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61. 发明申请

US20060231244A1 Tube blank correcting member for use in temporarily assembling heat exchanger, and apparatus for and method of temporaily assembling heat exchanger 审中-公开
标题翻译：用于临时组装热交换器的管坯修正构件，以及临时组装热交换器的装置和方法
公开(公告)号：US20060231244A1
公开(公告)日：2006-10-19
申请号：US10549286
申请日：2004-03-18
申请人： Akira Sekine , Takashi Tamura
发明人： Akira Sekine , Takashi Tamura
IPC分类号： F28F9/02
CPC分类号： B23K3/087 , B23K2101/14 , B23P15/26 , F28D1/0391 , F28F9/0243 , F28F9/182 , Y10T29/4935 , Y10T29/49359 , Y10T29/49378 , Y10T29/53113 , Y10T29/53117
摘要： A temporarily assembling apparatus comprises a support member 2 for supporting thereon heat exchange tube blanks P having their lengthwise direction positioned laterally, with their widthwise direction positioned vertically, and arranged from front rearward in parallel with opposite left and right ends thereof aligned respectively, and the fins F arranged between the respective pairs of adjacent tube blanks. Two header supports 3 are arranged respectively at the left and right sides of the support member 2 and movable leftward or rightward. A pair of left and right tube blank correcting members 19 are each in the form of a plate extending from the front rearward and having a plurality of blank fitting slits 23 formed in a side edge thereof and arranged from the front rearward at the same spacing as the heat exchange tubes to be produced of the heat exchanger. Each of the blank correcting members is movable between a correcting position wherein the corresponding ends of all the tube blanks P as supported on the support member 2 are fitted into the respective slits 23 and a noncorrecting position wherein the tube blanks P are not fitted into the slits 23. In temporarily assembling components, the opposie ends of the heat exchange blanks P can be reliably placed into insertion holes of respective headers.
摘要翻译：临时装配装置包括支撑构件2，用于在其上支撑其纵向方向位于其上的热交换管坯料P，其宽度方向垂直定位，并且分别从相对的左右端平行排列，从前向后排列，翅片F布置在各对相邻管坯之间。分别在支撑构件2的左侧和右侧分别设置两个头部支撑件3，并且可向左或向右移动。一对左右管坯校正部件19分别为从前后方向延伸的板状，并且具有形成在其侧边缘的多个坯料嵌合狭缝23，其前后方向以与由热交换器生产的热交换管。每个空白校正构件可在校正位置之间移动，其中支撑在支撑构件2上的所有管坯P的相应端部嵌入各个狭缝23中，并且未校正位置，其中管坯P未装配到狭缝23。在临时组装部件时，热交换坯料P的对置端可以可靠地放置在各个集管的插入孔中。

62. 发明申请

US20050150936A1 Bumping electronic components using transfer substrates 有权
标题翻译：使用转移底物冲击电子部件
公开(公告)号：US20050150936A1
公开(公告)日：2005-07-14
申请号：US10989107
申请日：2004-11-15
申请人： John Mackay
发明人： John Mackay
IPC分类号： B23K1/00 , B23K3/06 , B23K3/08 , B23K35/02 , B23K35/22 , H01L21/48 , H01L21/60 , H05K3/34 , H01L21/44 , B23K31/00 , B23K31/02
CPC分类号： H01L23/488 , B23K1/0016 , B23K3/0623 , B23K3/0638 , B23K3/087 , B23K35/0222 , B23K35/0244 , B23K35/224 , B23K2101/40 , B23K2101/42 , H01L21/4853 , H01L24/11 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/11334 , H01L2224/13099 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01074 , H01L2924/01075 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H05K3/3478 , H05K3/3484 , H05K2201/10477 , H05K2203/0113 , H05K2203/0278 , H05K2203/0338 , H05K2203/043 , H05K2203/0557 , H05K2203/085 , H05K2203/1581 , Y10S438/977 , H01L2924/00 , H01L2224/05599
摘要： A method for forming solder bumps on an electronic component. Providing a transfer substrate having a plurality of solder balls, disposing the transfer substrate on the surface of the electronic component, heating to reflow the solder balls onto the electronic component; and removing the sacrificial substrate. The transfer substrate may comprise a sacrificial film and a metal layer patterned with a mask which is used to form solder balls on the transfer substrate. Or, the transfer substrate may comprise a sheet of silicone rubber having solder balls embedded at least partially in the sheet. A method of aligning a part being bumped with a transfer substrate, using a shuttle mechanism and an alignment film is disclosed.
摘要翻译：一种在电子部件上形成焊料凸点的方法。提供具有多个焊球的转印衬底，将转印衬底设置在电子部件的表面上，加热以将焊球回流到电子部件上; 并去除牺牲衬底。转移衬底可以包括牺牲膜和用掩模图案化的金属层，该掩模用于在转移衬底上形成焊球。或者，转印衬底可以包括具有至少部分地嵌入片材中的焊球的硅橡胶片。公开了一种使用梭机构和取向膜将被凸起部分与转印衬底对准的方法。

63. 发明申请

US20050034302A1 Component connecting apparatus and method and component mounting apparatus 失效
标题翻译：部件连接装置及方法及部件安装装置
公开(公告)号：US20050034302A1
公开(公告)日：2005-02-17
申请号：US10891524
申请日：2004-07-15
申请人： Naoto Hosotani , Kazuki Fukada , Keiichi Iwata , Daido Komyoji
发明人： Naoto Hosotani , Kazuki Fukada , Keiichi Iwata , Daido Komyoji
IPC分类号： B23K3/08 , H05K3/34 , H05K3/30
CPC分类号： B23K3/087 , B23K2101/40 , H01L24/75 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/12042 , H05K3/3494 , H05K2201/10727 , H05K2203/0195 , H05K2203/1121 , H05K2203/1581 , H05K2203/304 , Y10T29/4913 , Y10T29/49144 , Y10T29/53178 , Y10T29/53191 , Y10T29/53261 , H01L2924/00014 , H01L2924/00
摘要： When a component that has a connection portion to be connected to the electrode of a board and a weak heat-resistant portion of a lower heat-resisting property than the fusing point of a connection material for connecting the electrode of the board with the connection portion is connected to the board with interposition of the connection material between the electrode of the board and the connection portion, a cooling member is brought in contact with the weak heat-resistant portion or its neighborhood while heating the connection material by heating the board brought in contact with a placement member, and the quantity of heat conducted to the weak heat-resistant portion via the board is reduced by being conducted to the cooling member, carrying out the fusing of the connection material while preventing the occurrence of thermal damage to the weak heat-resistant portion.
摘要翻译：当具有要连接到板的电极的连接部分和具有比用于将板的电极连接到连接部分的连接材料的熔点低的耐热性能的弱耐热部分的部件通过在板的电极和连接部之间插入连接材料而连接到板，通过加热连接材料来加热连接材料，冷却部件与弱的耐热部分或其邻近部分接触与放置构件接触，并且经由基板传导到弱耐热部的热量通过被传导到冷却构件而被减少，进行连接材料的熔合同时防止对弱的热损伤的发生耐热部分。

64. 发明申请

US20040211818A1 Jig and method for connecting connection members using the same 审中-公开
标题翻译：用于连接使用其的连接构件的夹具和方法
公开(公告)号：US20040211818A1
公开(公告)日：2004-10-28
申请号：US10712470
申请日：2003-11-13
发明人： Tomonari Ohtsuki , Yasue Yamazaki
IPC分类号： B23K037/04
CPC分类号： B23K3/087
摘要： A jig to be in contact with solder in reflow soldering is coated with diamond-like-carbon on at least a portion which is to be in contact with the solder. In this manner the solder is prevented from adhering to the jig. The diamond-like-carbon coating is preferably provided on the whole surface of the jig facing to the molten solder. In a method for connecting connection members using a jig which can be in contact with solder in reflow soldering, the jig is coated with the diamond-like-carbon on its surface which is likely to contact the solder.
摘要翻译：在回流焊接中与焊料接触的夹具在与焊料接触的至少一部分上涂覆有类金刚石碳。以这种方式，防止焊料粘附到夹具上。金刚石碳涂层优选设置在面向熔融焊料的夹具的整个表面上。在通过回流焊接可以与焊料接触的夹具连接连接构件的方法中，夹具在其可能与焊料接触的表面上涂覆有类金刚石碳。

65. 发明申请

US20030226253A1 Method and apparatus for thermally coupling a heat dissipation device to a microelectronic device 失效
公开(公告)号：US20030226253A1
公开(公告)日：2003-12-11
申请号：US10165395
申请日：2002-06-07
发明人： Steve M. Mayer
IPC分类号： H05K003/30 , B23K037/00 , B23P019/00
CPC分类号： B23K1/0016 , B23K3/087 , B23K20/023 , B23K37/0408 , B23K37/0443 , B23K2101/36 , B23K2101/40 , H01L23/42 , H01L2924/0002 , Y10T29/4913 , Y10T29/49144 , Y10T29/5313 , Y10T29/53174 , Y10T29/53178 , Y10T29/53191 , H01L2924/00
摘要： Apparatus and methods are provided for thermally coupling a heat dissipation device to a microelectronic device. A reflowable thermal interface material is applied between the back side of a microelectronic die and a heat dissipation device. Heat and pressure is conducted through the heat dissipation device to the interface material and producing thereby liquefaction followed by solidification of the interface material, the solidification occurring progressively from the center to the peripheral edge. A thermal compression bonding apparatus is provided comprising a bonding head adapted to apply heat and pressure to the heat dissipation device whereby providing the desired thermal profile to effect solidification of the interface material from the center outward.

66. 发明授权

US06609652B2 Ball bumping substrates, particuarly wafers 有权
公开(公告)号：US06609652B2
公开(公告)日：2003-08-26
申请号：US09962007
申请日：2001-09-24
申请人： John MacKay , Tom Molinaro
发明人： John MacKay , Tom Molinaro
IPC分类号： B23K3706
CPC分类号： B23K35/0222 , B23K1/0016 , B23K3/0623 , B23K3/0638 , B23K3/087 , B23K35/0244 , B23K35/224 , B23K2101/40 , B23K2101/42 , H01L21/4853 , H01L24/11 , H01L2224/05573 , H01L2224/11003 , H01L2224/13099 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01074 , H01L2924/01075 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/351 , H05K3/3484 , H05K2201/10477 , H05K2203/0113 , H05K2203/0278 , H05K2203/0338 , H05K2203/043 , H05K2203/0557 , H05K2203/085 , H05K2203/1581 , H01L2924/00 , H01L2224/05599
摘要： A mask (stencil) having cells (openings) is disposed on a surface of a heater stage, and is then then filled (printed) with solder paste. Then a substrate is assembled to the opposite side of the mask. Then the solder paste is reflowed. This may be done partially inverted. Then the mask is separated from the substrate, either before or after cooling. Solder balls are thus formed on the substrate, which may be a semiconductor wafer. A method for printing the mask with solder paste is described.

67. 发明申请

US20030111517A1 Method and apparatus for local application of solder to preselected conductor areas on a printed circuit board 有权
标题翻译：将焊料局部应用于印刷电路板上的预选导体区域的方法和装置
公开(公告)号：US20030111517A1
公开(公告)日：2003-06-19
申请号：US10321581
申请日：2002-12-18
发明人： Akira Takaguchi , Masaki Wata , Chikara Numata
IPC分类号： B23K037/00 , B23K001/08 , B23K031/00 , B23K031/02 , B23K001/20
CPC分类号： H05K3/3468 , B23K1/085 , B23K1/203 , B23K3/0653 , B23K3/082 , B23K3/087 , H05K3/3489 , H05K2203/111
摘要： An apparatus for locally applying solder to a plurality of sets of preselected conductive areas on each printed circuit board to which component leads are joined. The apparatus includes a flux station with flux nozzles, a preheater station, and a wave solder station with solder nozzles, arranged in line to receive and process printed circuit boards. The flux nozzles and the solder nozzles are arranged in a pattern identical to that of the preselected conductive areas on each of the board. A conveyor system is arranged to simultaneously transporting the boards from one station to another. The conveyor system includes a frame, an arm carriage reciprocably moved along the frame, a plurality of pairs of pivot arms pivotably connected to the arm carriage and movable between an inoperative position where the pivot arms are disengaged from the boards and an operative position where the pivot arms are engaged with the boards, a pair of first rails connected to the frame and located above the flux station and the preheater station, and a pair of second rails connected to the frame and located above the wave solder station.
摘要翻译：一种用于将焊料局部施加到组件引线所连接的每个印刷电路板上的多组预选导电区域的设备。该设备包括具有磁通喷嘴的焊剂站，预热站和具有焊接喷嘴的波峰焊接站，排列成线以接收和处理印刷电路板。焊剂喷嘴和焊接喷嘴以与每个板上的预选导电区域相同的模式布置。输送机系统被布置成将板从一个站同时运输到另一个站。输送机系统包括框架，沿着框架往复运动的臂托架，多对枢转臂，可枢转地连接到臂托架上，并且可在枢转臂与板分离的非操作位置和可操作位置之间移动，枢转臂与板接合，连接到框架并位于焊剂站和预热器站上的一对第一轨道，以及连接到框架并位于波峰焊站上方的一对第二轨道。

68. 发明申请

US20030102297A1 System and method for mounting electronic components onto flexible substrates 有权
标题翻译：将电子部件安装到柔性基板上的系统和方法
公开(公告)号：US20030102297A1
公开(公告)日：2003-06-05
申请号：US10007485
申请日：2001-12-03
发明人： Lakhi N. Goenka , Peter Joseph Sinkunas
IPC分类号： F27B009/10 , B23K001/012
CPC分类号： B23K3/087 , B23K1/012 , H05K3/3494 , H05K2201/0305 , H05K2203/0165 , H05K2203/081 , H05K2203/111 , H05K2203/1121 , H05K2203/1581
摘要： A system and method for reflowing solder to interconnect a plurality of electronic components to a substrate is disclosed. The system includes an oven for preheating the substrate and the plurality of electronic components disposed thereon, a supplemental heat source disposed in the oven for providing additional heat energy to reflow the solder, and a pallet for supporting the substrate, wherein the supplemental heat source creates a stream of hot gas that flows transversely across the substrate.
摘要翻译：公开了一种用于回流焊料以将多个电子部件互连到基板的系统和方法。该系统包括用于预热基底和设置在其上的多个电子部件的烘箱，设置在烘箱中的辅助热源，用于提供额外的热能以回流焊料，以及用于支撑基底的托盘，其中补充热源产生流过基板的热气流。

69. 发明申请

US20030089761A1 Method and means for rapid heat-sink soldering 失效
标题翻译：快速散热焊接的方法和手段
公开(公告)号：US20030089761A1
公开(公告)日：2003-05-15
申请号：US10329654
申请日：2002-12-24
发明人： Larry J. Costa
IPC分类号： B23K037/00 , B23K005/22 , B23K031/02 , B23K035/12
CPC分类号： B23K3/085 , B23K3/087
摘要： A method and system for rapid heat-sink soldering, having a workpiece gripper, an intense heat source, and an optional air-jet cooling system, is provided for soldering workpieces to substrates of dissimilar material composition. The workpiece gripper selectively positions the workpiece closely adjacent the substrate and continually removes excess heat from the workpiece, both during and after the application of heat to the workpiece. Upon termination of the heat application, air-jet cooling can be provided to the workpiece to quickly cool the terminal and the molten layer of solderable material.
摘要翻译：提供了用于将工件焊接到异种材料组合物的基板上的用于快速散热焊接的方法和系统，其具有工件夹持器，强热源和可选的空气喷射冷却系统。工件夹具选择性地将工件紧邻基板定位，并且在向工件施加热量期间和之后连续地从工件移除多余的热量。在热应用终止时，可以向工件提供喷气冷却，以快速冷却可焊接材料的端子和熔融层。

70. 发明申请

US20030067080A1 Sockets for "springed" semiconductor devices 失效
公开(公告)号：US20030067080A1
公开(公告)日：2003-04-10
申请号：US10299131
申请日：2002-11-19
申请人： FormFactor, Inc.
发明人： Thomas H. Dozier II , Benjamin N. Eldridge , Gary W. Grube , Igor Y. Khandros , Gaetan L. Mathieu , David V. Pedersen , Michael A. Stadt
IPC分类号： H01L023/48
CPC分类号： G01R1/0408 , B23K3/087 , G01R1/0416 , G01R1/0466 , G01R31/2886 , H01L23/04 , H01L23/13 , H01L23/32 , H01L23/5385 , H01L24/72 , H01L2224/1134 , H01L2224/13099 , H01L2224/16 , H01L2224/16237 , H01L2224/73251 , H01L2224/8114 , H01L2224/81901 , H01L2924/00013 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01078 , H01L2924/01079 , H05K1/119 , H05K3/308 , H05K3/325 , H05K2201/0311 , H05K2201/09472 , H05K2201/09827 , Y10T29/49128 , Y10T29/4913 , Y10T29/49139 , Y10T29/4914 , Y10T29/49147 , Y10T29/49153 , Y10T29/49208 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , H01L2924/00014 , H01L2224/72
摘要： Temporary connections to spring contact elements extending from an electronic component such as a semiconductor device are made by urging the electronic component, consequently the ends of the spring contact elements, vertically against terminals of an interconnection substrate, or by horizontally urging terminals of an interconnection substrate against end portions of the spring contact elements. A variety of terminal configurations are disclosed.

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