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    • 62. 发明授权
    • Semiconductor device, production method thereof, and electronic device
    • 半导体装置及其制造方法以及电子装置
    • US08174053B2
    • 2012-05-08
    • US12438394
    • 2007-06-04
    • Hidehito Kitakado
    • Hidehito Kitakado
    • H01L29/10
    • H01L29/78627H01L27/1255H01L29/78603H01L29/78621
    • The present invention provides a semiconductor device which includes a thin film transistor as a resistance element, wherein a variation in resistance of the thin film transistor is suppressed without increasing an area of the resistance element and the resistance element can be produced through simplified production steps. The semiconductor device of the present invention is a semiconductor device including a first thin film transistor and a second thin film transistor on a substrate, the first thin film transistor being used as a resistance element, the second thin film transistor including a semiconductor layer having a low concentration drain region and a high concentration drain region, the low concentration drain region and the high concentration drain region being different in impurity concentration, wherein an impurity concentration of a channel region of a semiconductor layer in the first thin film transistor is the same as an impurity concentration of the low concentration drain region of the semiconductor layer in the second thin film transistor.
    • 本发明提供一种半导体器件,其包括作为电阻元件的薄膜晶体管,其中抑制薄膜晶体管的电阻变化而不增加电阻元件的面积,并且可以通过简化的制造步骤来制造电阻元件。 本发明的半导体器件是在衬底上包括第一薄膜晶体管和第二薄膜晶体管的半导体器件,第一薄膜晶体管用作电阻元件,第二薄膜晶体管包括具有 低浓度漏极区域和高浓度漏极区域,低浓度漏极区域和高浓度漏极区域的杂质浓度不同,其中第一薄膜晶体管中的半导体层的沟道区域的杂质浓度与 第二薄膜晶体管中的半导体层的低浓度漏极区的杂质浓度。
    • 64. 发明授权
    • Semiconductor device and manufacturing method thereof
    • 半导体装置及其制造方法
    • US07202149B2
    • 2007-04-10
    • US11010389
    • 2004-12-14
    • Saishi FujikawaEtsuko AsanoTatsuya AraoTakashi YokoshimaTakuya MatsuoHidehito Kitakado
    • Saishi FujikawaEtsuko AsanoTatsuya AraoTakashi YokoshimaTakuya MatsuoHidehito Kitakado
    • H01L21/4763H01L21/3205
    • H01L29/78621H01L27/1237H01L29/42384H01L29/49H01L29/66757
    • A semiconductor device of which manufacturing steps can be simplified by doping impurities at a time, and a manufacturing method thereof. The manufacturing method of the semiconductor device comprises the steps of: forming first and second semiconductor layers over a substrate, forming a first insulating film over the first and second semiconductor layers, forming first and second conductive films thereover, forming a first gate electrode having a stacked layer of the first and second conductive films, in which a portion of the first conductive film is exposed from the second conductive film, over the first semiconductor layer with the first insulating film interposed therebetween, forming a second insulating film over the first insulating film, forming third and fourth conductive films thereover, and forming a second gate electrode having a stacked layer of the third and fourth conductive films, in which a portion of the third conductive film is exposed from the fourth conductive film, over the second semiconductor layer with the first and second insulating films interposed therebetween.
    • 通过一次掺杂杂质可以简化制造步骤的半导体器件及其制造方法。 半导体器件的制造方法包括以下步骤:在衬底上形成第一和第二半导体层,在第一和第二半导体层上形成第一绝缘膜,在其上形成第一和第二导电膜,形成具有 将第一导电膜的一部分从第二导电膜露出的第一导电膜和第二导电膜的第一绝缘膜在第一绝缘膜之上形成第二绝缘膜, 在其上形成第三和第四导电膜,并且形成第二栅电极,其具有第三导电膜和第四导电膜的堆叠层,其中第三导电膜的一部分从第四导电膜暴露在第二半导体层上, 其间插入第一绝缘膜和第二绝缘膜。
    • 65. 发明申请
    • Semiconductor device and method for manufacturing the same
    • 半导体装置及其制造方法
    • US20070034874A1
    • 2007-02-15
    • US11584524
    • 2006-10-23
    • Tatsuya AraoTakeshi NodaTakuya MatsuoHidehito KitakadoMasanori Kyoho
    • Tatsuya AraoTakeshi NodaTakuya MatsuoHidehito KitakadoMasanori Kyoho
    • H01L29/04H01L21/84
    • H01L27/124H01L27/1214H01L27/1259H01L29/6675H01L29/78621H01L29/78648
    • A semiconductor device that can be manufactured with a reduced cost by decreasing the number of masks is disclosed, and a method for manufacturing the semiconductor device is disclosed. The method for manufacturing the semiconductor device comprises the steps of: forming a semiconductor layer 3 having a source and a drain regions 10, 11, and LDD regions 16, 17; a gate insulating film 5; and a gate electrode 6; forming a first and a second interlayer insulating films 24, 25 over the gate electrode 6 and the gate insulating film 5; forming contact holes 25a, 25c to these interlayer insulating films so as to be located over each of the source region and the drain region; and an opening portion 25b to these interlayer insulating films so as to be located over the gate electrode and the LDD region; forming a second gate electrode 26b by a conductive film in the opening portion so as to cover the gate electrode and the LDD region; and a pixel electrode 26a over the second interlayer insulating film; removing the gate insulating film in the contact hole; and forming wirings 27, 28 connected to each the source region and the drain region.
    • 公开了可以通过减少掩模数而降低成本的半导体器件,并且公开了一种用于制造半导体器件的方法。 制造半导体器件的方法包括以下步骤:形成具有源极和漏极区域10,11以及LDD区域16,17的半导体层3; 栅极绝缘膜5; 和栅电极6; 在栅极电极6和栅极绝缘膜5上形成第一和第二层间绝缘膜24,25; 向这些层间绝缘膜形成接触孔25a,25c,以便位于源极区域和漏极区域之上; 和这些层间绝缘膜的开口部分25b,以便位于栅电极和LDD区之上; 通过开口部中的导电膜形成第二栅电极26b,以覆盖栅电极和LDD区; 以及在第二层间绝缘膜上的像素电极26a; 去除接触孔中的栅极绝缘膜; 以及形成连接到每个源极区域和漏极区域的布线27,28。
    • 69. 发明授权
    • Semiconductor device and manufacturing method thereof
    • 半导体装置及其制造方法
    • US07714367B2
    • 2010-05-11
    • US11694467
    • 2007-03-30
    • Saishi FujikawaEtsuko AsanoTatsuya AraoTakashi YokoshimaTakuya MatsuoHidehito Kitakado
    • Saishi FujikawaEtsuko AsanoTatsuya AraoTakashi YokoshimaTakuya MatsuoHidehito Kitakado
    • H01L29/76H01L29/94H01L31/00
    • H01L29/78621H01L27/1237H01L29/42384H01L29/49H01L29/66757
    • A semiconductor device of which manufacturing steps can be simplified by doping impurities at a time, and a manufacturing method thereof. The manufacturing method of the semiconductor device comprises the steps of: forming first and second semiconductor layers over a substrate, forming a first insulating film over the first and second semiconductor layers, forming first and second conductive films thereover, forming a first gate electrode having a stacked layer of the first and second conductive films, in which a portion of the first conductive film is exposed from the second conductive film, over the first semiconductor layer with the first insulating film interposed therebetween, forming a second insulating film over the first insulating film, forming third and fourth conductive films thereover, and forming a second gate electrode having a stacked layer of the third and fourth conductive films, in which a portion of the third conductive film is exposed from the fourth conductive film, over the second semiconductor layer with the first and second insulating films interposed therebetween.
    • 通过一次掺杂杂质可以简化制造步骤的半导体器件及其制造方法。 半导体器件的制造方法包括以下步骤:在衬底上形成第一和第二半导体层,在第一和第二半导体层上形成第一绝缘膜,在其上形成第一和第二导电膜,形成具有 将第一导电膜的一部分从第二导电膜露出的第一导电膜和第二导电膜的第一绝缘膜在第一绝缘膜之上形成第二绝缘膜, 在其上形成第三和第四导电膜,并且形成第二栅电极,其具有第三导电膜和第四导电膜的堆叠层,其中第三导电膜的一部分从第四导电膜暴露在第二半导体层上, 其间插入第一绝缘膜和第二绝缘膜。