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    • 61. 发明申请
    • SOLID-STATE IMAGING APPARATUS, METHOD OF MANUFACTURING SAME, AND CAMERA
    • 固态成像装置,制造方法和相机
    • US20120212637A1
    • 2012-08-23
    • US13360166
    • 2012-01-27
    • Koji TsudukiTakanori SuzukiHisatane KomoriSatoru Hamasaki
    • Koji TsudukiTakanori SuzukiHisatane KomoriSatoru Hamasaki
    • H04N5/228H01L31/18H01L31/02
    • H01L27/14618H01L27/14683H01L2224/94
    • A solid-state imaging apparatus, comprising: a semiconductor chip having a principal face including a pixel region; a protruding portion disposed on the principal face to surround the pixel region; a cover member disposed over the pixel region; and an adhesive material surrounding the pixel region and bonding the cover member and the protruding portion, is provided. The protruding portion has top and first side faces facing the space, a first edge line being formed by this two faces. The adhesive material bonds the top face of the protruding portion and the cover member. The adhesive material has a first face facing the interior space, and the first face extends from the first edge line toward the cover member. Perimeters of the interior space, in planes parallel to the principal face become shorter in a direction from the top face of the protruding portion toward the cover member.
    • 一种固态成像装置,包括:具有包括像素区域的主面的半导体芯片; 设置在所述主面上以围绕所述像素区域的突出部分; 设置在所述像素区域上的盖构件; 并且设置围绕像素区域并且接合盖构件和突出部分的粘合材料。 突出部分具有面向空间的顶部和第一侧面,由该两个面形成的第一边缘线。 粘合剂材料将突出部分的顶面和盖部件结合。 粘合剂材料具有面向内部空间的第一面,第一面从第一边缘线朝向盖构件延伸。 在与主体面平行的平面内的内部空间的周长在从突出部的顶面向盖部的顶面的方向变短。
    • 66. 发明申请
    • REFRIGERATION SYSTEM
    • 制冷系统
    • US20100218549A1
    • 2010-09-02
    • US12680417
    • 2008-09-16
    • Takanori SuzukiMasatoshi Tomita
    • Takanori SuzukiMasatoshi Tomita
    • F25B1/00F25B41/00
    • F25B31/006F24F1/022F25B2600/021Y02B30/741
    • A refrigeration system (10) includes: a refrigerant circuit (11) performing a vapor compression refrigeration cycle by including a compressor (30), a utilization side heat exchanger (24) configured to allow refrigerant to perform heat exchange with air, and a heat-source side heat exchanger (25) configured to allow refrigerant to perform heat exchange with water; and a casing (14) housing the utilization side heat exchanger (24). The casing (14) contains a power supply (31) including a power semiconductor device and configured to supply electric power to the compressor (30), and also contains a cooler (19) configured to cool the power supply (31) by supplying air to the power supply (31).
    • 一种制冷系统(10),其特征在于,包括:制冷剂回路(11),其通过包括压缩机(30),利用侧热交换器(24)构成为允许制冷剂与空气进行热交换而进行蒸气压缩制冷循环, 源侧热交换器(25),其构造成允许制冷剂与水进行热交换; 和容纳利用侧热交换器(24)的壳体(14)。 壳体(14)包括电源(31),其包括功率半导体器件,并且被配置为向压缩机(30)供电,并且还包括冷却器(19),其被配置为通过供应空气来冷却电源 到电源(31)。