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61. 发明申请

US20090097523A1 SEMICONDUCTOR LASER APPARATUS AND METHOD OF MANUFACTURING THE SAME 失效
标题翻译：半导体激光装置及其制造方法
公开(公告)号：US20090097523A1
公开(公告)日：2009-04-16
申请号：US12333764
申请日：2008-12-12
申请人： Yasuyuki Bessho , Masayuki Hata , Daijiro Inoue
发明人： Yasuyuki Bessho , Masayuki Hata , Daijiro Inoue
IPC分类号： H01S5/00
CPC分类号： H01S5/4025 , H01S5/4087
摘要： Second and third p-side pad electrodes are formed on an insulating film of a blue-violet semiconductor laser device on both sides of a first p-side pad electrode. The second p-side pad electrode and the third p-side pad electrode are formed separately from each other. Solder films are formed on the upper surfaces of the second and third p-side pad electrodes respectively. A fourth p-side pad electrode of a red semiconductor laser device is bonded onto the second p-side pad electrode with the corresponding solder film sandwiched therebetween. A fifth p-side pad electrode of an infrared semiconductor laser device is bonded onto the third p-side pad electrode with the corresponding solder film sandwiched therebetween. The second and third p-side pad electrodes are formed separately from each other, so that the fourth and fifth p-side pad electrodes are electrically isolated from each other.
摘要翻译：第二和第三p侧焊盘电极形成在第一p侧焊盘电极两侧的蓝紫色半导体激光器件的绝缘膜上。第二p侧焊盘电极和第三p侧焊盘电极彼此分开地形成。焊接膜分别形成在第二和第三p侧焊盘电极的上表面上。红色半导体激光器件的第四p侧焊盘电极被粘合到第二p侧焊盘电极上，其中夹有相应的焊料膜。红外半导体激光器件的第五p侧焊盘电极被粘合到第三p侧焊盘电极上，其中夹有相应的焊料膜。第二和第三p侧焊盘电极彼此分开地形成，使得第四和第五p侧焊盘电极彼此电隔离。

62. 发明申请

US20070274360A1 Semiconductor laser element and semiconductor laser device 审中-公开
标题翻译：半导体激光元件和半导体激光器件
公开(公告)号：US20070274360A1
公开(公告)日：2007-11-29
申请号：US11710922
申请日：2007-02-27
申请人： Daijiro Inoue , Yasuyuki Bessho , Masayuki Hata
发明人： Daijiro Inoue , Yasuyuki Bessho , Masayuki Hata
IPC分类号： H01S5/00
CPC分类号： H01S5/2231 , H01S5/2223
摘要： A semiconductor laser element includes a semiconductor layer, an insulating layer and an electrode. The semiconductor layer is formed on a substrate, and includes a raised portion extending along a predetermined direction and flat portions provided on outer sides in a width direction of the raised portion. The insulating layer is formed on upper surfaces of the flat portions and side surfaces of the raised portion. The electrode includes a first portion provided along the predetermined direction on the raised portion and a second portion including a plurality of protruding portions protruding outward from the first portion in the width direction of the raised portion. A gap through which the insulating layer is exposed is provided between each adjacent two of the plurality of protruding portions.
摘要翻译：半导体激光元件包括半导体层，绝缘层和电极。半导体层形成在基板上，并且包括沿着预定方向延伸的凸起部分和设置在凸起部分的宽度方向上的外侧的平坦部分。绝缘层形成在凸起部分的平坦部分和侧表面的上表面上。电极包括沿着预定方向设置在凸起部分上的第一部分和第二部分，其包括从凸起部分的宽度方向上的第一部分向外突出的多个突出部分。在相邻的两个突出部分之间设置有绝缘层暴露的间隙。

63. 发明申请

US20100111131A1 SEMICONDUCTOR LASER APPARATUS 失效
标题翻译：半导体激光设备
公开(公告)号：US20100111131A1
公开(公告)日：2010-05-06
申请号：US12685580
申请日：2010-01-11
申请人： Daijiro Inoue , Masayuki Hata , Yasuyuki Bessho
发明人： Daijiro Inoue , Masayuki Hata , Yasuyuki Bessho
IPC分类号： H01S5/40
CPC分类号： G11B7/1275 , B82Y20/00 , G11B2007/0006 , H01L2224/48091 , H01S5/02212 , H01S5/0224 , H01S5/02272 , H01S5/02276 , H01S5/02476 , H01S5/0425 , H01S5/0427 , H01S5/06226 , H01S5/2213 , H01S5/2214 , H01S5/2222 , H01S5/2231 , H01S5/34326 , H01S5/34333 , H01S5/3436 , H01S5/4043 , H01S5/4087 , H01S2301/173 , H01L2924/00014
摘要： A sub-substrate, a blue-violet semiconductor laser device, an insulating layer, and a red semiconductor laser device are stacked in order on a support member through a plurality of fusion layers. The insulating layer is stacked on an n-side pad electrode of the blue-violet semiconductor laser device, and a conductive layer is formed on the insulating layer. The red semiconductor laser device is stacked on the conductive layer through a fusion layer. The conductive layer is electrically connected to a p-side pad electrode of the red semiconductor laser device. The n-side pad electrode of the blue-violet semiconductor laser device and the n-side pad electrode of the red semiconductor laser device are electrically connected to each other.
摘要翻译：通过多个熔融层将辅助基板，蓝紫色半导体激光器件，绝缘层和红色半导体激光器件按顺序堆叠在支撑构件上。绝缘层堆叠在蓝紫色半导体激光器件的n侧焊盘电极上，并且在绝缘层上形成导电层。红色半导体激光器件通过熔融层堆叠在导电层上。导电层与红色半导体激光器件的p侧焊盘电极电连接。蓝紫色半导体激光器件的n侧焊盘电极和红色半导体激光器件的n侧焊盘电极彼此电连接。

64. 发明申请

US20100067559A1 LASER DIODE DEVICE, OPTICAL APPARATUS AND DISPLAY APPARATUS 审中-公开
标题翻译：激光二极管装置，光学装置和显示装置
公开(公告)号：US20100067559A1
公开(公告)日：2010-03-18
申请号：US12557138
申请日：2009-09-10
申请人： Daijiro INOUE , Yasuyuki Bessho , Masayuki Hata
发明人： Daijiro INOUE , Yasuyuki Bessho , Masayuki Hata
IPC分类号： H01S5/00
CPC分类号： H01S5/042 , H01L2224/32145 , H01L2224/48091 , H01L2224/73265 , H01S5/02212 , H01S5/02276 , H01S5/0428 , H01S5/4031 , H01S5/4093 , H04N9/3129 , H01L2924/00014
摘要： A laser diode device includes a first laser diode element, a second laser diode element and a third laser diode element having a longer lasing wavelength than the first and second 6 laser diode elements. The first, second and third laser diode elements are arranged in a package, and the third laser diode element is not electrically connected to the first and second laser diode elements.
摘要翻译：激光二极管器件包括第一激光二极管元件，第二激光二极管元件和具有比第一和第六激光二极管元件更长的激光波长的第三激光二极管元件。第一，第二和第三激光二极管元件布置在封装中，并且第三激光二极管元件不电连接到第一和第二激光二极管元件。

65. 发明授权

US07551659B2 Semiconductor laser apparatus 失效
标题翻译：半导体激光装置
公开(公告)号：US07551659B2
公开(公告)日：2009-06-23
申请号：US11081726
申请日：2005-03-17
申请人： Yasuyuki Bessho , Masayuki Hata , Daijiro Inoue
发明人： Yasuyuki Bessho , Masayuki Hata , Daijiro Inoue
IPC分类号： H01S5/00
CPC分类号： H01S5/4043 , H01L2224/48091 , H01L2224/73265 , H01S5/02212 , H01S5/02272 , H01S5/02276 , H01S5/4087 , H01L2924/00014
摘要： A p-type pad electrode in a red semiconductor laser device and a first terminal are connected through a wire. A p-type pad electrode in an infrared semiconductor laser device and a second terminal are connected through a wire. A p-electrode in a blue-violet semiconductor laser device and a third terminal are connected through a wire. An n-electrode in the blue-violet semiconductor laser device is electrically conducting to amount. An n-electrode in the red semiconductor laser device and the mount are connected through a wire, while an n-electrode in the infrared semiconductor laser device and the mount is connected through a wire. The mount has a fourth terminal inside.
摘要翻译：红色半导体激光器件中的p型焊盘电极和第一端子通过导线连接。红外半导体激光器件中的p型焊盘电极和第二端子通过导线连接。蓝紫色半导体激光器件中的p电极和第三端子通过导线连接。蓝紫色半导体激光器件中的n电极是导电量的。红外半导体激光器件中的n电极和安装件通过导线连接，而红外半导体激光器件中的n电极和安装座通过导线连接。安装座内有第四个终端。

66. 发明授权

US08193016B2 Semiconductor laser device and method of manufacturing the same 有权
标题翻译：半导体激光器件及其制造方法
公开(公告)号：US08193016B2
公开(公告)日：2012-06-05
申请号：US12985632
申请日：2011-01-06
申请人： Ryoji Hiroyama , Daijiro Inoue , Yasuyuki Bessho , Masayuki Hata
发明人： Ryoji Hiroyama , Daijiro Inoue , Yasuyuki Bessho , Masayuki Hata
IPC分类号： H01L21/00
CPC分类号： H01S5/34333 , B82Y20/00 , H01S5/0201 , H01S5/0202 , H01S5/0203 , H01S5/0425 , H01S5/16 , H01S5/22 , H01S5/2201
摘要： A semiconductor laser device includes a substrate and a semiconductor layer formed on a surface of the substrate and having a waveguide extending in a first direction parallel to the surface, wherein the waveguide is formed on a region approaching a first side from a center of the semiconductor laser device in a second direction parallel to the surface and intersecting with the first direction, a first region separated from the waveguide on a side opposite to the first side of the waveguide and extending parallel to the first direction and a first recess portion separated from the waveguide on an extension of a facet of the waveguide, intersecting with the first region and extending in the second direction are formed on an upper surface of the semiconductor laser device, and a thickness of the semiconductor layer on the first region is smaller than a thickness of the semiconductor layer on a region other than the first region.
摘要翻译：半导体激光器件包括衬底和形成在衬底的表面上的半导体层，并且具有沿平行于表面的第一方向延伸的波导，其中波导形成在从半导体的中心接近第一侧的区域激光装置在与第一方向平行的第二方向上与第一方向相交的第一区域，与波导的与波导的第一侧相反的一侧并且平行于第一方向延伸的第一凹部，在半导体激光器件的上表面上形成有与第一区域交叉且沿第二方向延伸的波导的小平面的延伸的波导，并且第一区域上的半导体层的厚度小于厚度的第一区域以外的区域。

67. 发明申请

US20110104839A1 SEMICONDUCTOR LASER DEVICE AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：半导体激光器件及其制造方法
公开(公告)号：US20110104839A1
公开(公告)日：2011-05-05
申请号：US12985632
申请日：2011-01-06
申请人： Ryoji Hiroyama , Daijiro Inoue , Yasuyuki Bessho , Masayuki Hata
发明人： Ryoji Hiroyama , Daijiro Inoue , Yasuyuki Bessho , Masayuki Hata
IPC分类号： H01L33/00
CPC分类号： H01S5/34333 , B82Y20/00 , H01S5/0201 , H01S5/0202 , H01S5/0203 , H01S5/0425 , H01S5/16 , H01S5/22 , H01S5/2201
摘要： A semiconductor laser device includes a substrate and a semiconductor layer formed on a surface of the substrate and having a waveguide extending in a first direction parallel to the surface, wherein the waveguide is formed on a region approaching a first side from a center of the semiconductor laser device in a second direction parallel to the surface and intersecting with the first direction, a first region separated from the waveguide on a side opposite to the first side of the waveguide and extending parallel to the first direction and a first recess portion separated from the waveguide on an extension of a facet of the waveguide, intersecting with the first region and extending in the second direction are formed on an upper surface of the semiconductor laser device, and a thickness of the semiconductor layer on the first region is smaller than a thickness of the semiconductor layer on a region other than the first region.
摘要翻译：半导体激光器件包括衬底和形成在衬底的表面上的半导体层，并且具有沿平行于表面的第一方向延伸的波导，其中波导形成在从半导体的中心接近第一侧的区域激光装置在与第一方向平行的第二方向上与第一方向相交的第一区域，与波导的与波导的第一侧相反的一侧并且平行于第一方向延伸的第一凹部，在半导体激光器件的上表面上形成有与第一区域交叉且沿第二方向延伸的波导的小平面的延伸的波导，并且第一区域上的半导体层的厚度小于厚度的第一区域以外的区域。

68. 发明授权

US07881356B2 Semiconductor laser apparatus and method of manufacturing the same 失效
标题翻译：半导体激光装置及其制造方法
公开(公告)号：US07881356B2
公开(公告)日：2011-02-01
申请号：US12333764
申请日：2008-12-12
申请人： Yasuyuki Bessho , Masayuki Hata , Daijiro Inoue
发明人： Yasuyuki Bessho , Masayuki Hata , Daijiro Inoue
IPC分类号： H01S5/00
CPC分类号： H01S5/4025 , H01S5/4087
摘要： Second and third p-side pad electrodes are formed on an insulating film of a blue-violet semiconductor laser device on both sides of a first p-side pad electrode. The second p-side pad electrode and the third p-side pad electrode are formed separately from each other. Solder films are formed on the upper surfaces of the second and third p-side pad electrodes respectively. A fourth p-side pad electrode of a red semiconductor laser device is bonded onto the second p-side pad electrode with the corresponding solder film sandwiched therebetween. A fifth p-side pad electrode of an infrared semiconductor laser device is bonded onto the third p-side pad electrode with the corresponding solder film sandwiched therebetween. The second and third p-side pad electrodes are formed separately from each other, so that the fourth and fifth p-side pad electrodes are electrically isolated from each other.
摘要翻译：第二和第三p侧焊盘电极形成在第一p侧焊盘电极两侧的蓝紫色半导体激光器件的绝缘膜上。第二p侧焊盘电极和第三p侧焊盘电极彼此分开地形成。焊接膜分别形成在第二和第三p侧焊盘电极的上表面上。红色半导体激光器件的第四p侧焊盘电极被粘合到第二p侧焊盘电极上，其中夹有相应的焊料膜。红外半导体激光器件的第五p侧焊盘电极被粘合到第三p侧焊盘电极上，其中夹有相应的焊料膜。第二和第三p侧焊盘电极彼此分开地形成，使得第四和第五p侧焊盘电极彼此电隔离。

69. 发明申请

US20060054906A1 Semiconductor laser apparatus 失效
标题翻译：半导体激光装置
公开(公告)号：US20060054906A1
公开(公告)日：2006-03-16
申请号：US11215129
申请日：2005-08-31
申请人： Daijiro Inoue , Masayuki Hata , Yasuyuki Bessho
发明人： Daijiro Inoue , Masayuki Hata , Yasuyuki Bessho
IPC分类号： H01L33/00
CPC分类号： G11B7/1275 , B82Y20/00 , G11B2007/0006 , H01L2224/48091 , H01S5/02212 , H01S5/0224 , H01S5/02272 , H01S5/02276 , H01S5/02476 , H01S5/0425 , H01S5/0427 , H01S5/06226 , H01S5/2213 , H01S5/2214 , H01S5/2222 , H01S5/2231 , H01S5/34326 , H01S5/34333 , H01S5/3436 , H01S5/4043 , H01S5/4087 , H01S2301/173 , H01L2924/00014
摘要： A sub-substrate, a blue-violet semiconductor laser device, an insulating layer, and a red semiconductor laser device are stacked in order on a support member through a plurality of fusion layers. The insulating layer is stacked on an n-side pad electrode of the blue-violet semiconductor laser device, and a conductive layer is formed on the insulating layer. The red semiconductor laser device is stacked on the conductive layer through a fusion layer. The conductive layer is electrically connected to a p-side pad electrode of the red semiconductor laser device. The n-side pad electrode of the blue-violet semiconductor laser device and the n-side pad electrode of the red semiconductor laser device are electrically connected to each other.
摘要翻译：通过多个熔融层将辅助基板，蓝紫色半导体激光器件，绝缘层和红色半导体激光器件按顺序堆叠在支撑构件上。绝缘层堆叠在蓝紫色半导体激光器件的n侧焊盘电极上，并且在绝缘层上形成导电层。红色半导体激光器件通过熔融层堆叠在导电层上。导电层与红色半导体激光器件的p侧焊盘电极电连接。蓝紫色半导体激光器件的n侧焊盘电极和红色半导体激光器件的n侧焊盘电极彼此电连接。

70. 发明申请

US20050242361A1 Semiconductor laser apparatus and method of manufacturing the same 失效
标题翻译：半导体激光装置及其制造方法
公开(公告)号：US20050242361A1
公开(公告)日：2005-11-03
申请号：US11093024
申请日：2005-03-30
申请人： Yasuyuki Bessho , Masayuki Hata , Daijiro Inoue
发明人： Yasuyuki Bessho , Masayuki Hata , Daijiro Inoue
IPC分类号： H01L21/00 , H01S5/026 , H01S5/22 , H01S5/40 , H01L33/00
CPC分类号： H01S5/4025 , H01S5/4087
摘要： Second and third p-side pad electrodes are formed on an insulating film of a blue-violet semiconductor laser device on both sides of a first p-side pad electrode. The second p-side pad electrode and the third p-side pad electrode are formed separately from each other. Solder films are formed on the upper surfaces of the second and third p-side pad electrodes respectively. A fourth p-side pad electrode of a red semiconductor laser device is bonded onto the second p-side pad electrode with the corresponding solder film sandwiched therebetween. A fifth p-side pad electrode of an infrared semiconductor laser device is bonded onto the third p-side pad electrode with the corresponding solder film sandwiched therebetween. The second and third p-side pad electrodes are formed separately from each other, so that the fourth and fifth p-side pad electrodes are electrically isolated from each other.
摘要翻译：第二和第三p侧焊盘电极形成在第一p侧焊盘电极两侧的蓝紫色半导体激光器件的绝缘膜上。第二p侧焊盘电极和第三p侧焊盘电极彼此分开地形成。焊接膜分别形成在第二和第三p侧焊盘电极的上表面上。红色半导体激光器件的第四p侧焊盘电极被粘合到第二p侧焊盘电极上，其中夹有相应的焊料膜。红外半导体激光器件的第五p侧焊盘电极被粘合到第三p侧焊盘电极上，其中夹有相应的焊料膜。第二和第三p侧焊盘电极彼此分开地形成，使得第四和第五p侧焊盘电极彼此电隔离。

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