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61. 发明授权

US07931659B2 System and method for treating ischemic stroke 有权
标题翻译：缺血性脑卒中治疗系统及方法
公开(公告)号：US07931659B2
公开(公告)日：2011-04-26
申请号：US11210636
申请日：2005-08-24
申请人： Arani Bose , Vikas Gupta , Sean Donahue , Delilah Hui
发明人： Arani Bose , Vikas Gupta , Sean Donahue , Delilah Hui
IPC分类号： A61M29/00 , A61B17/22
CPC分类号： A61B17/221 , A61B17/22 , A61B2017/22044 , A61B2017/2215 , A61B2217/005 , A61F2/013 , A61M2025/1052
摘要： A thromboembolic removal system for treating ischemic stroke includes an elongate member and a receiver on a distal portion of the elongate member. The receiver includes structural members arranged to form a sleeve having a central lumen. A plurality of the structural members form engaging elements having apex regions that extend into the central lumen. During use of the thromboembolic removal system, the receiver is advanced over a body of thromboembolic material within a blood vessel, causing the body to be received into the central lumen, and causing the engaging elements to engage the body within the lumen.
摘要翻译：用于治疗缺血性卒中的血栓栓塞去除系统包括细长构件和在细长构件的远侧部分上的接收器。接收器包括布置成形成具有中心腔的套筒的结构构件。多个结构构件形成具有延伸到中心腔的顶点区域的接合元件。在使用血栓栓塞移除系统期间，接收器在血管内的血栓栓塞物质的身体上前进，使得身体被容纳在中央腔中，并使得接合元件与体内的身体接合。

62. 发明申请

US20100301470A1 STUD BUMPS AS LOCAL HEAT SINKS DURING TRANSIENT POWER OPERATIONS 有权
标题翻译：在瞬时功率运行期间作为本地热量的散热器
公开(公告)号：US20100301470A1
公开(公告)日：2010-12-02
申请号：US12543763
申请日：2009-08-19
申请人： Siva P. Gurrum , Kapil Heramb Sahasrabudhe , Vikas Gupta
发明人： Siva P. Gurrum , Kapil Heramb Sahasrabudhe , Vikas Gupta
IPC分类号： H01L23/367 , H01L21/58
CPC分类号： H01L23/367 , H01L23/3171 , H01L24/14 , H01L24/16 , H01L2224/0554 , H01L2224/05548 , H01L2224/05573 , H01L2224/056 , H01L2224/16 , H01L2924/00014 , H01L2924/01079 , H01L2924/01084 , H01L2924/10253 , H01L2924/14 , H01L2924/19041 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A thermal management configuration for a flip chip semiconductor device is disclosed. The device includes a high power silicon based die having a metal bonding surface. A plurality of interconnects are formed on the metal surface and connected to a substrate. A plurality of thermal management stud bumps are formed on the metal bonding surface, the thermal management stud bumps positioned distinct from the interconnects and local to die hot spots, exposed ends of the thermal management stud bumps spaced from the substrate.
摘要翻译：公开了一种用于倒装芯片半导体器件的热管理配置。该器件包括具有金属接合表面的高功率硅基管芯。在金属表面上形成多个互连件并连接到基板。在金属接合表面上形成多个热管理突起，热管理突起凸起与互连不同，并且局部到管芯热点，热管理突起凸起与基板间隔开的暴露端。

63. 发明授权

US07838988B1 Stud bumps as local heat sinks during transient power operations 有权
标题翻译：瞬态功率运行期间，当局部散热片时，螺柱凸起
公开(公告)号：US07838988B1
公开(公告)日：2010-11-23
申请号：US12543763
申请日：2009-08-19
申请人： Siva Prakash Gurrum , Kapil Heramb Sahasrabudhe , Vikas Gupta
发明人： Siva Prakash Gurrum , Kapil Heramb Sahasrabudhe , Vikas Gupta
IPC分类号： H01L23/10 , H01L23/34 , H01L23/12
CPC分类号： H01L23/367 , H01L23/3171 , H01L24/14 , H01L24/16 , H01L2224/0554 , H01L2224/05548 , H01L2224/05573 , H01L2224/056 , H01L2224/16 , H01L2924/00014 , H01L2924/01079 , H01L2924/01084 , H01L2924/10253 , H01L2924/14 , H01L2924/19041 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A thermal management configuration for a flip chip semiconductor device is disclosed. The device includes a high power silicon based die having a metal bonding surface. A plurality of interconnects are formed on the metal surface and connected to a substrate. A plurality of thermal management stud bumps are formed on the metal bonding surface, the thermal management stud bumps positioned distinct from the interconnects and local to die hot spots, exposed ends of the thermal management stud bumps spaced from the substrate.
摘要翻译：公开了一种用于倒装芯片半导体器件的热管理配置。该器件包括具有金属接合表面的高功率硅基管芯。在金属表面上形成多个互连件并连接到基板。在金属接合表面上形成多个热管理突起，热管理突起凸起与互连不同，并且局部到管芯热点，热管理突起凸起与基板间隔开的暴露端。

64. 发明授权

US07584152B2 Automatic authorization of programmatic transactions 有权
标题翻译：自动授权程序化交易
公开(公告)号：US07584152B2
公开(公告)日：2009-09-01
申请号：US11537538
申请日：2006-09-29
申请人： Vikas Gupta , Allan H. Vermeulen , Eugene Wei , Andrew R. Jassy , Jeffrey P. Bezos , Duane J. Krause , David A. Schappell
发明人： Vikas Gupta , Allan H. Vermeulen , Eugene Wei , Andrew R. Jassy , Jeffrey P. Bezos , Duane J. Krause , David A. Schappell
IPC分类号： G06F17/60
CPC分类号： G06Q20/02 , G06Q20/0855 , G06Q20/12 , G06Q20/367 , G06Q20/3672 , G06Q20/3674 , G06Q20/403 , G07F17/16
摘要： Techniques are described for facilitating interactions between computing systems, such as via a third-party transaction authorization system that automatically authorizes transactions between parties. In some situations, the transactions are programmatic transactions involving the use of fee-based Web services by executing application programs, with the transaction authorization system authorizing and/or providing payments for transactions between Web service provider and consumer parties in accordance with private authorization instructions previously specified by the parties. The authorization instructions may include predefined instruction rule sets that regulate conditions under which a potential transaction can be authorized, with the instruction rule sets each referenced by an associated reference token. The transaction authorization system can then receive a reference token from each party to a potential transaction, and determine whether to authorize the transaction based on whether the instruction rule sets associated with the reference tokens are compatible or otherwise satisfied.
摘要翻译：描述了用于促进计算系统之间的交互的技术，例如通过自动授权方之间的交易的第三方交易授权系统。在某些情况下，交易是涉及通过执行应用程序使用基于费用的Web服务的程序交易，交易授权系统根据先前的私人授权指令授权和/或提供Web服务提供商和消费方之间的交易支付由各方指定。授权指令可以包括预定义的指令规则集，其规定可以授权潜在事务的条件，每个指令规则集都由相关联的引用令牌引用。交易授权系统然后可以从每一方接收参考令牌到潜在的交易，并且基于与引用令牌相关联的指令规则集是兼容还是满足来确定是否授权交易。

65. 发明授权

US07502760B1 Providing payments automatically in accordance with predefined instructions 有权
标题翻译：根据预定义的说明自动提供付款
公开(公告)号：US07502760B1
公开(公告)日：2009-03-10
申请号：US11200880
申请日：2005-08-09
申请人： Vikas Gupta
发明人： Vikas Gupta
IPC分类号： G06F17/60
CPC分类号： G06Q20/40 , G06Q20/367 , G06Q20/3672 , G06Q20/3674 , G06Q20/382 , G06Q20/405 , G06Q40/02
摘要： Techniques are described for facilitating interactions between computing systems, such as by using an authorization system to automatically authorize financial payments between parties in accordance with previously specified private authorization instructions of at least one of the parties. In some situations, some or all of the payments are associated with commerce-related or other transactions, such as transactions initiated by a consumer via the Web to acquire items from a retailer. The authorization instructions may include predefined instruction sets that regulate conditions under which a potential payment can be authorized, with the instruction sets each associated in some situations with a reference. After one or more parties each supply one or more such references or otherwise indicate one or more such instruction sets for use with a potential payment, the authorization system can determine whether to authorize the payment based on whether the instruction sets are compatible or otherwise satisfied.
摘要翻译：描述了用于促进计算系统之间的交互的技术，例如通过使用授权系统根据至少一方的先前指定的私人授权指令来自动授权各方之间的财务支付。在某些情况下，部分或全部付款与商业相关或其他交易相关联，例如消费者通过网络发起的交易，以从零售商那里获取物品。授权指令可以包括预定义的指令集，其规定可以授权潜在支付的条件，其中每个在某些情况下与参考相关联的指令集。在一方或多方各自提供一个或多个这样的参考文献之后，或以其他方式指示一个或多个这样的指令集用于潜在的支付时，授权系统可以基于指令集是兼容还是以其他方式来确定是否授权支付。

66. 发明申请

US20080122049A1 Leadframe finger design to ensure lead-locking for enhanced fatigue life of bonding wire in an overmolded package 审中-公开
标题翻译：引线框架手指设计，以确保引线锁定，以提高包覆成型封装中接合线的疲劳寿命
公开(公告)号：US20080122049A1
公开(公告)日：2008-05-29
申请号：US11605553
申请日：2006-11-28
申请人： Jie-Hua Zhao , Vikas Gupta
发明人： Jie-Hua Zhao , Vikas Gupta
IPC分类号： H01L23/495 , H01L21/56
CPC分类号： H01L23/3107 , H01L23/49541 , H01L23/49548 , H01L24/45 , H01L24/48 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48095 , H01L2224/48247 , H01L2224/73265 , H01L2924/01013 , H01L2924/01028 , H01L2924/01079 , H01L2924/14 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： In a method and system for fabricating a semiconductor device (200, 300 or 400), a portion of a metal sheet to form a leadframe (210, 310 or 410) having a lead finger (220, 320 or 430) is removed to form a lead finger lock (260, 360 or 460). The lead finger lock (260, 360 or 460) is disposed within a configurable distance of a wirebonding joint (240, 340 or 440) located on a surface of the lead finger (220, 320 or 430). An integrated circuit (IC) chip (290, 390 or 490) is attached to the leadframe (210, 310 or 410). A conductive pad end (232, 332 or 432) of a bond wire (230, 330 or 430) is bonded to the IC chip (290, 390 or 490) and a lead finger end (234, 334 or 434) of the bond wire is bonded to an inner end (222, 322 or 422) of the lead finger at the wirebonding joint (240, 340 or 440). The IC chip, the leadframe, the lead finger, and the wirebonding are encapsulated with a molding compound (MC) (250, 350 or 450). The lead finger lock (260, 360 or 460) that is encapsulated by the MC (250, 350 or 450) limits a relative displacement (270, 370 or 470) between the MC and the lead finger at the wirebonding joint (240, 340 or 440).
摘要翻译：在用于制造半导体器件（200,300或400）的方法和系统中，移除金属片的一部分以形成具有引线指（220,320或430）的引线框（210,310或410）以形成导针锁（260,360或460）。引导指锁定（260,360或460）设置在位于引线指（220,320或430）的表面上的引线键合接头（240,340或440）的可配置距离内。集成电路（IC）芯片（290,390或490）附接到引线框架（210,310或410）。接合线（230,330或430）的导电焊盘端（232,332或432）被结合到IC芯片（290,390或490）上，并且该键的引线端（234,334或434）导线在引线键合接头（240,340或440）处连接到引线指的内端（222,322或422）。 IC芯片，引线框，引线指和引线键合用模制化合物（MC）（250,350或450）封装。由MC（250,350或450）封装的引导指锁（260,360或460）限制了引线键合接头（240,340）处的MC和引线指之间的相对位移（270,370或470）或440）。

67. 发明申请

US20080079159A1 Focused stress relief using reinforcing elements 审中-公开
标题翻译：使用增强元素集中应力消除
公开(公告)号：US20080079159A1
公开(公告)日：2008-04-03
申请号：US11542336
申请日：2006-10-02
申请人： Vikas Gupta , Gregory Eric Howard
发明人： Vikas Gupta , Gregory Eric Howard
IPC分类号： H01L23/52 , H01L21/4763
CPC分类号： H01L23/53295 , H01L23/585 , H01L2224/05124 , H01L2224/05147 , H01L2224/05166 , H01L2224/05184 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/0558 , H01L2224/05644 , H01L2224/05664 , H01L2224/05669 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00 , H01L2924/00014 , H01L2924/013
摘要： In a method and system for relieving stress induced within a dielectric layer of a semiconductor device (100), areas in the dielectric layer (236, 238, 242) where the stress exceeds a threshold are identified. The areas, which are in parallel alignment with electrical interconnects such as conductive bumps (130), include a selected number of outer rows of the conductive bumps (130) having a high stress level. Within the identified areas where the stress exceeds the threshold, patterned zones (250) having an adjustable zone density are provided by adding reinforcing elements (240) to relieve the stress below the threshold.
摘要翻译：在用于减轻在半导体器件（100）的电介质层内感应的应力的方法和系统中，识别出应力超过阈值的电介质层（236,238,242）中的区域。与诸如导电凸块（130）的电互连平行对准的区域包括具有高应力水平的选定数量的导电凸块（130）的外排。在应力超过阈值的识别区域内，通过添加增强元件（240）以减轻低于阈值的应力来提供具有可调区域密度的图案区域（250）。

68. 发明申请

US20080028070A1 METHOD AND SYSTEM FOR REMOTE MANAGEMENT OF ONLINE ACTIVITIES 审中-公开
标题翻译：远程管理在线活动的方法与系统
公开(公告)号：US20080028070A1
公开(公告)日：2008-01-31
申请号：US11627914
申请日：2007-01-26
申请人： Vikas Gupta
发明人： Vikas Gupta
IPC分类号： G06F15/173
CPC分类号： G06F9/54 , H04L51/18
摘要： A method and a system for performing online tasks is disclosed. An addressable entity is created for a task. A user sends a task message to this addressable entity. The task message includes task content and sender information. The task content and the sender information are extracted from the task message. The task message is authorized by the owner of the task, or by using a set of pre-defined rules. Once the task message has been authorized, the online task is managed based on the extracted content.
摘要翻译：公开了一种执行在线任务的方法和系统。为任务创建可寻址实体。用户向任何可寻址实体发送任务消息。任务消息包括任务内容和发送者信息。从任务消息中提取任务内容和发送者信息。任务消息由任务的所有者授权，或通过使用一组预定义的规则。一旦任务消息被授权，基于所提取的内容来管理在线任务。

69. 发明授权

US07137670B2 Seating system and method for making same 有权
公开(公告)号：US07137670B2
公开(公告)日：2006-11-21
申请号：US11268245
申请日：2005-11-07
申请人： Vikas Gupta , Jane M. Palmieri , Mick F. Heckert , Gregory J. Korchnak , Eric R. Kurtycz , Gregory P. Reny
发明人： Vikas Gupta , Jane M. Palmieri , Mick F. Heckert , Gregory J. Korchnak , Eric R. Kurtycz , Gregory P. Reny
IPC分类号： B60N2/42
CPC分类号： B60N2/688 , B29C49/04 , B29C49/4802 , B29C2049/4812 , B60N2/366 , B60N2/682 , B60N2/686 , B60N2205/35 , Y10S297/02
摘要： An improved seating system that includes a seat back assembly (10) that is fabricated to include a seat back (12) with first and second wall portions (14,16), and which may include an integrated reinforcement structure (18). The seating system is capable of either or both of withstanding without rupture at least about 11000 Newtons in the direction in which the seat back (12) faces in a plane, parallel to the longitudinal centerline of the vehicle or, upon rapid acceleration up to at least about 20 g, substantially no fragmentation of the seat back with at least a 30 kg mass placed behind the seat back.

70. 发明授权

US07084726B2 Thin film shape memory alloy actuated microrelay 失效
公开(公告)号：US07084726B2
公开(公告)日：2006-08-01
申请号：US10661035
申请日：2003-09-15
申请人： Vikas Gupta , Valery Martynov
发明人： Vikas Gupta , Valery Martynov
IPC分类号： H01H51/22
CPC分类号： H01H1/0036 , H01H61/0107 , H01H2001/0047 , H01H2061/006
摘要： A microrelay device formed on a silicon substrate wafer for use in opening and closing a current path in a circuit. A pair of electrically conducting latching beams are attached at their proximal ends to terminals on the substrate. Proximal ends of the beams have complementary shapes which releasably fit together to latch the beams and close the circuit. A pair of shape memory alloy actuators are selectively operated to change shapes which bend one of the beams in a direction which latches the distal ends, or bend the other beam to release the distal ends and open the circuit. The microrelay is bistable in its two positions, and power to the actuators is applied only for switching it open or closed.

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