 , C08L63/00 , C08L2666/04 , C08F8/08 , C08F232/08
摘要： A resin composition with a low dielectric constant comprises: (a) a functionalized cyclic olefin copolymer; (b) a mixture of epoxy resins; and (c) a curing agent. A laminate and a resin coated clad made of the resin composition exhibit reduced dielectric constants of 3.3 and 2.9 at 1 GHz, respectively.
摘要翻译：具有低介电常数的树脂组合物包括：（a）官能化环烯烃共聚物; （b）环氧树脂的混合物; 和（c）固化剂。由树脂组合物制成的层压材料和树脂涂覆的包层分别在1GHz下显示3.3和2.9的介电常数降低。

62. 发明授权

US06323264B1 Corrosion barrier coating composition 有权
标题翻译：防腐涂料组合物
公开(公告)号：US06323264B1
公开(公告)日：2001-11-27
申请号：US09434192
申请日：1999-11-04
申请人： Nikolay Nazaryan , Stanley S. Orkin , Glen Greenberg
发明人： Nikolay Nazaryan , Stanley S. Orkin , Glen Greenberg
IPC分类号： C08K310
CPC分类号： C08K3/24 , C08G59/38 , C08K3/40 , C09D163/00 , C08L63/00 , C08L2666/04
摘要： The present invention is directed to a corrosion barrier coating composition, comprising an admixture of: (1) about 60 to about 95 wt % of a one-component epoxy resin composition comprising (a) about 10-30% by weight of 4-glycidyloxy, n,n-diglycidyl aniline; (b) about 30-60% by weight of an epoxy resin, wherein the epoxy resin is epichlorohydrin ether of bisphenol A; and (c) about 3-7% by weight of strontium chromate; (2) about 1 to about 30 wt % of polytetrafluoroethylene; and (3) about 1 to about 20 wt % of glass powder, all weight percents being based on the total weight of the composition. The present invention is also directed to a substrate coated with the above corrosion barrier coating composition, and a method of coating a substrate with the above composition.
摘要翻译：本发明涉及一种防腐涂料组合物，其包含以下混合物：（1）约60至约95重量％的单组分环氧树脂组合物，其包含（a）约10-30重量％的4-缩水甘油氧基，n，n-二缩水甘油基苯胺; （b）约30-60重量％的环氧树脂，其中环氧树脂是双酚A的表氯醇醚; 和（c）约3-7重量％的铬酸锶; （2）约1至约30重量％的聚四氟乙烯; 和（3）约1至约20重量％的玻璃粉末，所有重量百分比均基于组合物的总重量。本发明还涉及涂覆有上述防腐涂料组合物的基材以及用上述组合物涂布基材的方法。

63. 发明申请

US20010035111A1 Curable two-component mortar composition and its use 有权
标题翻译：可固化的双组分砂浆组成及其用途
公开(公告)号：US20010035111A1
公开(公告)日：2001-11-01
申请号：US09765143
申请日：2001-01-18
发明人： Roland Gienau , Sascha Dierker , Mechthild Krauter
IPC分类号： C04B007/32 , C04B007/02 , C04B024/00
CPC分类号： C04B40/065 , C04B26/14 , C08G59/38 , C08G59/50 , C08L63/00 , C04B7/00
摘要： A curable, two-component mortar composition is described, which is based on a curable epoxide resin, at least one reactive diluent for the epoxide resin, an amine curing agent and one or more inorganic fillers, as well as, optionally, curing catalysts, rheological aids, thixotropizing agents, stabilizers, dispersants, agents to control the reaction rate and wetting agents, the amine curing agent of the curable epoxide resin and the reactive diluent being kept separate from one another to inhibit any reaction, wherein the mortar composition contains a cross-linking reactive diluent, which has functional epoxy groups with an epoxy functionality of at least 2. The mortar composition is used to fasten anchoring means in boreholes.
摘要翻译：描述了可固化的双组分砂浆组合物，其基于可固化的环氧树脂，至少一种用于环氧树脂的反应性稀释剂，胺固化剂和一种或多种无机填料，以及任选的固化催化剂，流变助剂，触变剂，稳定剂，分散剂，控制反应速率和润湿剂的试剂，可固化环氧树脂的胺固化剂和反应性稀释剂彼此分离以抑制任何反应，其中砂浆组合物含有交联反应性稀释剂，其具有至少为2的环氧官能团的官能环氧基团。砂浆组合物用于将锚固装置固定在钻孔中。

64. 发明授权

US06255409B1 Epoxy resin composition and resin-encapsulated semiconductor device 失效
标题翻译：环氧树脂组合物和树脂封装的半导体器件
公开(公告)号：US06255409B1
公开(公告)日：2001-07-03
申请号：US09266736
申请日：1999-03-12
申请人： Yoshiki Matsuoka , Yasuhiro Hirano , Nobuyuki Nakajima
发明人： Yoshiki Matsuoka , Yasuhiro Hirano , Nobuyuki Nakajima
IPC分类号： C08G5914
CPC分类号： H01L23/293 , C08G59/3218 , C08G59/38 , C08G59/621 , C08L63/00 , H01L2924/0002 , C08L61/04 , H01L2924/00
摘要： An epoxy resin composition comprising (A) a bifunctional crystalline epoxy compound, (B) an amorphous trisphenolmethane type epoxy compound having three or more of epoxy groups in a molecule, and (C) an epoxy curing agent having phenolic hydroxyl groups. The resin composition has an excellent moldability (low viscosity and can be filled with filler with high density) and high softening point, and is used preferably as an encapsulating material for electronic device.
摘要翻译：一种环氧树脂组合物，其包含（A）双官能结晶环氧化合物，（B）分子中具有三个或更多个环氧基的无定形三酚甲烷型环氧化合物，和（C）具有酚羟基的环氧固化剂。该树脂组合物具有优异的成型性（低粘度，可填充高密度填料）和高软化点，优选用作电子器件的封装材料。

65. 发明授权

US06210862B1 Composition for photoimaging 有权
标题翻译：光成像用组合物
公开(公告)号：US06210862B1
公开(公告)日：2001-04-03
申请号：US09150824
申请日：1998-09-10
申请人： Richard Allen Day , David John Russell , Donald Herman Glatzel
发明人： Richard Allen Day , David John Russell , Donald Herman Glatzel
IPC分类号： G03F7004
CPC分类号： C08G59/38 , C08G59/687 , G03F7/038 , G03F7/0385 , H05K3/287 , Y10S428/901
摘要： According to the present invention, an improved photoimagable cationically polymerizable epoxy based solder mask is provided that contains a non-brominated epoxy resin system and from about 0.1 to about 15 parts, by weight per 100 parts of resin system, of a cationic photoinitiator. The non-brominated epoxy-resin system has solids that are comprised of from about 10% to about 80% by weight, of a polyol resin having epoxy functionality; from about 0% to about 90% by weight of a polyepoxy resin; and from about 25% to about 85% by weight of an difunctional epoxy resin. Since the photosensitive cationically polymerizable epoxy based solder mask does not contain bromine, it is particularly advantageous halogens in waste processing chemicals or in incinerated scrap circuit boards are regulated by environmental concerns. The photosensitive cationically polymerizable non-brominated epoxy based solder mask has a glass transition temperature greater than about 100° C., preferably greater than about 110° C. The solder mask dries to a tack-free film; thus, artwork used in the photoimaging process will not stick to the dried soldermask film. The polyol resin which is a condensation product of epichlorohydrin and bisphenol A, has a weight average molecular weight of between about 40,000 and 130,000. The polyepoxy resin is an epoxidized multi-functional bisphenol A formaldehyde novolak resin having a weight average molecular weight of 4,000 to 10,000. The epoxidized diglycidyl ether of bisphenol A has two epoxide groups per molecule, a melting point of between about 80° C. and about 110° C. and a weight average molecular weight of between about 600 and 2,500. The invention also relates to a cationically polymerized solder mask.
摘要翻译：根据本发明，提供了一种改进的可光成像的可阳离子聚合的环氧基焊接掩模，其包含非溴化环氧树脂体系和每100份树脂体系约0.1至约15重量份的阳离子光引发剂。非溴化环氧树脂体系具有由约10重量％至约80重量％的具有环氧官能团的多元醇树脂组成的固体; 约0重量％至约90重量％的聚环氧树脂; 和约25重量％至约85重量％的双官能环氧树脂。由于光敏阳离子聚合型环氧基焊接掩模不含溴，所以特别有利的是废物处理化学品中的卤素或焚烧废料电路板中的卤素受到环境问题的限制。光敏阳离子聚合的非溴化环氧基焊料掩模具有大于约100℃，优选大于约110℃的玻璃化转变温度。焊料掩模干燥成无粘性膜; 因此，在光成像过程中使用的艺术品不会粘附在干燥的焊接膜上。作为表氯醇和双酚A的缩合物的多元醇树脂的重均分子量为约40,000〜130,000。聚环氧树脂是重均分子量为4000〜10000的环氧化多官能双酚A甲醛酚醛清漆树脂。双酚A的环氧化二缩水甘油醚每分子具有两个环氧基团，熔点在约80℃至约110℃之间，重均分子量约为600-2,500。本发明还涉及阳离子聚合的焊接掩模。

66. 发明授权

US06194490B1 Curable composition comprising epoxidized natural oils 有权
标题翻译：包含环氧化天然油的可固化组合物
公开(公告)号：US06194490B1
公开(公告)日：2001-02-27
申请号：US09253162
申请日：1999-02-19
申请人： Martin Roth , Qian Tang , Roger Malherbe , Catherine Schoenenberger
发明人： Martin Roth , Qian Tang , Roger Malherbe , Catherine Schoenenberger
IPC分类号： C08K336
CPC分类号： C08L63/00 , C08G59/38 , C08G59/42 , C08G59/686
摘要： A composition, which comprises (a) a compound containing at least one epoxy group in inner position per molecule, obtained by epoxidation of a natural unsaturated oil or of its derivative; (b) an epoxy compound selected from the group consisting of glycidyl ethers, glycidyl esters and cycloaliphatic epoxides; (c) a polycarboxylic acid anhydride; (d) a compound of formula I, I, III or IV or an acid adduct of a compound of formula I, II, III or IV wherein R1 to R4 are each independently of one another hydrogen; C1-C18alkyl which is unsubstituted or substituted by one or more than one hydroxyl group amino group, halogen atom, cyano group, C1-C6alkoxy group or C1-C6cyanalkoxy group; C5-C14aryl, C6-C24aralkyl, C3-C14heteroaryl or C4-C14heteroaralkyl which are unsubstituted or substituted by one or more than one C1-C6alkyl group, C1-C6alkoxy group or halogen atom, n is an integer from 1 to 3, and R5 and R6 are each independently of the other C1-C6alkyl or, together with the nitrogen atom, form a five- or six-membered ring, and (e) 20-90% by weight, based on the entire composition, of a filler, the average diameter of the filler particles being from 0.1 &mgr;m to 5.0 mm, can be cured to products having a high Tg and are suitable in particular as encapsulating material for electrical and electronic components.
摘要翻译：一种组合物，其包含（a）通过天然不饱和油或其衍生物的环氧化获得的每分子含有至少一个内部位置的环氧基的化合物;（b）选自缩水甘油醚，缩水甘油酯和环脂族环氧化物;（c）多元羧酸酐;（d）式I，I，III或IV的化合物或式I，II，III或IV化合物的酸加合物，其中R 1至R 4各自独立于氢; 未被取代或被一个或多于一个羟基氨基，卤素原子，氰基，C 1 -C 6烷氧基或C 1 -C 6氰基烷氧基取代的C 1 -C 18烷基; 未被取代或被一个或多于一个C 1 -C 6烷基，C 1 -C 6烷氧基或卤素原子取代的C 5 -C 14芳基，C 6 -C 24芳烷基，C 3 -C 14杂芳基或C 4 -C 14杂芳烷基，n为1至3的整数，R 5 和R 6各自独立地为其它C 1 -C 6烷基，或者与氮原子一起形成五元或六元环，和（e）基于整个组合物的20-90重量％的填料，填料颗粒的平均直径为0.1μm至5.0mm，可以固化成具有高Tg的产品，并且特别适合用作电气和电子部件的包封材料。

67. 发明授权

US6117953A Liquid epoxy resin composition for ball grid array package 有权
标题翻译：液体环氧树脂组合物球形阵列包装
公开(公告)号：US6117953A
公开(公告)日：2000-09-12
申请号：US234482
申请日：1999-01-21
申请人： Nobuhiro Ichiroku , Toshio Shiobara
发明人： Nobuhiro Ichiroku , Toshio Shiobara
IPC分类号： C08G59/38 , C08L63/00 , H01L23/29 , C08G59/16 , C08L63/02
CPC分类号： C08G59/38 , C08L63/00 , H01L23/293 , H01L2924/0002
摘要： A liquid epoxy resin composition comprising (A) an epoxy resin component which includes specific amounts of three specific epoxy resins, (B) a curing agent, (C) a curing accelerator, and (D) an inorganic filler has a low viscosity, high cure rate, ease of processing, reliability, and shelf stability. The composition can be used as a semiconductor device encapsulant to provide BGA packages having minimal warpage.
摘要翻译：一种液体环氧树脂组合物，其包含（A）包含特定量的三种特定环氧树脂的环氧树脂组分，（B）固化剂，（C）固化促进剂和（D）无机填料的环氧树脂组合物具有低粘度，高固化速度，易加工性，可靠性和储存稳定性。该组合物可用作半导体器件密封剂以提供具有最小翘曲的BGA封装。

68. 发明授权

US6048956A Diglycidyl ethers 失效
标题翻译：二缩水甘油醚
公开(公告)号：US6048956A
公开(公告)日：2000-04-11
申请号：US180148
申请日：1998-11-03
申请人： Kenji Muto , Toshikazu Murayama , Nobuko Tsuzaki
发明人： Kenji Muto , Toshikazu Murayama , Nobuko Tsuzaki
IPC分类号： C07D303/24 , C07D303/27 , C08G59/22 , C08G59/38 , C08G59/68 , C08G65/10
CPC分类号： C08G59/38 , C07D303/24 , C08G59/22 , C08G59/226
摘要： The present invention relates to a diglycidyl ether represented by the following general formula (I): ##STR1## (wherein, R.sup.1 and R.sup.2 are the same or different, and represent lower alkyl having 1.about.6 carbon atoms), a composition including the glycidyl ether and epoxy resin, and epoxy resin cured product obtained by the composition. The glycidyl ether can be used as a reactive diluent for epoxy resins.
摘要翻译： PCT No.PCT / JP98 / 00861 Sec。 371日期：1998年11月3日 102（e）日期1998年11月3日PCT 1998年3月3日PCT PCT。第WO98 / 39314号公报日本9月11日本发明涉及由以下通式（I）表示的二缩水甘油醚：（其中，R 1和R 2相同或不同，表示具有1个6碳原子的低级烷基），包括缩水甘油醚和环氧树脂，以及通过该组合物获得的环氧树脂固化产物。缩水甘油醚可用作环氧树脂的反应性稀释剂。

69. 发明授权

US5916683A Copper-clad laminate with prepreg of epoxy resin and aryl ester 失效
标题翻译：覆铜层压板与环氧树脂预浸料和芳基酯
公开(公告)号：US5916683A
公开(公告)日：1999-06-29
申请号：US964417
申请日：1997-11-04
申请人： Youichi Ueda , Yasuhiro Endo , Mitsuhiro Shibata , Kaori Yamasaki
发明人： Youichi Ueda , Yasuhiro Endo , Mitsuhiro Shibata , Kaori Yamasaki
IPC分类号： C07C69/017 , C07D311/60 , C08G59/06 , C08G59/22 , C08G59/38 , C08G59/42 , H01L23/498 , H01P1/04 , H01P1/383 , H01P3/16 , H05K1/03 , B32B15/08 , B32B27/04 , C08G59/62
CPC分类号： H01P1/04 , C07C69/017 , C07D311/60 , C08G59/066 , C08G59/226 , C08G59/38 , C08G59/4223 , C08G59/4238 , H01L23/49894 , H01P1/383 , H01P3/16 , H01L2924/0002 , H01L2924/3011 , H05K1/0326 , Y10T428/31522 , Y10T428/31529 , Y10T442/3415
摘要： A copper clad laminate is disclosed as being obtained by thermoforming a prepreg and a copper foil. As disclosed, the pre-preg (uncured) includes a substrate impregnated with an epoxy resin, an aryl ester compound and a curing agent. The copper-clad laminate has a low dielectric constant and a low dielectric loss tangent. It is suitable for a multilayer printed wiring board for high speed operation, especially at high-frequency region.
摘要翻译：公开了通过热成型预浸料和铜箔获得的覆铜层压板。如所公开的，预浸料（未固化）包括浸渍有环氧树脂，芳基酯化合物和固化剂的基材。覆铜层压板具有低介电常数和低介电损耗角正切。适用于高速运行的多层印刷电路板，尤其适用于高频区域。

70. 发明授权

US5741575A Adhesive for printed circuit board 失效
标题翻译：印刷电路板用粘合剂
公开(公告)号：US5741575A
公开(公告)日：1998-04-21
申请号：US755804
申请日：1996-12-17
申请人： Motoo Asai , Chie Onishi
发明人： Motoo Asai , Chie Onishi
IPC分类号： C08G59/18 , C08G59/38 , C08L63/00 , C09J7/00 , C09J163/00 , H01B3/40 , H05K3/00 , H05K3/18 , H05K3/38 , H05K3/42 , H05K3/46 , B32B9/00
CPC分类号： H05K3/4661 , C08G59/18 , C08G59/38 , C08L63/00 , C09J163/00 , C09J7/00 , H01B3/40 , H05K3/387 , H05K2201/0154 , H05K2201/0212 , H05K2203/0143 , H05K2203/066 , H05K2203/0773 , H05K2203/0789 , H05K2203/0796 , H05K3/0035 , H05K3/181 , H05K3/184 , H05K3/426 , H05K3/4644 , Y10S428/901 , Y10S525/934 , Y10S525/935 , Y10T428/24843 , Y10T428/24893 , Y10T428/24917 , Y10T428/24926 , Y10T442/674
摘要： There are disclosed an adhesive obtained by dispersing a cured amino resin fine powder soluble in acid or oxidizing agent into an uncured heat-resistant resin matrix hardly soluble in acid or oxidizing agent when being subjected to a curing treatment as well as a printed circuit board using this adhesive and a method of producing the same. The adhesive has excellent properties such as resistance to chemicals, heat resistance, electric properties, hardness and adhesion property owing to the use of the amino resin fine powder. Therefore, the printed circuit board using such an adhesive is not influenced by service circumstance and is high in the connection reliability without forming short circuit between patterns. Furthermore, in the method of producing the printed circuit board, the adhesive is provided in form of a sheet or a prepreg, whereby the printed circuit board can be produced easily and cheaply.
摘要翻译：公开了一种粘合剂，其通过将可溶于酸或氧化剂的固化的氨基树脂细粉末分散在难溶于酸或氧化剂的未固化的耐热树脂基质中，以及使用该粘合剂及其制造方法。粘合剂由于使用氨基树脂细粉而具有优异的性能，如耐化学性，耐热性，电性能，硬度和粘合性。因此，使用这种粘合剂的印刷电路板不受服务环境的影响，连接可靠性高，不会形成图案之间的短路。此外，在制造印刷电路板的方法中，粘合剂以片材或预浸料的形式提供，由此可以容易且廉价地制造印刷电路板。

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