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61. 发明申请

US20060105266A1 Low activation energy positive resist 有权
标题翻译：低活化能正抗蚀剂
公开(公告)号：US20060105266A1
公开(公告)日：2006-05-18
申请号：US10987530
申请日：2004-11-12
申请人： Mahmoud Khojasteh , Kuang-Jung Chen , Pushkara Varanasi
发明人： Mahmoud Khojasteh , Kuang-Jung Chen , Pushkara Varanasi
IPC分类号： G03C1/76
CPC分类号： G03F7/0392 , G03F7/40
摘要： Acid-catalyzed positive resist compositions which are imageable with 193 nm radiation (and possibly other radiation) at low energy levels are obtained using a polymer having acrylate/methacrylate monomeric units comprising a low activation energy moiety preferably attached to a naphthalene ester group. The resist allows the performance benefit of acrylate/methacrylate polymers with low activation energy for imaging thereby enabling improved resolution and reduced post-exposure bake sensitivity. The resist polymer also preferably contains monomeric units comprising fluoroalcohol moiety and a monomeric units comprising a lactone moiety.
摘要翻译：使用具有丙烯酸酯/甲基丙烯酸酯单体单元的聚合物可获得可在193nm辐射（以及可能的其它辐射）下成像的酸催化的正性抗蚀剂组合物，其包含优选连接于萘酯基团的低活化能部分。抗蚀剂允许具有低活化能的丙烯酸酯/甲基丙烯酸酯聚合物的性能益处用于成像，从而能够提高分辨率和降低曝光后烘烤灵敏度。抗蚀剂聚合物还优选含有包含氟代醇部分的单体单元和包含内酯部分的单体单元。

62. 发明授权

US06770419B2 Low silicon-outgassing resist for bilayer lithography 失效
公开(公告)号：US06770419B2
公开(公告)日：2004-08-03
申请号：US10241937
申请日：2002-09-11
申请人： Mahmoud M. Khojasteh , Ranee W. Kwong , Kuang-Jung Chen , Pushkara Rao Varanasi , Robert D. Allen , Phillip Brock , Frances Houle , Ratnam Sooriyakumaran
发明人： Mahmoud M. Khojasteh , Ranee W. Kwong , Kuang-Jung Chen , Pushkara Rao Varanasi , Robert D. Allen , Phillip Brock , Frances Houle , Ratnam Sooriyakumaran
IPC分类号： G03C173
CPC分类号： G03F7/094 , G03F7/0397 , G03F7/0758 , Y10S430/106 , Y10S430/111 , Y10S430/115
摘要： The silicon-containing resist compositions which have low silicon outgassing and high resolution lithographic performance, especially in bilayer or multilayer lithographic applications using 193 nm or shorter wavelength imaging radiation are enabled by the presence of an imaging polymer having silicon-containing, non-acid-labile pendant groups. The resist compositions of the invention are preferably further characterized by the substantial absence of silicon-containing acid-labile moieties.

63. 发明授权

US06685853B1 Energy sensitive electrically conductive admixtures, uses thereof, methods of fabrication and structures fabricated therewith 有权
标题翻译：能量敏感的导电掺合物，其用途，制造方法和用其制造的结构
公开(公告)号：US06685853B1
公开(公告)日：2004-02-03
申请号：US09614230
申请日：2000-07-12
申请人： Marie Angelopoulos , Edward D. Babich , Inna V. Babich , Kuang-Jung Chen , Wayne Martin Moreau , David E. Seeger
发明人： Marie Angelopoulos , Edward D. Babich , Inna V. Babich , Kuang-Jung Chen , Wayne Martin Moreau , David E. Seeger
IPC分类号： H01B112
CPC分类号： H01B1/12 , H01L23/5328 , H01L2924/0002 , H01L2924/00
摘要： The present invention is an admixture of an electrically conductive material and an energy sensitive material resulting in a conductive energy sensitive composition. The structures are useful for lithography in microelectronic fabrication to avoid the effects of charging on resists from electron beams. The compositions are also useful in applications of scanning electron metrology and static dissipation.
摘要翻译：本发明是导电材料和能量敏感材料的混合物，导致导电能量敏感组合物。该结构可用于微电子制造中的光刻，以避免对来自电子束的抗蚀剂充电的影响。该组合物也可用于扫描电子测量和静电消散的应用中。

64. 发明授权

US08557637B2 Method for fabricating the flexible electronic device 有权
标题翻译：柔性电子装置的制造方法
公开(公告)号：US08557637B2
公开(公告)日：2013-10-15
申请号：US13529820
申请日：2012-06-21
申请人： Kuang-Jung Chen , Isaac Wing-Tak Chan
发明人： Kuang-Jung Chen , Isaac Wing-Tak Chan
IPC分类号： H01L21/00 , H01L21/30
CPC分类号： H01L51/003 , H01L51/0097 , H01L2227/326 , H01L2251/5338 , H01L2251/566
摘要： The disclosure provides a method for fabricating the flexible electronic devices, including: providing a first rigid carrier substrate and a second rigid carrier substrate, wherein at least one flexible electronic device is formed between the first rigid carrier substrate and the second rigid carrier substrate, and a plurality of first de-bonding areas, a first flexible substrate, the flexible electronic device, a second flexible substrate, a plurality of second de-bonding areas and the second rigid carrier substrate are formed on the first rigid carrier substrate; performing a first cutting step to cut through the first de-bonding areas; separating the first rigid carrier substrate from the first de-bonding areas; removing the first rigid carrier substrate from the first de-bonding areas; and performing a second cutting step to cut through the second de-bonding areas; separating and removing the second rigid carrier substrate from the second de-bonding areas.
摘要翻译：本公开提供了一种制造柔性电子器件的方法，包括：提供第一刚性载体衬底和第二刚性载体衬底，其中在第一刚性载体衬底和第二刚性载体衬底之间形成至少一个柔性电子器件，以及多个第一解除接合区域，第一柔性基板，柔性电子器件，第二柔性基板，多个第二解除接合区域和第二刚性载体基板形成在第一刚性载体基板上; 执行第一切割步骤以切割第一去粘合区域; 将第一刚性载体基板与第一去粘合区域分离; 从第一去粘合区域移除第一刚性载体衬底; 以及执行第二切割步骤以切割所述第二去粘合区域; 从第二去接合区域分离和去除第二刚性载体衬底。

65. 发明申请

US20130026639A1 Method of fabricating dual damascene structures using a multilevel multiple exposure patterning scheme 审中-公开
标题翻译：使用多级多重曝光图案化方案制造双镶嵌结构的方法
公开(公告)号：US20130026639A1
公开(公告)日：2013-01-31
申请号：US13615980
申请日：2012-09-14
申请人： John C. Arnold , Kuang-Jung Chen , Matthew E. Colburn , Dario L. Goldfarb , Stefan Harrar , Steven J. Holmes , Pushkara Varanasi
发明人： John C. Arnold , Kuang-Jung Chen , Matthew E. Colburn , Dario L. Goldfarb , Stefan Harrar , Steven J. Holmes , Pushkara Varanasi
IPC分类号： H01L21/428 , H01L23/48
CPC分类号： H01L23/53295 , G03F7/091 , G03F7/38 , H01L21/0274 , H01L21/31144 , H01L21/76811 , H01L21/76813 , H01L2221/1021 , H01L2924/0002 , H01L2924/00
摘要： A method for fabricating a dual damascene structure includes providing a first photoresist layer coated on an underlying dielectric stack, exposing said first photoresist layer to a first predetermined pattern of light, coating a second photoresist layer onto the pre-exposed first photoresist layer, exposing said second photoresist layer to a second predetermined pattern of light, optionally post-exposure baking the multi-tiered photoresist layers and developing said photoresist layers to form a multi-tiered dual damascene structure in the photoresist layers.
摘要翻译：一种用于制造双镶嵌结构的方法包括提供涂覆在下面的电介质堆叠上的第一光致抗蚀剂层，将所述第一光致抗蚀剂层暴露于第一预定图案的光，将第二光致抗蚀剂层涂覆到预曝光的第一光致抗蚀剂层上，第二光致抗蚀剂层到第二预定图案的光，任选地后曝光烘烤多层光致抗蚀剂层并显影所述光致抗蚀剂层以在光致抗蚀剂层中形成多层双镶嵌结构。

66. 发明申请

US20120024722A1 PACKAGE OF ENVIRONMENTAL SENSITIVE ELEMENT AND ENCAPSULATION METHOD OF THE SAME 有权
标题翻译：环境敏感元件的包装及其封装方法
公开(公告)号：US20120024722A1
公开(公告)日：2012-02-02
申请号：US12944691
申请日：2010-11-11
申请人： Kuang-Jung Chen
发明人： Kuang-Jung Chen
IPC分类号： B65D81/26 , B05D5/12
CPC分类号： H01L21/56 , H01L23/26 , H01L2924/0002 , H01L2924/12044 , H01L2924/00
摘要： An encapsulation method of an environmental sensitive element is provided. An environmental sensitive element and a first rib are formed on a first substrate. The first rib surrounds the environmentally sensitive element. A getter layer is formed on the environmental sensitive element. A first encapsulation layer is formed to encapsulate the getter layer and the first rib. The first barrier layer is formed to encapsulate the first encapsulation layer located on the first rib. The first rib, a portion of the first encapsulation layer located on the first rib and the first barrier layer form a barrier structure. A second substrate is provided on the first substrate and a filling layer is formed between the first substrate and the second substrate. The second substrate is bonded to the first substrate by the filling layer. The filling layer encapsulates the environmental sensitive element, the first encapsulation layer and the barrier structure.
摘要翻译：提供了一种环境敏感元件的封装方法。在第一基板上形成环境敏感元件和第一肋条。第一个肋围绕环境敏感元件。在环境敏感元件上形成吸气剂层。形成第一封装层以封装吸气剂层和第一肋。形成第一阻挡层以封装位于第一肋上的第一封装层。第一肋，位于第一肋上的第一包封层的一部分和第一阻挡层形成阻挡结构。在第一基板上设置第二基板，在第一基板和第二基板之间形成填充层。第二基板通过填充层与第一基板结合。填充层封装环境敏感元件，第一封装层和屏障结构。

67. 发明申请

US20110063808A1 PACKAGE OF ENVIRONMENTAL SENSITIVE ELEMENT 有权
标题翻译：环境敏感元件的包装
公开(公告)号：US20110063808A1
公开(公告)日：2011-03-17
申请号：US12703155
申请日：2010-02-09
申请人： Kuang-Jung Chen , Shu-Tang Yeh , Jia-Chong Ho
发明人： Kuang-Jung Chen , Shu-Tang Yeh , Jia-Chong Ho
IPC分类号： H05K1/00
CPC分类号： H01L51/0097 , H01L51/5246 , H01L51/5253 , H01L51/5256 , H01L2251/5338 , Y02E10/549 , Y10T428/239
摘要： A package of an environmental sensitive element including a flexible substrate, an environmental sensitive element, a flexible sacrificial layer and a packaging structure is provided. The environmental sensitive element is disposed on the flexible substrate. The flexible sacrificial layer is disposed on the environmental sensitive element, wherein the environmental sensitive element includes a plurality of first thin films and the flexible sacrificial layer includes a plurality of second thin films. The bonding strength between two adjacent second thin films is substantially equal to or lower than the bonding strength between two adjacent first thin films. Further, the packaging structure covers the environmental sensitive element and the flexible sacrificial layer.
摘要翻译：提供了包括柔性基板，环境敏感元件，柔性牺牲层和封装结构的环境敏感元件的封装。环境敏感元件设置在柔性基板上。柔性牺牲层设置在环境敏感元件上，其中环境敏感元件包括多个第一薄膜，并且柔性牺牲层包括多个第二薄膜。两个相邻的第二薄膜之间的结合强度基本上等于或低于两个相邻的第一薄膜之间的结合强度。此外，包装结构覆盖环境敏感元件和柔性牺牲层。

68. 发明申请

US20100265207A1 TOUCH-SENSING DISPLAY APPARATUS AND FABRICATING METHOD THEREOF 有权
标题翻译：触摸感应显示装置及其制作方法
公开(公告)号：US20100265207A1
公开(公告)日：2010-10-21
申请号：US12703163
申请日：2010-02-09
申请人： Kuang-Jung Chen
发明人： Kuang-Jung Chen
IPC分类号： G06F3/041 , G06F3/045 , G06F3/044 , H01J9/00
CPC分类号： G06F3/044 , G06F3/0412 , G06F2203/04111 , H01L27/323
摘要： A touch-sensing display apparatus including a touch panel, an environmentally sensitive electronic device and an adhesive layer is provided. The water/oxygen vapor transmission rate of the touch panel is lower than 10−1 g/m2*day, and the touch panel includes a first substrate, a sensing circuit and at least one water/oxygen barrier layer. The first substrate is a first flexible substrate. The sensing circuit and the water/oxygen barrier layer are disposed on the first substrate. The environmentally sensitive electronic device includes a second substrate and a pixel array. The pixel array is disposed on the second substrate and between the first substrate and the second substrate. The adhesive layer is disposed between the touch panel and the environmentally sensitive electronic device. Moreover, a fabricating method of the above-mentioned touch-sensing display apparatus is also provided.
摘要翻译：提供了包括触摸面板，环境敏感电子设备和粘合剂层的触摸感测显示设备。触摸面板的水/氧气透过率低于10-1g / m2 *天，触控面板包括第一基板，检测电路和至少一个水/氧阻隔层。第一衬底是第一柔性衬底。感测电路和水/氧阻隔层设置在第一基板上。环境敏感的电子设备包括第二基板和像素阵列。像素阵列设置在第二基板上并且在第一基板和第二基板之间。粘合剂层设置在触摸面板和环境敏感的电子设备之间。此外，还提供了上述触摸感测显示装置的制造方法。

69. 发明申请

US20100258346A1 PACKAGE OF ENVIRONMENTALLY SENSITIVE ELECTRONIC DEVICE AND FABRICATING METHOD THEREOF 有权
标题翻译：环境敏感电子设备的包装及其制造方法
公开(公告)号：US20100258346A1
公开(公告)日：2010-10-14
申请号：US12487658
申请日：2009-06-19
申请人： Kuang-Jung Chen , Jia-Chong Ho , Jing-Yi Yan , Shu-Tang Yeh
发明人： Kuang-Jung Chen , Jia-Chong Ho , Jing-Yi Yan , Shu-Tang Yeh
IPC分类号： H01L23/28 , H01L21/56
CPC分类号： H01L23/564 , H01L21/56 , H01L23/293 , H01L23/3121 , H01L51/5243 , H01L51/5246 , H01L51/525 , H01L2251/5338 , H01L2924/0002 , H01L2924/12044 , Y10T29/49002 , H01L2924/00
摘要： A package of an environmentally sensitive electronic device including a first substrate, a second substrate, an environmentally sensitive electronic device, a plurality of barrier structures, and a fill is provided. The second substrate is disposed above the first substrate. The environmentally sensitive electronic device is disposed on the first substrate and located between the first substrate and the second substrate. The barrier structures are disposed between the first substrate and the second substrate, wherein the barrier structures surround the environmental sensitive electronic device, and the water vapor transmission rate of the barrier structures is less than 10−1 g/m2/day. The fill is disposed between the first substrate and the second substrate and covers the environmentally sensitive electronic device and the barrier structures.
摘要翻译：提供一种包括第一基板，第二基板，环境敏感电子设备，多个屏障结构和填充物的环境敏感电子设备的封装。第二基板设置在第一基板的上方。环境敏感的电子设备设置在第一基板上并且位于第一基板和第二基板之间。阻挡结构设置在第一基板和第二基板之间，其中阻挡结构围绕环境敏感电子设备，并且阻挡结构的水蒸汽透过率小于10-1g / m 2 /天。填充物设置在第一基板和第二基板之间并且覆盖环境敏感的电子设备和屏障结构。

70. 发明申请

US20060105267A1 Positive resist containing naphthol functionality 有权
标题翻译：含有萘酚官能团的正性抗蚀剂
公开(公告)号：US20060105267A1
公开(公告)日：2006-05-18
申请号：US10987540
申请日：2004-11-12
申请人： Mahmoud Khojasteh , Kuang-Jung Chen , Pushkara Varanasi
发明人： Mahmoud Khojasteh , Kuang-Jung Chen , Pushkara Varanasi
IPC分类号： G03C1/76
CPC分类号： G03F7/40 , G03F7/0397
摘要： Acid-catalyzed positive resist compositions which are imageable with 193 nm radiation are obtained using a polymer having acrylate/methacrylate monomeric units comprising a naphthol ester group. The resist may optionally contain polymer having acrylate/methacrylate monomeric units with fluorine-containing functional groups. The resists containing the polymer having acrylate/methacrylate monomeric units comprising a naphthol ester group have an improved process window, including improved etch resistance and reduced swelling compared to conventional fluorine-containing 193 nm resist.
摘要翻译：使用具有包含萘酚酯基的丙烯酸酯/甲基丙烯酸酯单体单元的聚合物获得可用193nm辐射成像的酸催化正性抗蚀剂组合物。抗蚀剂可任选地含有具有含氟官能团的具有丙烯酸酯/甲基丙烯酸酯单体单元的聚合物。包含含有萘酚酯基团的具有丙烯酸酯/甲基丙烯酸酯单体单元的聚合物的抗蚀剂具有改进的工艺窗口，与常规含氟193nm抗蚀剂相比，包括改进的耐蚀刻性和降低的溶胀。

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