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61. 发明申请

US20060157850A1 Semiconductor device and manufacturing method thereof 有权
公开(公告)号：US20060157850A1
公开(公告)日：2006-07-20
申请号：US11378650
申请日：2006-03-20
申请人： Shinji Yamaguchi , Takuro Asazu , Atsushi Ono
发明人： Shinji Yamaguchi , Takuro Asazu , Atsushi Ono
IPC分类号： H01L23/48
CPC分类号： H01L23/3107 , H01L23/3192 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor device of the present invention is furnished with (a) a first protection film, formed on a substrate, having an opening section on an electrode pad, (b) a protrusion electrode, connected on the electrode pad at the opening section, whose peripheral portion is formed to overlap the first protection film, (c) a second protection film, formed to cover at least a gap at a boundary portion of the first protection film and the protrusion electrode, having an opening on a top area of the protrusion electrode except a portion around the boundary portion of the first protection film and the protrusion electrode, and (d) a coating layer formed to cover a surface of the protrusion electrode at the opening of the second protection film. With this arrangement, it is possible to provide a semiconductor device wherein the protrusion electrode is formed with an electroless plating method, capable of preventing the lowering of the adhesion strength of the protrusion electrode to the electrode pad.

62. 发明申请

US20060028041A1 Laminated-type multi-joint portion drive mechanism and manufacturing method therefor, grasping hand and robot arm provided with the same 有权
标题翻译：层叠型多关节部驱动机构及其制造方法，其握持装备有该手柄的机器人手臂
公开(公告)号：US20060028041A1
公开(公告)日：2006-02-09
申请号：US11199089
申请日：2005-08-09
申请人： Atsushi Ono , Kazuo Yokoyama
发明人： Atsushi Ono , Kazuo Yokoyama
IPC分类号： B25J15/12
CPC分类号： B25J9/142 , B25J15/0023 , B25J15/10 , B25J15/12
摘要： A laminated-type multi-joint portion drive mechanism includes a bone member having at least two elastic deformation portions, a laminated-type pneumatic tube member having at least two-line tubes which are stacked on the bone member and which are connected to a pneumatic drive source, and a planar-type joint-portion deformation member which is stacked on the laminated-type pneumatic tube member and which are placed at joint portions confronting the deformation portions, respectively, and which are connected to the tubes, in which when pneumatic pressure is applied to pneumatic operation chamber, the joint portion corresponding to the pneumatic operation chamber to which the pneumatic pressure is applied is deformable.
摘要翻译：层叠型多关节部驱动机构包括具有至少两个弹性变形部的骨构件，层叠型气动管构件，其具有堆叠在骨构件上的至少两根管，并且连接到气动驱动源和平面型接合部变形构件，其层叠在层叠型气动管构件上，并且分别设置在与变形部相对的接合部，并且连接到管，其中当气动对气动操作室施加压力，与施加气动压力的气动操作室对应的接合部可变形。

63. 发明授权

US06933607B2 Semiconductor device with bumps on electrode pads oriented in given direction 有权
标题翻译：具有在给定方向上取向的电极焊盘上的凸起的半导体器件
公开(公告)号：US06933607B2
公开(公告)日：2005-08-23
申请号：US10282054
申请日：2002-10-29
申请人： Atsushi Ono , Yasunori Chikawa , Makoto Kanda , Norimitsu Nie , Satoru Tone , Motoji Shiota , Akio Inohara , Hirokazu Yoshida
发明人： Atsushi Ono , Yasunori Chikawa , Makoto Kanda , Norimitsu Nie , Satoru Tone , Motoji Shiota , Akio Inohara , Hirokazu Yoshida
IPC分类号： H01L21/60 , H01L23/485 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L24/10 , H01L24/13 , H01L2224/05001 , H01L2224/05022 , H01L2224/05572 , H01L2224/13 , H01L2224/13099 , H01L2224/1411 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H01L2924/351 , H01L2924/00 , H01L2224/05541 , H01L2224/05005
摘要： A semiconductor device includes a semiconductor substrate, a plurality of electrode pads aligned on the semiconductor substrate, and a plurality of bump electrodes placed on each electrode pad, wherein the plurality of bump electrodes on the electrode pad are aligned in a direction orthogonal to a direction where the electrode pads are aligned. A manufacturing method of the semiconductor device includes the steps of patterning a photoresist which serves as a bump electrode forming use mask on the semiconductor substrate having formed thereon the electrode pads and forming a bump electrode in a perpendicular straight wall shape to be thinner than the photoresist by plating the bump electrode forming use metal to the electrode pad.
摘要翻译：半导体器件包括半导体衬底，在半导体衬底上排列的多个电极焊盘和放置在每个电极焊盘上的多个凸起电极，其中电极焊盘上的多个凸起电极在与方向正交的方向上排列其中电极焊盘对齐。半导体器件的制造方法包括以下步骤：在其上形成有电极焊盘的半导体衬底上形成用作形成用途掩模的凸块电极的光致抗蚀剂，并且形成具有比光致抗蚀剂更薄的垂直直壁形状的凸块电极通过将形成使用金属的凸块电极电镀到电极焊盘。

64. 发明授权

US06747351B2 Semiconductor device and method of manufacturing of the same 失效
标题翻译：半导体装置及其制造方法
公开(公告)号：US06747351B2
公开(公告)日：2004-06-08
申请号：US09971268
申请日：2001-10-05
申请人： Shinji Yamaguchi , Takuro Asazu , Atsushi Ono
发明人： Shinji Yamaguchi , Takuro Asazu , Atsushi Ono
IPC分类号： H01L2348
CPC分类号： H01L21/288 , H01L24/11 , H01L24/13 , H01L2224/13099 , H01L2224/83851 , H01L2924/0001 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/0103 , H01L2924/01033 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/09701 , H01L2924/15787 , H01L2924/00
摘要： A defect-free film is formed on a surface of a protrusive electrode. An immersion Au film is formed on the surface of the protrusive electrode, after a gap which an immersion Au plating liquid can enter evenly is formed between a protrusive electrode made of Ni or a Ni alloy on an electrode pad made of Al or mainly made of Al and a protective coat by etching.
摘要翻译：在突出电极的表面上形成无缺陷的膜。在由Al或Ni合金制成的突出电极之间，在由Al制成的电极焊盘或主要由Al制成的电极焊盘上形成浸渍Au电镀液体能够均匀进入的间隙之后的浸渍Au膜， Al和通过蚀刻的保护涂层。

65. 发明授权

US06694820B2 Pressure sensor 失效
标题翻译：压力传感器
公开(公告)号：US06694820B2
公开(公告)日：2004-02-24
申请号：US10174942
申请日：2002-06-20
申请人： Atsushi Ono
发明人： Atsushi Ono
IPC分类号： G01L900
CPC分类号： H01H13/785 , H01H13/50 , H01H2201/036 , H01H2215/004
摘要： In a pressure sensor, a first electrode is formed on a base plate. A insulating laminate material coats the first electrode. A conductive rubber is attached on a click rubber. The conductive rubber is brought into a pressure contact with the first electrode coated with the insulating laminate material.
摘要翻译：在压力传感器中，第一电极形成在基板上。绝缘层压材料涂覆第一电极。导电橡胶附着在点胶上。将导电橡胶与涂覆有绝缘层压材料的第一电极压力接触。

66. 发明授权

US06552288B2 Input device for game controller 失效
标题翻译：游戏控制器输入装置
公开(公告)号：US06552288B2
公开(公告)日：2003-04-22
申请号：US09796459
申请日：2001-03-02
申请人： Atsushi Ono
发明人： Atsushi Ono
IPC分类号： H03K17975
CPC分类号： H01H13/785 , H01H13/702 , H01H2201/02 , H01H2201/036 , H01H2215/004 , H01H2239/006
摘要： A first electrode and a second electrode are disposed on a base board. A resist is formed on the base board so as to cover the first electrode. A capacitance-operated silicon rubber sensor is provided on the base board so as to cover the resist and the second electrode. A click rubber is disposed above the silicon rubber sensor. A button deforms the click rubber so as to press down the silicon rubber sensor and the resist. The silicon rubber sensor and the resist generates an analog output signal between the first and second electrodes in proportion to a force pressing the button, when the pressing force is larger than a predetermined pressing force enough to deform the click rubber so as to establish the output signal.
摘要翻译：第一电极和第二电极设置在基板上。在基板上形成抗蚀剂以覆盖第一电极。在基板上设置电容操作的硅橡胶传感器，以覆盖抗蚀剂和第二电极。硅橡胶传感器上方设有点胶。按钮使点击橡胶变形，以压下硅橡胶传感器和抗蚀剂。硅橡胶传感器和抗蚀剂在按压力大于预定的按压力的情况下与按压按钮的力成比例地在第一和第二电极之间产生模拟输出信号，足以使咔嗒声橡胶变形，从而建立输出信号。

67. 发明授权

US06214449B1 Ink jet recording paper 失效
标题翻译：喷墨记录纸
公开(公告)号：US06214449B1
公开(公告)日：2001-04-10
申请号：US09280720
申请日：1999-03-30
申请人： Teiichi Otani , Atsushi Ono , Noboru Kondo
发明人： Teiichi Otani , Atsushi Ono , Noboru Kondo
IPC分类号： B32B500
CPC分类号： B41M5/52 , B41M5/506 , B41M5/5218 , Y10T428/259
摘要： An ink jet recording paper having on at least one side of a base paper at least two ink-receiving layers which each comprise a pigment and a resin as main components; the topmost layer of said ink-receiving layers having a thickness of 5 &mgr;m to less than 25 &mgr;m and a density of 0.4 g/cm3 to 0.6 g/cm3 and the ink-receiving layer arranged underneath said topmost layer having a density higher than the density of the topmost layer by 0.05 g/cm3 to 0.5 g/cm3, thereby acquiring high suitability for full-color ink jet printer of photo type.
摘要翻译：一种喷墨记录纸，其在至少一个原纸侧具有至少两个油墨接收层，每个油墨接收层各自包含颜料和树脂作为主要成分; 所述油墨接收层的最上层具有5μm至小于25μm的厚度和0.4g / cm 3至0.6g / cm 3的密度，并且布置在所述最顶层下方的油墨接收层的密度高于最高层的密度为0.05g / cm 3至0.5g / cm 3，从而获得对于照相类型的全色喷墨打印机的高适用性。

68. 发明授权

US4198601A Control unit for transceiver 失效
标题翻译：收发器控制单元
公开(公告)号：US4198601A
公开(公告)日：1980-04-15
申请号：US843669
申请日：1977-10-19
申请人： Atsushi Ono , Shoji Fujino , Yukio Ozaki , Kentaro Suzuki
发明人： Atsushi Ono , Shoji Fujino , Yukio Ozaki , Kentaro Suzuki
IPC分类号： H04B1/40
CPC分类号： H04B1/401
摘要： A control unit for the transceiver characterized in that the whole operating portions of the transceiver is built into a housing of such a size which makes it easy to grip by one hand and the operator can remote-control the transceiver, holding the housing separate from the transceiver in his hand.
摘要翻译：一种用于收发器的控制单元，其特征在于，收发器的整个操作部分被内置在这样的尺寸的壳体中，这使得一只手易于抓握，并且操作者可以远程控制收发器，将壳体与收音机在他手中。

69. 发明授权

US08624339B2 Vibrating device and electronic apparatus 有权
标题翻译：振动装置及电子仪器
公开(公告)号：US08624339B2
公开(公告)日：2014-01-07
申请号：US13556768
申请日：2012-07-24
申请人： Norihito Matsukawa , Atsushi Ono , Mitsuhiro Tateyama , Tsunenori Shibata
发明人： Norihito Matsukawa , Atsushi Ono , Mitsuhiro Tateyama , Tsunenori Shibata
IPC分类号： H01L29/82
CPC分类号： G01C19/5628 , G01C19/5783 , H01L2224/16225 , H01L2224/48091 , H01L2224/49171 , H01L2924/07811 , H01L2924/00014 , H01L2924/00
摘要： A vibrating device has a package having an accommodating space in the interior thereof and a gyro element and an IC chip accommodated in the accommodating space. The package has a plate-like bottom plate having an IC chip mounting area and a vibrating element mounting area. The IC chip mounting area includes an IC chip mounting surface on which the IC chip is mounted. The vibrating element mounting area is arranged in parallel with the IC chip mounting area and includes a vibrating element mounting surface on which the gyro element is mounted. The thickness of the IC chip mounting area is smaller than that of the vibrating element mounting area. The IC chip mounting surface is located closer to a bottom side than the vibrating element mounting surface.
摘要翻译：振动装置具有在其内部具有容纳空间的包装，以及容纳在容纳空间中的陀螺仪元件和IC芯片。封装具有板状底板，其具有IC芯片安装区域和振动元件安装区域。 IC芯片安装区域包括安装有IC芯片的IC芯片安装面。振动元件安装区域与IC芯片安装区域平行布置，并且包括其上安装有陀螺仪元件的振动元件安装表面。 IC芯片安装面积的厚度小于振动元件安装面积的厚度。 IC芯片安装面位于比振动元件安装面更靠近底面的位置。

70. 发明授权

US07933128B2 Electronic device, electronic module, and methods for manufacturing the same 有权
标题翻译：电子装置，电子模块及其制造方法
公开(公告)号：US07933128B2
公开(公告)日：2011-04-26
申请号：US12248395
申请日：2008-10-09
申请人： Atsushi Ono , Yoshihiro Kobayashi , Shojiro Kitamura , Masayuki Matsunaga , Akitoshi Hara
发明人： Atsushi Ono , Yoshihiro Kobayashi , Shojiro Kitamura , Masayuki Matsunaga , Akitoshi Hara
IPC分类号： H05K1/18
CPC分类号： B81B7/007 , B81B7/0074 , B81B2201/025 , H01L24/97 , H01L2224/48091 , H01L2224/48227 , H01L2924/15156 , H01L2924/15313 , H01L2924/16195 , Y10T29/49155 , H01L2924/00014
摘要： An electronic device includes: an outline configuration including a first surface, a second surface facing opposite from the first surface, and a mounting surface coupled to the first and second surfaces; a first substrate including a first electrode; a second substrate including a second electrode; a resin disposed between the first and second substrates; and an electric element sealed with the resin and having an outline configuration of a polyhedron, the electric element being disposed such that a broadest surface of the polyhedron faces one of the first substrate and the second substrate. The first surface is one surface of the first substrate, the one surface being opposite from another surface of the first substrate on a side adjacent to the resin. The second surface is one surface of the second substrate, the one surface being opposite from another surface of the second substrate on a side adjacent to the resin. The mounting surface includes: an exposed surface of the resin between the first and second substrates, and side surfaces of the first and second substrates adjacent to the exposed surface. The first electrode is disposed at an end of the first surface adjacent to the mounting surface and electrically coupled to the electric element. The second electrode is disposed at an end of the second surface adjacent to the mounting surface and electrically coupled to the electric element.
摘要翻译：电子设备包括：轮廓配置，其包括第一表面，与第一表面相对的第二表面和联接到第一和第二表面的安装表面; 第一基板，包括第一电极; 第二基板，包括第二电极; 设置在所述第一和第二基板之间的树脂; 以及用所述树脂密封并具有多面体轮廓构造的电气元件，所述电气元件设置成使得所述多面体的最宽表面面向所述第一基板和所述第二基板之一。所述第一表面是所述第一基板的一个表面，所述一个表面在与所述树脂相邻的一侧与所述第一基板的另一个表面相对。所述第二表面是所述第二基板的一个表面，所述一个表面在与所述树脂相邻的一侧与所述第二基板的另一表面相对。安装表面包括：树脂在第一和第二基板之间的暴露表面以及与暴露表面相邻的第一和第二基板的侧表面。第一电极设置在与安装表面相邻的第一表面的端部处并且电耦合到电气元件。第二电极设置在与安装表面相邻的第二表面的端部处并且电耦合到电气元件。

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