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61. 发明授权

US06630745B1 Semiconductor encapsulating epoxy resin composition and semiconductor device 有权
标题翻译：半导体封装环氧树脂组合物和半导体器件
公开(公告)号：US06630745B1
公开(公告)日：2003-10-07
申请号：US09558384
申请日：2000-04-26
申请人： Shoichi Osada , Eiichi Asano , Shigeki Ino , Takayuki Aoki , Kazutoshi Tomiyoshi , Toshio Shiobara
发明人： Shoichi Osada , Eiichi Asano , Shigeki Ino , Takayuki Aoki , Kazutoshi Tomiyoshi , Toshio Shiobara
IPC分类号： H01L2329
CPC分类号： H01L23/293 , C08L63/00 , H01L2924/0002 , Y10T428/12528 , Y10T428/31511 , C08L83/00 , H01L2924/00
摘要： A semiconductor encapsulating epoxy resin composition is provided comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a molybdenum compound, (D-i) an organopolysiloxane, (D-ii) an organopolysiloxane cured product, or (D-iii) a block copolymer obtained by reacting an epoxy resin or alkenyl group-bearing epoxy resin with an organohydrogenpolysiloxane, and (E) an inorganic filler. The composition has improved moldability and solder crack resistance while exhibiting high flame retardance despite the absence of halogenated epoxy resins and antimony oxide.
摘要翻译：提供半导体封装环氧树脂组合物，其包含（A）环氧树脂，（B）酚醛树脂固化剂，（C）钼化合物，（Di）有机聚硅氧烷，（D-ii）有机聚硅氧烷固化产物或（ D-iii）通过环氧树脂或含烯基的环氧树脂与有机氢聚硅氧烷反应得到的嵌段共聚物和（E）无机填料。尽管没有卤化环氧树脂和氧化锑，该组合物具有改进的成型性和耐焊料裂纹性，同时显示出高阻燃性。

62. 发明授权

US06627328B2 Light-transmissive epoxy resin composition and semiconductor device 有权
标题翻译：透光环氧树脂组合物和半导体器件
公开(公告)号：US06627328B2
公开(公告)日：2003-09-30
申请号：US09950737
申请日：2001-09-13
申请人： Tatsuya Kanamaru , Tsuyoshi Honda , Eiichi Asano , Toshio Shiobara
发明人： Tatsuya Kanamaru , Tsuyoshi Honda , Eiichi Asano , Toshio Shiobara
IPC分类号： H01L2912
CPC分类号： C08L63/00 , Y10T428/12528 , Y10T428/31511
摘要： An epoxy resin composition comprising (A) an epoxy resin, (B) a curing accelerator, and (C) an inorganic filler is light transmissive when it satisfies formulae (1) and (2): [{2(nA2+nC2)−(nA+nC)2}/2]½
摘要翻译：包含（A）环氧树脂，（B）固化促进剂和（C）无机填料的环氧树脂组合物当满足式（1）和（2）时是透光的：其中nA是在T1° 固化的未填充组合物的c为n C为无机填料的T1℃的折射率，fA为固化的未填充组合物的折射率的温度系数，f C为折射率的温度系数无机填料。固化的组合物在宽温度范围内具有改善的耐热性，耐湿性和低应力以及高透明度。该组合物适用于光学半导体器件的密封。

63. 发明授权

US06534193B2 Liquid epoxy resin composition and semiconductor device 有权
公开(公告)号：US06534193B2
公开(公告)日：2003-03-18
申请号：US09912400
申请日：2001-07-26
申请人： Kazuaki Sumita , Toshio Shiobara
发明人： Kazuaki Sumita , Toshio Shiobara
IPC分类号： H01L2912
CPC分类号： H01L24/31 , C08L63/00 , H01L21/563 , H01L23/293 , H01L2224/16225 , H01L2224/73203 , H01L2224/83951 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01025 , H01L2924/01027 , H01L2924/01033 , H01L2924/01051 , H01L2924/01082 , H01L2924/01087 , H01L2924/10253 , H01L2924/12042 , H01L2924/12044 , H01L2924/181 , Y10T428/12528 , C08L2666/04 , H01L2924/3512 , H01L2924/00 , H01L2224/0401
摘要： A liquid epoxy resin composition includes (A) a liquid epoxy resin, (B) an optional curing agent, (C) a curing accelerator, (D) an inorganic filler, and (E) an indene-styrene or indene-chroman-styrene copolymer having a Mn of 200-2,000 in an amount of 0.1-20 parts by weight per 100 parts by weight of components (A) and (B) combined. The indene polymer (E) is previously melt mixed with a part or all of the liquid epoxy resin (A) prior to compounding with the remaining components. A semiconductor device sealed with the cured product of the liquid epoxy resin composition remains reliable.

64. 发明授权

US06342309B1 Epoxy resin composition and semiconductor device 有权
标题翻译：环氧树脂组合物和半导体器件
公开(公告)号：US06342309B1
公开(公告)日：2002-01-29
申请号：US09640874
申请日：2000-08-18
申请人： Toshio Shiobara , Shigeki Ino , Yasuo Kimura , Takayuki Aoki , Kazuhiro Arai , Hidenori Mizushima
发明人： Toshio Shiobara , Shigeki Ino , Yasuo Kimura , Takayuki Aoki , Kazuhiro Arai , Hidenori Mizushima
IPC分类号： H01L2912
CPC分类号： C08G59/188 , H01L23/293 , H01L2924/0002 , Y10T428/12528 , Y10T428/31511 , H01L2924/00
摘要： An epoxy resin composition contains (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) catalyzed microcapsules containing an imidazole compound or organic phosphorus compound and having a mean particle size of 0.5-50 &mgr;m, the quantity of the catalyst leached out from the microcapsules in o-cresol at 30° C. for 15 minutes being at least 70% by weight of the entire catalyst quantity. The composition is suited for semiconductor package encapsulation since it has satisfactory catalyst latency, storage stability and cure.
摘要翻译：环氧树脂组合物含有（A）环氧树脂，（B）固化剂，（C）无机填料和（D）含有咪唑化合物或有机磷化合物的催化微胶囊，其平均粒径为0.5〜在30℃下从邻甲酚中的微胶囊中浸出15分钟的催化剂的量为整个催化剂量的至少70重量％。该组合物适用于半导体封装封装，因为其具有令人满意的催化剂潜伏期，储存稳定性和固化性。

65. 发明授权

US06323263B1 Semiconductor sealing liquid epoxy resin compositions 有权
标题翻译：半导体密封液环氧树脂组合物
公开(公告)号：US06323263B1
公开(公告)日：2001-11-27
申请号：US09708682
申请日：2000-11-09
申请人： Haruyoshi Kuwabawa , Kazuaki Sumita , Toshio Shiobara
发明人： Haruyoshi Kuwabawa , Kazuaki Sumita , Toshio Shiobara
IPC分类号： C08K336
CPC分类号： C08G59/4215 , C08K3/36 , C08K2201/014 , Y10T428/12528 , C08L63/00
摘要： In a semiconductor-sealing liquid epoxy resin composition comprising (A) a liquid epoxy resin, (B) a curing agent, and (C) an inorganic filler, the inorganic filler has such a controlled particle size distribution that the composition provides improved interstitial infiltration and has a low modulus of elasticity in the cured state.
摘要翻译：在包含（A）液体环氧树脂，（B）固化剂和（C）无机填料）的半导体密封液体环氧树脂组合物中，无机填料具有这样的受控粒度分布，使组合物提供改善的间隙渗透并且在固化状态下具有低的弹性模量。

66. 发明授权

US06310120B1 Flip-chip type semiconductor device sealing material 有权
标题翻译：倒装型半导体器件密封材料
公开(公告)号：US06310120B1
公开(公告)日：2001-10-30
申请号：US09499038
申请日：2000-02-07
申请人： Toshio Shiobara , Kazuaki Sumita
发明人： Toshio Shiobara , Kazuaki Sumita
IPC分类号： C08K322
CPC分类号： H01L24/31 , C08G59/4215 , H01L2224/16225 , H01L2224/2919 , H01L2224/29298 , H01L2224/83951 , H01L2924/00011 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01033 , H01L2924/01037 , H01L2924/0104 , H01L2924/01058 , H01L2924/01075 , H01L2924/01082 , H01L2924/0665 , H01L2924/10253 , H01L2924/00 , H01L2924/3512 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： A sealing material comprising (A) a liquid epoxy resin, (B) a curing agent, (C) spherical silica, (D) a soft x-ray non-transmissive spherical inorganic filler, and (E) a curing accelerator is suited as an underfill material for flip-chip type semiconductor devices. The sealing material has improved thin-film infiltration and storage stability. The filled state or seal defects can be readily inspected using soft x-rays.
摘要翻译：一种密封材料，其包含（A）液体环氧树脂，（B）固化剂，（C）球形二氧化硅，（D）软x射线非透射性球形无机填料和（E）固化促进剂适合作为用于倒装芯片型半导体器件的底部填充材料。密封材料具有改善的薄膜渗透和储存稳定性。使用软X射线可以方便地检查填充状态或密封缺陷。

67. 发明授权

US06235865B1 Phosphonium borate compound, making method, curing catalyst, and epoxy resin composition 有权
标题翻译：硼酸鏻化合物，制法，固化催化剂和环氧树脂组合物
公开(公告)号：US06235865B1
公开(公告)日：2001-05-22
申请号：US09345390
申请日：1999-06-30
申请人： Hisashi Shimizu , Minoru Takei , Toshio Shiobara
发明人： Hisashi Shimizu , Minoru Takei , Toshio Shiobara
IPC分类号： B01J3122
CPC分类号： C08K5/55 , B01J31/0268 , B01J31/146 , C07F9/54 , C08G59/688 , C08L63/00
摘要： Phosphonium borate compounds of formula (1) are novel. R1, R2, R3 and R4 each are a monovalent organic group having an aromatic or heterocyclic ring or a monovalent aliphatic group, at least one of R1, R2, R3 and R4 which are bonded to phosphorus atom and at least one of R1, R2, R3 and R4 which are bonded to boron atom are each an organic group derived by releasing a proton from a proton donor selected from among an aromatic carboxylic acid having at least one carboxyl group, an aromatic carboxylic acid having at least one acid anhydride group and at least one carboxyl group, a phenol compound having at least one phenolic hydroxyl group, an aromatic compound having at least one carboxyl group and at least one phenolic hydroxyl group, and an aliphatic carboxylic acid having at least one carboxyl group. The phosphonium borate compounds are useful as a latent curing catalyst for epoxy resin compositions. The epoxy resin compositions are improved in shelf stability, fast-curing ability and flow and cure into products having moisture resistance and improved electrical properties.
摘要翻译：式（1）的硼酸鏻化合物是新颖的.R1，R2，R3和R4各自是具有芳族或杂环或一价脂族基的一价有机基团，R 1，R 2，R 3和R 4中的至少一个是键合的磷原子和与硼原子键合的R 1，R 2，R 3和R 4中的至少一个各自是通过从质子供体中释放质子衍生的有机基团，所述质子供体选自具有至少一个羧基的芳族羧酸，具有至少一个酸酐基和至少一个羧基的芳族羧酸，具有至少一个酚羟基的酚化合物，至少一个羧基和至少一个酚羟基的芳族化合物和脂族羧酸具有至少一个羧基。硼酸鏻化合物可用作环氧树脂组合物的潜在固化催化剂。环氧树脂组合物在贮存稳定性，快速固化能力和流动性方面得到改进，并且固化成具有防潮性和改善的电性能的产品。

68. 发明授权

US06168872A Semiconductor encapsulating epoxy resin composition and semiconductor device 有权
标题翻译：半导体封装环氧树脂组合物和半导体器件
公开(公告)号：US06168872A
公开(公告)日：2001-01-02
申请号：US09220439
申请日：1998-12-24
申请人： Kenji Ohashi , Tatsuya Ishizaki , Masayuki Umeno , Eiichi Asano , Shoichi Osada , Kazutoshi Tomiyoshi , Toshio Shiobara
发明人： Kenji Ohashi , Tatsuya Ishizaki , Masayuki Umeno , Eiichi Asano , Shoichi Osada , Kazutoshi Tomiyoshi , Toshio Shiobara
IPC分类号： H01L2912
CPC分类号： H01L23/293 , H01L2924/0002 , H01L2924/12044 , Y10T428/12528 , H01L2924/00
摘要： An epoxy resin composition comprising an epoxy resin, a curing agent, an inorganic filler, and a curing accelerator is suited for semiconductor encapsulation. A specific organic phosphorus compound is used as the curing accelerator. The composition is smoothly flowing, stable during storage, effectively curable and mold releasable and can be molded and cured into products free from wire flow and voids.
摘要翻译：包含环氧树脂，固化剂，无机填料和固化促进剂的环氧树脂组合物适用于半导体封装。使用特定的有机磷化合物作为固化促进剂。组合物流畅平稳，储存期间稳定，有效固化和脱模，并且可以模制和固化成不含导线流动和空隙的产品。

69. 发明授权

US6084037A Epoxy resin composition and semiconductor device 失效
标题翻译：环氧树脂组合物和半导体器件
公开(公告)号：US6084037A
公开(公告)日：2000-07-04
申请号：US993403
申请日：1997-12-18
申请人： Hisashi Shimizu , Minoru Takei , Masachika Yoshino , Toshio Shiobara
发明人： Hisashi Shimizu , Minoru Takei , Masachika Yoshino , Toshio Shiobara
IPC分类号： C08K3/22 , C08F283/10 , C08G59/40 , C08G59/68 , C08K3/36 , C08K5/548 , C08L63/00 , H01L23/29 , H01L23/31
CPC分类号： C08K5/548 , C08F283/10 , C08G59/686 , C08G59/687 , C08L63/00
摘要： In an epoxy resin composition comprising an epoxy resin, a curing agent, and an inorganic filler, there are blended a salt of trimellitic anhydride with 1,8-diazabicyclo(5.4.0)undecene-7 as a curing accelerator and a mercapto-containing silane coupling agent. The composition is shelf stable and smoothly flowing and cures into a product having improved adhesion, moisture resistance and electrical properties. The composition is suitable for the encapsulation of semiconductor devices.
摘要翻译：在包含环氧树脂，固化剂和无机填料的环氧树脂组合物中，将偏苯三酸酐的盐与作为固化促进剂的1,8-二氮杂双环（5.4.0）十一碳烯-7和含巯基的硅烷偶联剂。该组合物是稳定的并顺利流动并固化成具有改善的粘合性，耐湿性和电性能的产品。该组合物适用于半导体器件的封装。

70. 发明授权

US5940688A Epoxy resin composition and semiconductor device encapsulated therewith 失效
标题翻译：环氧树脂组合物和封装的半导体器件
公开(公告)号：US5940688A
公开(公告)日：1999-08-17
申请号：US919242
申请日：1997-08-28
申请人： Noriaki Higuchi , Takaaki Fukumoto , Toshio Shiobara , Eiichi Asano , Kazutoshi Tomiyoshi
发明人： Noriaki Higuchi , Takaaki Fukumoto , Toshio Shiobara , Eiichi Asano , Kazutoshi Tomiyoshi
IPC分类号： C08K3/36 , H01B3/40 , H01L23/29 , H01L21/302 , C08L63/00 , H01L21/463
CPC分类号： H01L23/293 , C08K3/36 , H01B3/40 , H01L2924/0002
摘要： In an epoxy resin composition comprising an epoxy resin, a curing agent, and 80-90 wt % of a particulate inorganic filler, fine particles having a particle size of less than 3 .mu.m account for 10-40 wt % of the inorganic filler, and the inorganic filler has a specific surface area of less than 2.5 m.sup.2 /g as measured by a nitrogen adsorption BET method. The inorganic filler satisfies that when a blend of a bisphenol F type liquid epoxy resin having a viscosity of 30-45 poises at 25.degree. C. as measured by Gardner-Holdt method with 75 wt % of the inorganic filler is measured for viscosity at 25.degree. C. by means of an E type viscometer, the viscosity at a shear rate of 0.6 s.sub.-1 is less than 50,000 poises and the ratio of the viscosity at a shear rate of 0.6 s.sup.-1 to the viscosity at a share rate of 10 s.sup.-1 is less than 2.5/1. The epoxy resin composition has a low melt viscosity enough to mold on semiconductor devices without die pad and wire deformation.
摘要翻译：在包含环氧树脂，固化剂和80-90重量％的颗粒状无机填料的环氧树脂组合物中，粒径小于3微米的微粒占无机填料的10-40重量％并且通过氮吸附BET法测量的无机填料的比表面积小于2.5m 2 / g。无机填料满足当通过Gardner-Holdt法测定的25℃粘度为30-45泊的双酚F型液体环氧树脂与75重量％的无机填料的共混物在25℃下测定粘度通过E型粘度计，剪切速率为0.6s-1时的粘度小于50,000泊，剪切速率为0.6s-1时的粘度与粘度分别为 10 s-1小于2.5 / 1。环氧树脂组合物具有低的熔融粘度，足以在半导体器件上模制而没有模具垫和线变形。

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