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    • 64. 发明申请
    • Programming methods for multi-level flash EEPROMs
    • 多级闪存EEPROM的编程方法
    • US20050078521A1
    • 2005-04-14
    • US10999030
    • 2004-11-29
    • Chun ChenKirk Prall
    • Chun ChenKirk Prall
    • G11C7/00G11C11/34G11C11/56G11C16/04
    • G11C11/5628G11C16/0483
    • A method is provided for programming a memory cell of an electrically erasable programmable read only memory. The memory cell is fabricated on a substrate and comprises a source region, a drain region, a floating gate, and a control gate. The memory cell has a threshold voltage selectively configurable into one of at least three programming states. The method includes generating a drain current between the drain region and the source region by applying a drain-to-source bias voltage between the drain region and the source region. The method further includes injecting hot electrons from the drain current to the floating gate by applying a gate voltage to the control gate. A selected threshold voltage for the memory cell corresponding to a selected one of the programming states is generated by applying a selected constant drain-to-source bias voltage and a selected gate voltage.
    • 提供了一种用于对电可擦除可编程只读存储器的存储单元进行编程的方法。 存储单元制造在衬底上,并且包括源极区域,漏极区域,浮动栅极和控制栅极。 存储单元具有可选地配置为至少三个编程状态之一的阈值电压。 该方法包括通过在漏极区域和源极区域之间施加漏极 - 源极偏置电压来在漏极区域和源极区域之间产生漏极电流。 该方法还包括通过向控制栅极施加栅极电压将热电子从漏极电流注入到浮置栅极。 通过施加选定的恒定漏极 - 源极偏置电压和所选择的栅极电压来产生对应于所选择的一个编程状态的存储单元的选定阈值电压。
    • 68. 发明授权
    • Semiconductor-on-insulator transistor and memory circuitry employing semiconductor-on-insulator transistors
    • 采用绝缘体上半导体晶体管的绝缘体上半导体晶体管和存储器电路
    • US06404008B1
    • 2002-06-11
    • US09315900
    • 1999-05-20
    • Kirk Prall
    • Kirk Prall
    • H01L27108
    • H01L27/1203H01L21/84H01L29/78642Y10S257/905
    • The invention includes several aspects related to semiconductor-on-insulator transistors, to memory and other DRAM circuitry and arrays, to transistor gate arrays, and to methods of fabricating such constructions. In one aspect, a semiconductor-on-insulator transistor includes, a) an insulator layer; b) a layer of semiconductor material over the insulator layer; c) a transistor gate provided within the semiconductor material layer; and d) an outer elevation source/drain diffusion region and an inner elevation diffusion region provided within the semiconductor material layer in operable proximity to the transistor gate. In another aspect, DRAM circuitry includes a plurality of memory cells not requiring sequential access, at least a portion of the plurality having more than two memory cells for a single bit line contact. In still another aspect, a DRAM array of memory cells comprises a plurality of wordlines, source regions, drain regions, bit lines in electrical connection with the drain regions, and storage capacitors in electrical connection with the source regions; at least two drain regions of different memory cells being interconnected with one another beneath one of the wordlines. In yet another aspect, a DRAM array has more than two memory cells for a single bit line contact, and a plurality of individual memory cells occupy a surface area of less than or equal to 2f×(2f+f/N), where “f” is the minimum photolithographic feature size with which the array was fabricated, and “N” is the number of memory cells per single bit line contact within the portion.
    • 本发明包括与绝缘体上半导体晶体管,存储器和其他DRAM电路和阵列到晶体管栅极阵列有关的几个方面,以及制造这种结构的方法。 在一个方面,绝缘体上半导体晶体管包括:a)绝缘体层; b)绝缘体层上的半导体材料层; c)设置在半导体材料层内的晶体管栅极; 以及d)设置在半导体材料层内的外部高程源极/漏极扩散区域和内部高程扩散区域,其可操作地接近晶体管栅极。 在另一方面,DRAM电路包括不需要顺序访问的多个存储单元,多个存储单元的至少一部分具有用于单位线接触的多于两个存储单元。 在另一方面,存储器单元的DRAM阵列包括多个字线,源极区,漏极区,与漏极区电连接的位线以及与源极区域电连接的存储电容器; 不同存储器单元的至少两个漏极区域在一条字线之下彼此互连。 在另一方面,DRAM阵列具有用于单个位线接触的多于两个存储单元,并且多个独立存储单元占据小于或等于2fx(2f + f / N)的表面积,其中“f “是制造阵列的最小光刻特征尺寸,”N“是该部分内单个位线接触的存储单元数。
    • 69. 发明授权
    • Semiconductor processing method of fabricating field effect transistors
    • 制造场效应晶体管的半导体处理方法
    • US06326250B1
    • 2001-12-04
    • US08990200
    • 1997-12-22
    • Aftab AhmadKirk Prall
    • Aftab AhmadKirk Prall
    • H01L21336
    • H01L29/6653H01L21/823814
    • In one aspect of the invention, a semiconductor processing method includes: a) providing a semiconductor substrate; b) defining a first conductivity type region and a second conductivity type region of the semiconductor substrate; c) providing a first transistor gate over the first type region which defines a first source area and a first drain area operatively adjacent thereto; d) providing a second transistor gate over the second type region which defines a second source area and a second drain area operatively adjacent thereto; and e) blanket implanting a conductivity enhancing dopant of the second conductivity type through the first source and drain areas of the first conductivity region and the second source and drain areas of the second conductivity region to provide second conductivity type regular LDD implant regions within the substrate operatively adjacent the first transistor gate and to provide second conductivity type halo implant regions within the substrate operatively adjacent the second transistor gate. In another aspect, a semiconductor processing method includes: a) providing a semiconductor substrate; b) providing a transistor gate over the semiconductor substrate; c) providing spacers adjacent the transistor gate; d) providing electrically conductive source and drain implant regions within the substrate operatively adjacent the transistor gate; e) implanting a conductivity enhancing dopant into the previously formed electrically conductive source and drain regions; and f) driving the conductivity enhancing dopant under the spacers to form graded junction regions.
    • 在本发明的一个方面,半导体处理方法包括:a)提供半导体衬底; b)限定半导体衬底的第一导电类型区域和第二导电类型区域; c)在所述第一类型区域上提供限定与其可操作地相邻的第一源区域和第一漏极区域的第一晶体管栅极; d)在所述第二类型区域上提供限定与其可操作地相邻的第二源极区域和第二漏极区域的第二晶体管栅极; 以及e)通过所述第一导电区域的所述第一源极和漏极区域以及所述第二导电区域的所述第二源极和漏极区域覆盖所述第二导电类型的电导率增强掺杂剂,以在所述衬底内提供第二导电类型的常规LDD注入区域 可操作地与第一晶体管栅极相邻并且在衬底内提供可操作地邻近第二晶体管栅极的第二导电类型的晕圈注入区域。 另一方面,半导体处理方法包括:a)提供半导体衬底; b)在半导体衬底上提供晶体管栅极; c)提供与晶体管栅极相邻的间隔物; d)在所述衬底内提供与所述晶体管栅极可操作地相邻的导电源极和漏极注入区域; e)将电导率增强掺杂剂注入到先前形成的导电源极和漏极区域中; 以及f)在所述间隔物下驱动所述导电性增强掺杂剂以形成渐变连接区域。