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61. 发明申请

US20070108066A1 VOLTAGE MODE CURRENT CONTROL 审中-公开
标题翻译：电压模式电流控制
公开(公告)号：US20070108066A1
公开(公告)日：2007-05-17
申请号：US11553438
申请日：2006-10-26
申请人： Stan Tsai , Lakshmanan Karuppiah
发明人： Stan Tsai , Lakshmanan Karuppiah
IPC分类号： B23H3/00
CPC分类号： B23H5/08 , B24B37/042 , B24B49/10
摘要： Methods and apparatus for voltage-mode current control. A computer implemented method includes: (a) commencing a ECMP polishing step on a conductive film of a substrate; (b) setting a current output voltage of a voltage source, the current output voltage being set in accordance with a recipe for the ECMP polishing step; (c) measuring current flow through the conductive film; (d) calculating, based on the measured current flow, a current polishing rate; (e) determining whether an adjustment to the current output voltage is needed, the determining being based on a target polishing rate; and (f) when an adjustment is determined to be needed, calculating and effecting the adjustment to the current output voltage.
摘要翻译：电压模式电流控制的方法和装置。计算机实施方法包括：（a）在基板的导电膜上开始ECMP抛光步骤; （b）设定电压源的电流输出电压，根据ECMP研磨工序的配方设定电流输出电压; （c）测量通过导电膜的电流; （d）基于所测量的电流计算当前的抛光速率; （e）确定是否需要对当前输出电压的调整，所述确定基于目标抛光速率; 和（f）当确定需要调整时，计算并对当前输出电压进行调整。

62. 发明申请

US20070095677A1 ELECTROCHEMICAL METHOD FOR ECMP POLISHING PAD CONDITIONING 失效
标题翻译：用于ECMP抛光垫调节的电化学方法
公开(公告)号：US20070095677A1
公开(公告)日：2007-05-03
申请号：US11554928
申请日：2006-10-31
申请人： You Wang , Stan Tsai , Lakshmanan Karuppiah , Jie Diao , Renhe Jia , Alpay Yilmaz
发明人： You Wang , Stan Tsai , Lakshmanan Karuppiah , Jie Diao , Renhe Jia , Alpay Yilmaz
IPC分类号： B23H3/00
CPC分类号： B23H5/08 , B24B37/042 , B24B37/046 , B24B53/017 , C25F1/00 , H01L21/32125
摘要： A method for conditioning an Ecmp pad is provided. In one embodiment, a method for electrochemically processing a substrate includes the steps of providing an electrical bias voltage between the top surface of the pad assembly and an electrode, and electrochemically removing contaminants from the top surface of the pad.
摘要翻译：提供了一种调节Ecmp垫的方法。在一个实施例中，用于电化学处理衬底的方法包括以下步骤：在衬垫组件的顶表面和电极之间提供电偏置电压，以及电化学去除衬垫顶表面的污染物。

63. 发明授权

US07210981B2 Smart conditioner rinse station 失效
标题翻译：智能护发素漂洗站
公开(公告)号：US07210981B2
公开(公告)日：2007-05-01
申请号：US11273766
申请日：2005-11-14
申请人： Alpay Yilmaz , Lakshmanan Karuppiah
发明人： Alpay Yilmaz , Lakshmanan Karuppiah
IPC分类号： B24B53/00
CPC分类号： B24B53/017 , H01L21/67051 , H01L21/67092 , H01L21/67253
摘要： A method and apparatus for monitoring polishing pad conditioning mechanisms is provided. In one embodiment, a semiconductor substrate polishing system includes a rinse station, a polishing surface, a conditioning element, and a conditioning mechanism. The conditioning mechanism selectively positions the conditioning element over the polishing surface and over the rinse station. At least one sensor is provided and is configured to detect a first position and a second position of the conditioning element when disposed over the rinse station.
摘要翻译：提供了一种用于监测抛光垫调节机构的方法和装置。在一个实施例中，半导体衬底抛光系统包括冲洗台，抛光表面，调节元件和调节机构。调理机构选择性地将调理元件定位在抛光表面上和漂洗台上。提供至少一个传感器，并且被配置为当设置在漂洗站上时检测调理元件的第一位置和第二位置。

64. 发明申请

US20060073768A1 Conductive pad design modification for better wafer-pad contact 失效
公开(公告)号：US20060073768A1
公开(公告)日：2006-04-06
申请号：US11243488
申请日：2005-10-04
申请人： Rashid Mavliev , Lakshmanan Karuppiah
发明人： Rashid Mavliev , Lakshmanan Karuppiah
IPC分类号： B24B49/00
CPC分类号： B24B37/22 , B23H5/08 , B24B37/046 , B24B37/245 , H01L21/32125
摘要： An apparatus and method for manufacturing and refurbishing a conductive polishing pad assembly for performing an electrochemical process on a substrate is disclosed. The conductive polishing pad assembly is formed using a contact surface as a foundation that is coated with a metallic coating to create a conductive contact surface. In one embodiment, the metallic coating is a high purity tin/zinc alloy that is sprayed on the contact surface. The contact surface contains abrasive particles while the metallic coating provides at least conductive qualities to the contact surface.

65. 发明授权

US09073169B2 Feedback control of polishing using optical detection of clearance 有权
标题翻译：使用光学检测间隙的抛光反馈控制
公开(公告)号：US09073169B2
公开(公告)日：2015-07-07
申请号：US13223159
申请日：2011-08-31
申请人： Kun Xu , Ingemar Carlsson , Feng Q. Liu , David Maxwell Gage , You Wang , Dominic J. Benvegnu , Boguslaw A. Swedek , Yuchun Wang , Pierre Fontarensky , Wen-Chiang Tu , Lakshmanan Karuppiah
发明人： Kun Xu , Ingemar Carlsson , Feng Q. Liu , David Maxwell Gage , You Wang , Dominic J. Benvegnu , Boguslaw A. Swedek , Yuchun Wang , Pierre Fontarensky , Wen-Chiang Tu , Lakshmanan Karuppiah
IPC分类号： G06F19/00 , H01L21/00 , B24B49/00 , B24B37/005 , B24B37/04 , B24B37/10 , B24B37/30 , B24B49/12 , G01B11/06
CPC分类号： B24B37/005 , B24B37/042 , B24B37/107 , B24B37/30 , B24B49/12 , G01B11/0683
摘要： A method of controlling polishing includes polishing a first substrate having an overlying layer on an underlying layer or layer structure. During polishing, the substrate is monitored with an in-situ monitoring system to generate a sequence of measurements. The measurements are sorted into groups, each group associated with a different zone of a plurality of zones on the substrate. For each zone, a time at which the overlying layer is cleared is determined based on the measurements from the associated group. At least one second adjusted polishing pressure for at least zone is calculated based on a pressure applied in the at least one zone during polishing the substrate, the time for the at least one zone, and the time for another zone. A second substrate is polished using the at least one adjusted polishing pressure.
摘要翻译：控制抛光的方法包括在下层或层结构上抛光具有上层的第一衬底。在抛光期间，用原位监测系统监测基底以产生测量序列。测量被分组成组，每个组与衬底上的多个区域的不同区域相关联。对于每个区域，基于来自关联组的测量来确定覆盖层被清除的时间。基于在抛光衬底期间在至少一个区域中施加的压力，至少一个区域的时间和另一个区域的时间来计算至少一个至少一个区域的调整后的第二抛光压力。使用至少一个调整的抛光压力来抛光第二基底。

66. 发明授权

US08554351B2 Spectrographic monitoring of a substrate during processing using index values 有权
标题翻译：使用指标值对处理过程中的基板进行光谱监测
公开(公告)号：US08554351B2
公开(公告)日：2013-10-08
申请号：US13599766
申请日：2012-08-30
申请人： Jeffrey Drue David , Dominic J. Benvegnu , Harry Q. Lee , Boguslaw A. Swedek , Lakshmanan Karuppiah
发明人： Jeffrey Drue David , Dominic J. Benvegnu , Harry Q. Lee , Boguslaw A. Swedek , Lakshmanan Karuppiah
IPC分类号： G06F19/00 , B24B49/00 , G01B11/28
CPC分类号： G05B15/02 , B24B37/013 , B24B49/12
摘要： Methods, systems, and apparatus for spectrographic monitoring of a substrate during chemical mechanical polishing are described. In one aspect, a computer-implemented method includes storing a library having a plurality of reference spectra, each reference spectrum of the plurality of reference spectra having a stored associated index value, measuring a sequence of spectra in-situ during polishing to obtain measured spectra, for each measured spectrum of the sequence of spectra, finding a best matching reference spectrum to generate a sequence of best matching reference spectra, determining the associated index value for each best matching spectrum from the sequence of best matching reference spectra to generate a sequence of index values, fitting a linear function to the sequence of index values, and halting the polishing either when the linear function matches or exceeds a target index or when the associated index value from the determining step matches or exceeds the target index.
摘要翻译：描述了在化学机械抛光期间用于光谱监测基底的方法，系统和装置。一方面，计算机实现的方法包括存储具有多个参考光谱的库，多个参考光谱的每个参考光谱具有存储的相关联的索引值，在抛光期间原位测量光谱序列以获得测量的光谱，对于光谱序列的每个测量光谱，找到最佳匹配参考光谱以产生最佳匹配参考光谱序列，从最佳匹配参考光谱序列确定每个最佳匹配光谱的相关索引值，以产生序列索引值，将线性函数拟合到索引值序列，以及当线性函数匹配或超过目标索引时或者当来自确定步骤的相关索引值匹配或超过目标索引时停止抛光。

67. 发明申请

US20130189843A1 SLURRY FOR PLANARIZING PHOTORESIST 审中-公开
标题翻译：用于平面化光刻胶的浆料
公开(公告)号：US20130189843A1
公开(公告)日：2013-07-25
申请号：US13747825
申请日：2013-01-23
申请人： You Wang , Wen-Chiang Tu , Lakshmanan Karuppiah , Yufei Chen
发明人： You Wang , Wen-Chiang Tu , Lakshmanan Karuppiah , Yufei Chen
IPC分类号： H01L21/306
CPC分类号： H01L21/30625 , C09G1/02 , H01L21/31058
摘要： A slurry for planarization of a photoresist includes abrasive particles, an oxidizer, a surface activation chemical, and a solvent.
摘要翻译：用于平版化光致抗蚀剂的浆料包括磨料颗粒，氧化剂，表面活化化学品和溶剂。

68. 发明申请

US20130186850A1 SLURRY FOR COBALT APPLICATIONS 审中-公开
标题翻译：浆料应用
公开(公告)号：US20130186850A1
公开(公告)日：2013-07-25
申请号：US13357535
申请日：2012-01-24
申请人： You Wang , Chenhao Ge , Yufei Chen , Yuchun Wang , Wen-Chiang Tu , Lakshmanan Karuppiah
发明人： You Wang , Chenhao Ge , Yufei Chen , Yuchun Wang , Wen-Chiang Tu , Lakshmanan Karuppiah
IPC分类号： C09K13/00 , C09K13/02 , H05K3/26
CPC分类号： C09K3/1463 , C09G1/02 , H01L21/3212 , H01L23/53238 , H01L23/53257 , H01L2924/0002 , H05K3/045 , H05K3/107 , H01L2924/00
摘要： A slurry for chemical mechanical of a cobalt layer or a conductive layer over a cobalt layer includes abrasive particles, an organic complexing compound for Cu or Co ion complexion, a Co corrosion inhibitor that is 0.01-1.0 wt % of the slurry, an oxidizer, and a solvent. The slurry has a pH of 7-12.
摘要翻译：用于钴层或钴层上的导电层的化学机械的浆料包括磨料颗粒，用于Cu或Co离子表面的有机络合化合物，作为浆料的0.01-1.0重量％的Co腐蚀抑制剂，氧化剂，和溶剂。浆液的pH为7-12。

69. 发明申请

US20120323355A1 SPECTROGRAPHIC MONITORING OF A SUBSTRATE DURING PROCESSING USING INDEX VALUES 有权
标题翻译：使用指数值处理过程中基板的光谱监测
公开(公告)号：US20120323355A1
公开(公告)日：2012-12-20
申请号：US13599766
申请日：2012-08-30
申请人： Jeffrey Drue David , Dominic J. Benvegnu , Harry Q. Lee , Boguslaw A. Swedek , Lakshmanan Karuppiah
发明人： Jeffrey Drue David , Dominic J. Benvegnu , Harry Q. Lee , Boguslaw A. Swedek , Lakshmanan Karuppiah
IPC分类号： G05B19/18
CPC分类号： G05B15/02 , B24B37/013 , B24B49/12
摘要： Methods, systems, and apparatus for spectrographic monitoring of a substrate during chemical mechanical polishing are described. In one aspect, a computer-implemented method includes storing a library having a plurality of reference spectra, each reference spectrum of the plurality of reference spectra having a stored associated index value, measuring a sequence of spectra in-situ during polishing to obtain measured spectra, for each measured spectrum of the sequence of spectra, finding a best matching reference spectrum to generate a sequence of best matching reference spectra, determining the associated index value for each best matching spectrum from the sequence of best matching reference spectra to generate a sequence of index values, fitting a linear function to the sequence of index values, and halting the polishing either when the linear function matches or exceeds a target index or when the associated index value from the determining step matches or exceeds the target index.
摘要翻译：描述了在化学机械抛光期间用于光谱监测基底的方法，系统和装置。一方面，计算机实现的方法包括存储具有多个参考光谱的库，多个参考光谱的每个参考光谱具有存储的相关联的索引值，在抛光期间原位测量光谱序列以获得测量的光谱，对于光谱序列的每个测量光谱，找到最佳匹配参考光谱以产生最佳匹配参考光谱序列，从最佳匹配参考光谱序列确定每个最佳匹配光谱的相关索引值，以产生序列索引值，将线性函数拟合到索引值序列，以及当线性函数匹配或超过目标索引时或者当来自确定步骤的相关索引值匹配或超过目标索引时停止抛光。

70. 发明授权

US08260446B2 Spectrographic monitoring of a substrate during processing using index values 有权
标题翻译：使用指标值对处理过程中的基板进行光谱监测
公开(公告)号：US08260446B2
公开(公告)日：2012-09-04
申请号：US12699014
申请日：2010-02-02
申请人： Jeffrey Drue David , Dominic Benvegnu , Harry Q. Lee , Boguslaw A. Swedek , Lakshmanan Karuppiah
发明人： Jeffrey Drue David , Dominic Benvegnu , Harry Q. Lee , Boguslaw A. Swedek , Lakshmanan Karuppiah
IPC分类号： G06F19/00 , B24B49/00 , G01B11/28
CPC分类号： G05B15/02 , B24B37/013 , B24B49/12
摘要： Methods, systems, and apparatus for spectrographic monitoring of a substrate during chemical mechanical polishing are described. In one aspect, a computer-implemented method includes storing a library having a plurality of reference spectra, each reference spectrum of the plurality of reference spectra having a stored associated index value, measuring a sequence of spectra in-situ during polishing to obtain measured spectra, for each measured spectrum of the sequence of spectra, finding a best matching reference spectrum to generate a sequence of best matching reference spectra, determining the associated index value for each best matching spectrum from the sequence of best matching reference spectra to generate a sequence of index values, fitting a linear function to the sequence of index values, and halting the polishing either when the linear function matches or exceeds a target index or when the associated index value from the determining step matches or exceeds the target index.
摘要翻译：描述了在化学机械抛光期间用于光谱监测基底的方法，系统和装置。一方面，计算机实现的方法包括存储具有多个参考光谱的库，多个参考光谱的每个参考光谱具有存储的相关联的索引值，在抛光期间原位测量光谱序列以获得测量的光谱，对于光谱序列的每个测量光谱，找到最佳匹配参考光谱以产生最佳匹配参考光谱序列，从最佳匹配参考光谱序列确定每个最佳匹配光谱的相关索引值，以产生序列索引值，将线性函数拟合到索引值序列，以及当线性函数匹配或超过目标索引时或者当来自确定步骤的相关索引值匹配或超过目标索引时停止抛光。

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