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61. 发明申请

US20070216012A1 METHOD FOR MOUNTING AN ELECTRONIC PART ON A SUBSTRATE USING A LIQUID CONTAINING METAL PARTICLES 审中-公开
标题翻译：使用含液体金属颗粒安装在基板上的电子部件的方法
公开(公告)号：US20070216012A1
公开(公告)日：2007-09-20
申请号：US11735627
申请日：2007-04-16
申请人： HIROSHI HOZOJI , Toshiaki Morita , Hiroshi Sasaki
发明人： HIROSHI HOZOJI , Toshiaki Morita , Hiroshi Sasaki
IPC分类号： H01L23/52 , H01L29/06
CPC分类号： H05K3/328 , H01L23/24 , H01L23/66 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/81 , H01L24/83 , H01L25/072 , H01L25/16 , H01L2223/6644 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05644 , H01L2224/11332 , H01L2224/11505 , H01L2224/13099 , H01L2224/13139 , H01L2224/13144 , H01L2224/16225 , H01L2224/27505 , H01L2224/29 , H01L2224/29101 , H01L2224/29111 , H01L2224/29144 , H01L2224/2919 , H01L2224/29344 , H01L2224/32225 , H01L2224/371 , H01L2224/3754 , H01L2224/40095 , H01L2224/40225 , H01L2224/45015 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/49111 , H01L2224/49175 , H01L2224/73265 , H01L2224/81191 , H01L2224/81192 , H01L2224/81205 , H01L2224/8121 , H01L2224/81815 , H01L2224/83191 , H01L2224/83192 , H01L2224/83801 , H01L2224/8384 , H01L2224/85205 , H01L2924/00011 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01061 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/09701 , H01L2924/10253 , H01L2924/10272 , H01L2924/12041 , H01L2924/12044 , H01L2924/1301 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15787 , H01L2924/15788 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/19107 , H01L2924/351 , H05K1/183 , H05K3/102 , H05K3/321 , H05K2201/0218 , H05K2201/0257 , H05K2201/10636 , H05K2201/10674 , H05K2203/1131 , Y02P70/611 , H01L2924/00 , H01L2924/01014 , H01L2924/00015 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2924/2076 , H01L2224/83205 , H01L2924/00012 , H01L2924/01028 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： An electronic part mounting method, a semiconductor module, and a semiconductor device, which can reduce a mounting area and a device thickness. In an electronic part mounting method for bonding an electrode formed on a substrate and an electrode formed on an electronic part to each other, the method comprises the step of bonding both the electrodes through a metal layer made up of aggregated particles of at least one kind of metal. Then, the metal particles have an average particle size of 1 to 50 nm. Preferably, the metal particles form a metal layer having a thickness of 5 to 100 μm.
摘要翻译：电子部件安装方法，半导体模块和半导体器件，其可以减小安装面积和器件厚度。在将形成在基板上的电极和形成在电子部件上的电极彼此接合的电子部件安装方法中，该方法包括通过由至少一种类型的聚集颗粒构成的金属层将两个电极接合的步骤的金属。然后，金属粒子的平均粒径为1〜50nm。优选地，金属颗粒形成厚度为5至100μm的金属层。

62. 发明授权

US07218988B2 Yarn feeding apparatus of weft knitting machine 有权
标题翻译：纬编机喂纱机
公开(公告)号：US07218988B2
公开(公告)日：2007-05-15
申请号：US10576024
申请日：2004-10-15
申请人： Toshiaki Morita , Hirokazu Nishitani , Masanori Inumaki
发明人： Toshiaki Morita , Hirokazu Nishitani , Masanori Inumaki
IPC分类号： D04B15/78
CPC分类号： D04B7/34 , D04B1/28 , D04B15/48
摘要： A carriage which completes one course of knitting to the knitting end of a fabric is stopped. Knitting in a next course is performed when the carriage reverses its moving direction and re-starts its movement. Since the knitting yarn is not knitted to the fabric until a carrier brought by the carriage reaches a position of a knitting needle holding the stitch of the fabric at the knitting end, the knitting yarn existing in a feeding path between a yarn feeding mechanism and the carrier is excessively increased and a slack is generated. Since a distance between a yarn feeding port formed at a carrier's frontal end and the knitting needle at the fabric-knitting end is also reduced, the knitting yarn is further increased excessively. The further-excessively-increased knitting yarn is taken in by a yarn feeding means by reversing a servomotor, and further pulled in by a rewinding arm.
摘要翻译：停止向织物的编织端完成一个针织过程的托架。当滑架反转其移动方向并重新启动其移动时，执行下一个课程的编织。由于针织纱线没有编织到织物上，直到由托架带到的托架到达编织端处的织物针迹的织针的位置时，存在于喂纱机构和喂纱机构之间的进给路径中的针织纱线载体过度增加并产生松弛。由于形成在载体前端的喂纱口与织物编织端的织针之间的距离也减小，所以针织纱进一步增大。进一步过度增加的针织纱线由送纱装置通过反转伺服电动机而被再卷绕臂进一步拉入。

63. 发明授权

US07059157B2 Stitch presser in a weft knitting machine 失效
标题翻译：针织机缝纫机
公开(公告)号：US07059157B2
公开(公告)日：2006-06-13
申请号：US10543558
申请日：2004-02-02
申请人： Toshiaki Morita , Toshinori Nakamori
发明人： Toshiaki Morita , Toshinori Nakamori
IPC分类号： D04B7/04
CPC分类号： D04B15/06 , D04B15/90
摘要： A stitch presser in a weft knitting machine installed on a carriage that slides in a reciprocating fashion on a needle bed and configured such that a presser bar fitted through a presser bar supporting arm joined to a rotation shaft of a motor is advanced into a mouth portion of the weft knitting machine with an electric power supplied to the motor driving the predetermined presser bar in conjunction with the directional switching of the reciprocating motion of the carriage, including a rotation energizing mechanism for rotating the rotating shaft of the motor to a side retracting the presser bar of the weft knitting machine when the electric power is not supplied to the motor for driving the presser bar advanced into the mouth portion.
摘要翻译：一种纬编针织机中的针脚加压器，其安装在滑架上，以往复方式在针床上滑动，并且构造成使得通过与马达的旋转轴接合的压杆支撑臂安装的压脚推进到口部与电动机供给的电力一起驱动预定的压杆，结合托架的往复运动的方向切换，包括用于使马达的旋转轴旋转到一侧的旋转通电机构当没有向用于驱动压杆的电动机供给电力而进入口部时，纬编机的压脚杆。

64. 发明授权

US07049214B2 Method of manufacturing a semiconductor device to provide improved adhesion between bonding pads and ball portions of electrical connectors 失效
标题翻译：制造半导体器件的方法，以提供接合焊盘和电连接器的球部之间的改进的粘合
公开(公告)号：US07049214B2
公开(公告)日：2006-05-23
申请号：US10807249
申请日：2004-03-24
申请人： Naoki Kawanabe , Tomoo Matsuzawa , Toshiaki Morita , Takafumi Nishita
发明人： Naoki Kawanabe , Tomoo Matsuzawa , Toshiaki Morita , Takafumi Nishita
IPC分类号： H01L21/44
CPC分类号： H01L24/85 , H01L21/565 , H01L23/3128 , H01L24/05 , H01L24/06 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/78 , H01L24/97 , H01L2224/02166 , H01L2224/0401 , H01L2224/04042 , H01L2224/05553 , H01L2224/05554 , H01L2224/05624 , H01L2224/05644 , H01L2224/32225 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45164 , H01L2224/4807 , H01L2224/48091 , H01L2224/48227 , H01L2224/48453 , H01L2224/48455 , H01L2224/48465 , H01L2224/4847 , H01L2224/48624 , H01L2224/48644 , H01L2224/48724 , H01L2224/49171 , H01L2224/49431 , H01L2224/49433 , H01L2224/73265 , H01L2224/78301 , H01L2224/78704 , H01L2224/85045 , H01L2224/85181 , H01L2224/85201 , H01L2224/85203 , H01L2224/85205 , H01L2224/92247 , H01L2224/97 , H01L2924/00011 , H01L2924/01202 , H01L2924/01204 , H01L2924/014 , H01L2924/05042 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/20752 , H01L2924/351 , H01L2924/01046 , H01L2224/85 , H01L2924/00014 , H01L2924/01013 , H01L2924/00 , H01L2924/00012 , H01L2224/48744 , H01L2924/00015 , H01L2924/0102 , H01L2924/013 , H01L2924/01004 , H01L2924/00013 , H01L2924/01006
摘要： A method is provided to improve the adhesion between bonding pads and ball portions of gold wires to improve the reliability of a semiconductor device. About 1 wt. % of Pd is contained in gold wires for connection between electrode pads formed on a wiring substrate and electrode pads (exposed areas of a top layer wiring formed mainly of Al) formed on a semiconductor chip. In bonded portions between the electrode and ball portions of the gold wires, an interdiffusion of Au and Al is suppressed to prevent the formation of Au4Al after PCT (Pressure Cooker Test). Thus, a desired bonding strength is obtained even when the pitch of the electrode pads is smaller than 65 μm and the diameter of the ball portion is smaller than 55 μm or the diameter of the wire portion of each gold wire is not larger than 25 μm.
摘要翻译：提供了一种提高接合焊盘和金线球部之间的粘附性以提高半导体器件的可靠性的方法。约1重量％用于在形成在布线基板上的电极焊盘和形成在半导体芯片上的电极焊盘（主要由Al形成的顶层布线的暴露区域）之间的连接的金线中包含Pd的％。在金线的电极和球部之间的接合部分中，抑制了Au和Al的相互扩散，以防止在PCT（压力锅试验）之后形成Au 4 Al。因此，即使当电极焊盘的间距小于65μm并且球部的直径小于55μm或每个金线的线部分的直径不大于25μm时，也获得期望的接合强度。

65. 发明授权

US06978642B2 Weft knitting machine with movable sinker device 失效
标题翻译：纬编机具有可移动沉降片装置
公开(公告)号：US06978642B2
公开(公告)日：2005-12-27
申请号：US10516258
申请日：2003-05-01
申请人： Toshiaki Morita , Toshinori Nakamori
发明人： Toshiaki Morita , Toshinori Nakamori
IPC分类号： D04B15/06 , D04B15/70
CPC分类号： D04B15/70 , D04B15/06 , D04B15/362 , D04B15/90
摘要： A weft knitting machine with a movable sinker device capable of preventing yarn from being worn caused by repeatedly striking the yarn with a sinker energized by a spring to push down knitting fabric, wherein a stroke to which a yarn locking part (2a) at the tip of a sinker plate (2) is moved to a tooth port (6) by the energization of the spring (4) is increased at a first stage shown in (a) and decreased at a second stage shown in (b), the stroke is limited in (b) by locking a holding locking part (12a) of a holding member (12) to the holding locking part (2d) of the sinker plate (2), and a stage is switched to a second stage at a knitting portion where the yarn locking part (2a) repeatedly strikes the yarn to prevent the yarn from being thinned and fluffed.
摘要翻译：一种具有可移动沉降片装置的纬编机，其能够防止由于通过弹簧激发的沉降片重复地打击纱线而导致的纱线被磨损，从而将编织物的纱线锁定部分（2a）在（a）所示的第一阶段，通过弹簧（4）的激励，沉降板（2）的顶端移动到齿口（6），并且在（b）所示的第二阶段中减小，在（b）中通过将保持构件（12）的保持锁定部分（12a）锁定到沉降片（2）的保持锁定部分（2d）上而限制行程，并且将台架切换到第二阶段在纱线锁定部分（2a）反复撞击纱线的编织部分处，以防止纱线变薄和起毛。

66. 发明申请

US20050258550A1 Circuit board and semiconductor device using the same 审中-公开
标题翻译：电路板和半导体器件使用相同
公开(公告)号：US20050258550A1
公开(公告)日：2005-11-24
申请号：US11066200
申请日：2005-02-25
申请人： Toshiaki Morita , Kazuhiro Suzuki , Hisayuki Imamura , Junichi Watanabe , Mitsuaki Chiba
发明人： Toshiaki Morita , Kazuhiro Suzuki , Hisayuki Imamura , Junichi Watanabe , Mitsuaki Chiba
IPC分类号： H01L23/12 , H01L21/48 , H01L23/14 , H01L23/373 , H01L23/52 , H05K1/02 , H05K1/03 , H05K1/05 , H05K3/24
CPC分类号： H05K1/0271 , H01L21/4871 , H01L23/3735 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L2224/49111 , H01L2224/49175 , H01L2224/73265 , H01L2924/00014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/12041 , H01L2924/1301 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/19107 , H05K1/0306 , H05K1/05 , H05K3/0061 , H05K3/244 , H05K2201/0209 , H05K2201/0355 , H05K2201/068 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： There is provided a thinner high frequency power module structure having reduced the mounting area. An insulated board is provided with a composite metal board in which the Cu2O powder particles are dispersed into a matrix metal (Cu) (amount of addition of Cu2O: 20 vol %; thermal expansion coefficient: 10.0 ppm/° C.; thermal conductivity: 280 W/m•K; thickness: 1 mm; size: 42.4×85 mm), a silicon nitride board (thermal expansion coefficient: 3.4 ppm/° C.; thermal conductivity: 90 W/m•K; thickness: 0.3 mm; size: 30×50 mm) deposited with Ag-system bonding metal layer to one principal surface of the composite metal board, and a wiring metal board formed of copper or copper alloy provided to the other principal surface of the ceramics insulated board. For example, the bonding metal layer is adjusted in the thickness to 50 μm, while the wiring metal board is also adjusted in the thickness to 0.4 mm. In the integrated board of the wiring and heat radiating boards, the Ni plating layer (thickness: 6 μm, not illustrated) is formed with the non-electrolyte wet plating process to the surface metal layer of the wiring metal board and composite metal board. This Ni plating layer is formed to the wiring metal boards in order to attain the solder bondability to mount the semiconductor base material with the brazing method and to enhance the wire bondability of the wiring metal board. Moreover, this Ni plating layer effectively prevents denaturation of the internal side by shutting off from the external atmosphere.
摘要翻译：提供了一种较薄的高频功率模块结构，减少了安装面积。绝缘板设置有复合金属板，其中Cu 2 O 3粉末颗粒分散在基体金属（Cu）中（Cu 2 O 2的添加量： 20vol％;热膨胀系数：10.0ppm /℃;导热率：280W / mK;厚度：1mm;尺寸：42.4×85mm），氮化硅板（热膨胀系数：3.4ppm /℃ ;将Ag系接合金属层沉积在复合金属板的一个主表面上的导热率：90W / mK;厚度：0.3mm;尺寸：30x50mm），以及由铜或铜合金制成的布线金属板，陶瓷绝缘板的另一主面。例如，将接合金属层的厚度调整为50μm，同时将布线金属板的厚度调整为0.4mm。在布线和散热板的集成电路板中，通过非电解质湿式电镀工艺将金属镀层（厚度：6μm，未示出）形成到布线金属板和复合金属板的表面金属层。为了获得通过钎焊方法安装半导体基材的焊料接合性，并且提高布线用金属板的引线接合性，将该Ni镀层形成于配线用金属板。此外，该Ni镀层通过从外部气氛切断而有效地防止内侧的变性。

67. 发明授权

US06879041B2 Semiconductor device with joint structure having lead-free solder layer over nickel layer 有权
标题翻译：具有接合结构的半导体器件，其具有在镍层上的无铅焊料层
公开(公告)号：US06879041B2
公开(公告)日：2005-04-12
申请号：US10396326
申请日：2003-03-26
申请人： Kenichi Yamamoto , Toshiaki Morita , Munehiro Yamada , Ryosuke Kimoto
发明人： Kenichi Yamamoto , Toshiaki Morita , Munehiro Yamada , Ryosuke Kimoto
IPC分类号： H01L23/12 , H01L21/60 , H01L23/485 , H01L23/498 , H05K3/24 , H05K3/34 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L24/10 , H01L23/49816 , H01L24/13 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/05001 , H01L2224/05008 , H01L2224/05022 , H01L2224/05024 , H01L2224/05027 , H01L2224/05568 , H01L2224/05569 , H01L2224/05572 , H01L2224/05573 , H01L2224/13 , H01L2224/13099 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/48095 , H01L2224/48227 , H01L2224/48465 , H01L2224/73204 , H01L2224/73265 , H01L2224/92247 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01055 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/013 , H01L2924/01322 , H01L2924/01327 , H01L2924/0133 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H05K3/244 , H05K3/3463 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2224/05541 , H01L2224/05005
摘要： The impact strength resistance of a solder joint portion of a semiconductor device is improved. The semiconductor device has a joint structure wherein a jointing layer which does not contain sulfur substantially is arranged between an underlying conductive layer and a lead-free solder layer and further between the jointing layer and the lead-free solder layer is formed an alloy layer comprising elements of these layers.
摘要翻译：半导体器件的焊接部的耐冲击强度提高。半导体器件具有接合结构，其中基本上不含硫的接合层布置在下面的导电层和无铅焊料层之间，并且在接合层和无铅焊料层之间形成合金层，其包括这些层的元素。

68. 发明授权

US06609396B2 Weft knitting machine with transferring mechanism and transferring method 失效
标题翻译：纬编机具有转印机构和转印方式
公开(公告)号：US06609396B2
公开(公告)日：2003-08-26
申请号：US10239020
申请日：2002-09-18
申请人： Toshiaki Morita , Takekazu Shibuta
发明人： Toshiaki Morita , Takekazu Shibuta
IPC分类号： D04B700
CPC分类号： D04B15/02 , D04B7/28 , D04B15/365 , D04B15/78
摘要： A flat knitting machine comprising a transfer jack bed (9) holding transfer jacks (7) in such a manner as to freely advance and retract, wherein when a loop is transferred from the transfer jack (7) to the needle (19), the loop retaining portion (53) of the transfer jack (7) put in its advanced position is moved down to its lowered position, first; then, a back side (39b) of a needle hook of the needle (19) is made to go into the loop (111) retained on the loop retaining portion (53) of the transfer jack (7); then the loop retaining portion (53) is raised up to its raised position; and thereafter, a front side (39a) of the needle hook of the needle is made to go into the loop, whereby the transfer of loop can be ensured with a reduced burden on the loop in the transfer of loop through the use of a common track for the needles of the front bed (13a) and for the needles of the back bed (13b).
摘要翻译：一种横机，包括以可自由前进和后退的方式保持传送千斤顶（7）的传送千斤顶床（9），其中当环从传送千斤顶（7）传送到针（19）时，首先将放置在其前进位置的输送千斤顶（7）的回路保持部分（53）向下移动到其降低位置; 然后，将针（19）的针钩的后侧（39b）进入保持在转接插座（7）的环保持部（53）上的环（111）中。那么回路保持部分53被升高到其升高位置; 然后使针的针钩的前侧（39a）进入环路，由此可以通过使用共同的方式减小环路传递中环路的负担，从而确保环路的传送轨道用于前床（13a）和后床（13b）的针的针。

69. 发明授权

US06579623B2 Composite material member for semiconductor device and insulated and non-insulated semiconductor devices using composite material member 失效
公开(公告)号：US06579623B2
公开(公告)日：2003-06-17
申请号：US10083158
申请日：2002-02-27
申请人： Yasutoshi Kurihara , Yasuo Kondo , Takumi Ueno , Toshiaki Morita , Kenji Koyama , Takashi Suzumura , Kazuhiko Nakagawa , Kunihiro Fukuda
发明人： Yasutoshi Kurihara , Yasuo Kondo , Takumi Ueno , Toshiaki Morita , Kenji Koyama , Takashi Suzumura , Kazuhiko Nakagawa , Kunihiro Fukuda
IPC分类号： H04L21302
CPC分类号： H01L23/142 , H01L23/3736 , H01L24/73 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48472 , H01L2224/49109 , H01L2224/49111 , H01L2224/49175 , H01L2224/73265 , H01L2924/01327 , H01L2924/09701 , H01L2924/10253 , H01L2924/1301 , H01L2924/13055 , H01L2924/13091 , H01L2924/14 , H01L2924/15322 , H01L2924/16195 , H01L2924/181 , H01L2924/19107 , H01L2924/3011 , H01L2924/30111 , H01L2924/3025 , H05K1/05 , Y10T428/12083 , Y10T428/12535 , Y10T428/12611 , Y10T428/12889 , Y10T428/12903 , Y10T428/1291 , Y10T428/25 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要： To provide a composite material member for semiconductor device, an insulated semiconductor device and non-insulated semiconductor device using the composite material member, which are effective for obtaining a semiconductor device that alleviates thermal stress or thermal strain occurring during production or operation, has no possibilities of deformation, degeneration and rupture of each member, and is highly reliably and inexpensive. The composite material member for semiconductor device is characterized by being a composite metal plate with particles composed of cuprous oxide dispersed in a copper matrix, in which a surface of the composite metal plate is covered with a metal layer, and a copper layer with thickness of 0.5 &mgr;m or larger exists in an interface formed by the composite metal plate and the metal layer.

70. 发明授权

US6094946A Needle bed cleaner for a flat knitting machine 失效
标题翻译：针织机针床清洁剂
公开(公告)号：US6094946A
公开(公告)日：2000-08-01
申请号：US241734
申请日：1999-02-02
申请人： Toshiaki Morita , Kenji Ikoma
发明人： Toshiaki Morita , Kenji Ikoma
IPC分类号： D04B35/32 , D04B37/00
CPC分类号： D04B35/32
摘要： A flat knitting machine has a blower that is connected to a nozzle via a plastic tube, a base duct and a joint. The base duct is mounted on a rear cover of the flat knitting machine parallel to a needle bed and is rectangular in section. A long slit covered by a belt is provided on top of the base duct. The joint has three rollers, two of which make the belt contact the slit. The third roller peels the belt from the slit to connect the nozzle and the base duct. When the nozzle is connected to the carriage and travels over the needle beds, the needle beds are cleaned.
摘要翻译：横编机具有通过塑料管，基管和接头连接到喷嘴的鼓风机。底座管平行于针床安装在平针织机的后盖上，并且具有矩形截面。在基部管道的顶部设有由带子覆盖的长缝。接头具有三个辊，其中两个使皮带接触狭缝。第三个辊从缝隙中剥离皮带，以连接喷嘴和基管。当喷嘴连接到滑架并在针床上行进时，针床被清洁。

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