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    • 61. 发明申请
    • APPARATUS AND METHODS FOR EDGE RING IMPLEMENTATION FOR SUBSTRATE PROCESSING
    • 用于基板加工的边缘实施的装置和方法
    • US20110070743A1
    • 2011-03-24
    • US12951886
    • 2010-11-22
    • Rajinder DhindsaAlexei Marakhtanov
    • Rajinder DhindsaAlexei Marakhtanov
    • H01L21/3065
    • H01L21/6732H01J37/32091H01J37/32623H01J37/32642Y10S156/915
    • A method for processing a substrate in a plasma processing chamber is provided. The substrate is disposed above a chuck and surrounded by a first edge ring. The first edge ring is electrically isolated from the chuck. The method includes providing a second edge ring. The second edge ring is disposed below an edge of the substrate. The method also includes providing a coupling ring. The coupling ring is configured to facilitate RF coupling from an ESC (electrostatic chuck) assembly to the first edge ring, thereby causing the first edge ring to have an edge ring potential during substrate processing and causing the RF coupling to be maximized at the first edge ring and minimized at the second edge ring during the substrate processing. The method also includes providing an insulator ring, wherein the second edge ring is disposed above the insulator ring.
    • 提供了一种在等离子体处理室中处理衬底的方法。 衬底设置在卡盘上方并被第一边缘环包围。 第一边缘环与卡盘电隔离。 该方法包括提供第二边缘环。 第二边缘环设置在基板的边缘下方。 该方法还包括提供耦合环。 联接环被配置为便于从ESC(静电卡盘)组件到第一边缘环的RF耦合,从而使得第一边缘环在衬底处理期间具有边缘环电位,并且使RF耦合在第一边缘处被最大化 在基板处理期间在第二边缘环处环形并最小化。 该方法还包括提供绝缘体环,其中第二边缘环设置在绝缘体环上方。